MD972C2 - Soluţie pentru cuprarea chimică a dielectricilor - Google Patents
Soluţie pentru cuprarea chimică a dielectricilorInfo
- Publication number
- MD972C2 MD972C2 MD97-0298A MD970298A MD972C2 MD 972 C2 MD972 C2 MD 972C2 MD 970298 A MD970298 A MD 970298A MD 972 C2 MD972 C2 MD 972C2
- Authority
- MD
- Moldova
- Prior art keywords
- solution
- copper plating
- dielectrics
- electroless copper
- copper
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 5
- 229910052802 copper Inorganic materials 0.000 title abstract 5
- 239000010949 copper Substances 0.000 title abstract 5
- 238000007747 plating Methods 0.000 title abstract 4
- 239000003989 dielectric material Substances 0.000 title 1
- YOEUNKPREOJHBW-UHFFFAOYSA-N 3-formylsalicylic acid Chemical compound OC(=O)C1=CC=CC(C=O)=C1O YOEUNKPREOJHBW-UHFFFAOYSA-N 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 229910000365 copper sulfate Inorganic materials 0.000 abstract 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 abstract 1
- 238000001465 metallisation Methods 0.000 abstract 1
- 229960002167 sodium tartrate Drugs 0.000 abstract 1
- 239000001433 sodium tartrate Substances 0.000 abstract 1
- 239000003381 stabilizer Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Landscapes
- Chemically Coating (AREA)
Abstract
Invenţia se referă la metalizarea chimică, în special la cuprarea suprafeţelor de dielectrici.Conform invenţiei cuprarea se efectuează utilizând soluţia care conţine, g/L:Includerea în soluţie a stabilizatorului menţionat permite de a mări viteza de cuprare la temperatura camerei până la 13...20 µm/h. Totodată soluţia este stabilă 6 luni, poate fi multiplu corectată, asigură obţinerea acoperirilor de cupru dense, omogene şi microcristaline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MD97-0298A MD972C2 (ro) | 1997-11-17 | 1997-11-17 | Soluţie pentru cuprarea chimică a dielectricilor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MD97-0298A MD972C2 (ro) | 1997-11-17 | 1997-11-17 | Soluţie pentru cuprarea chimică a dielectricilor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MD972C2 true MD972C2 (ro) | 1998-11-30 |
Family
ID=62142669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MD97-0298A MD972C2 (ro) | 1997-11-17 | 1997-11-17 | Soluţie pentru cuprarea chimică a dielectricilor |
Country Status (1)
| Country | Link |
|---|---|
| MD (1) | MD972C2 (ro) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU456050A1 (ru) * | 1972-11-29 | 1975-01-05 | Предприятие П/Я А-1120 | Раствор дл химического меднени диэлектриков |
| US4301196A (en) * | 1978-09-13 | 1981-11-17 | Kollmorgen Technologies Corp. | Electroless copper deposition process having faster plating rates |
-
1997
- 1997-11-17 MD MD97-0298A patent/MD972C2/ro unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU456050A1 (ru) * | 1972-11-29 | 1975-01-05 | Предприятие П/Я А-1120 | Раствор дл химического меднени диэлектриков |
| US4301196A (en) * | 1978-09-13 | 1981-11-17 | Kollmorgen Technologies Corp. | Electroless copper deposition process having faster plating rates |
Non-Patent Citations (1)
| Title |
|---|
| Øàëêàóñêàñ Ì. è Âàøêàëèñ À. Õèìè÷åñêàÿ ìåòàëëèçàöèÿ ïëàñòìàññ. Ë., Õèìèÿ, 1985 г., ñ. 91-93. * |
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