MD2913F1 - Process for application of nickel-stanniferous plating - Google Patents
Process for application of nickel-stanniferous plating Download PDFInfo
- Publication number
- MD2913F1 MD2913F1 MDA20040212A MD20040212A MD2913F1 MD 2913 F1 MD2913 F1 MD 2913F1 MD A20040212 A MDA20040212 A MD A20040212A MD 20040212 A MD20040212 A MD 20040212A MD 2913 F1 MD2913 F1 MD 2913F1
- Authority
- MD
- Moldova
- Prior art keywords
- electrolyte
- chloride
- platings
- plating
- thermal treatment
- Prior art date
Links
- 238000007747 plating Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 abstract 3
- 239000003792 electrolyte Substances 0.000 abstract 3
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 abstract 3
- 238000007669 thermal treatment Methods 0.000 abstract 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 1
- 229910002651 NO3 Inorganic materials 0.000 abstract 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 abstract 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 abstract 1
- NGPGDYLVALNKEG-UHFFFAOYSA-N azanium;azane;2,3,4-trihydroxy-4-oxobutanoate Chemical compound [NH4+].[NH4+].[O-]C(=O)C(O)C(O)C([O-])=O NGPGDYLVALNKEG-UHFFFAOYSA-N 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- YPTUAQWMBNZZRN-UHFFFAOYSA-N dimethylaminoboron Chemical compound [B]N(C)C YPTUAQWMBNZZRN-UHFFFAOYSA-N 0.000 abstract 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 abstract 1
- 235000011180 diphosphates Nutrition 0.000 abstract 1
- 238000004070 electrodeposition Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 abstract 1
- FYWSTUCDSVYLPV-UHFFFAOYSA-N nitrooxythallium Chemical compound [Tl+].[O-][N+]([O-])=O FYWSTUCDSVYLPV-UHFFFAOYSA-N 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 235000011150 stannous chloride Nutrition 0.000 abstract 1
- 229940095064 tartrate Drugs 0.000 abstract 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 abstract 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 abstract 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 abstract 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to the technology for electrochemical application of functional platings and may be used in the radioelectronic industry.Summary of the invention consists in that the process includes the electrochemical deposition of coating from electrolyte containing nickel chloride, tin chloride, potassium pyrophosphate and subsequent thermal treatment, the electrolyte additionally containing ammonium tartrate, dimethylaminoborane and thallium nitrate, in the following component ratio, g/l:nickel chloride NiCl2(2H2O 1�0,0...15,0tin chloride SnCl2(6H2O �10,0...12,0potassium pyrophosphate K4P2O7 120,0...140,0ammonium tartrate C2H4(OH)2 (COONH4)2 �5,0...15,0dimethylaminoborane (CH3)2 NBH2 �1,5...2,5thallium nitrate TlNO3 ��0,001...0,010,the deposition is carried out at pH=8,5...10,5, the temperature of 50...70C and the current cathodic density of 0,5...2,0 A/dm2, and the subsequent thermal treatment of the plating at 120...150C during 0,5...1 hour.The result of the invention consists in increasing the electrolyte stability, improving the appearance of the platings and providing a high degree of soldering of the radioelectronic equipment elements with quick solders.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MDA20040212A MD2913G2 (en) | 2004-09-08 | 2004-09-08 | Process for application of nickel-stanniferous plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MDA20040212A MD2913G2 (en) | 2004-09-08 | 2004-09-08 | Process for application of nickel-stanniferous plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MD2913F1 true MD2913F1 (en) | 2005-11-30 |
| MD2913G2 MD2913G2 (en) | 2006-06-30 |
Family
ID=35450578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MDA20040212A MD2913G2 (en) | 2004-09-08 | 2004-09-08 | Process for application of nickel-stanniferous plating |
Country Status (1)
| Country | Link |
|---|---|
| MD (1) | MD2913G2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MD4087C1 (en) * | 2010-02-10 | 2011-08-31 | Государственный Университет Молд0 | Process for chemical-catalytic deposition of metal coatings |
-
2004
- 2004-09-08 MD MDA20040212A patent/MD2913G2/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| MD2913G2 (en) | 2006-06-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG4A | Patent for invention issued | ||
| KA4A | Patent for invention lapsed due to non-payment of fees (with right of restoration) | ||
| MM4A | Patent for invention definitely lapsed due to non-payment of fees |