LV13605B - Method for soldering of adjoining pipes - Google Patents

Abstract

The way of soldering of the pipes relates to the area of the instrument - making industry and may be used in the production of such tubular heating appliances as the towel-dryers. This technology allows increasing the quality of the junctions: increase their durability and density as well as the stability of those parameters. This may be achieved by the means of the drilling /3/ in the adjoining pipe (2) in the place of the main pipe (1). The solder (4) is formed in the form of the ring, and on the edge of the opening the petals are cut and bent up to the inner diameter of the solder ring (4). Afterwards, the petals (5) are dressed with the solder and the adjoining pipe (2) on the solder while heating up the junction until the solder has melted.

Description

BACKGROUND OF THE INVENTION Description of the Invention

The invention relates to the field of soldering and can be used for the manufacture of tubular structures such as towel warmers.

A method of soldering tube clamps is known, according to which pointing dies are performed on the main pipe in order to orientate the clamping pipes (patent application RU 2001110903; SKI B23K1 / 00; 2003 /. However, this method is only suitable for telescopic connections when the smaller diameter pipe is oriented by the inside diameter of the largest pipe.

Also known is the method of soldering the overlapping tubes, according to which a liner / patent RU 2240909 is used for their mutual orientation; SKI B23K1 / 00; 2002 /. The disadvantage of this technique is that it can only be applied to pipes on the common axis.

Closest to the present invention, in terms of its technical nature and the result to be achieved, is a method of soldering the adjoining pipe, whereby a key is formed at the location of the adjoining pipe by a circular ball, then mounted on the adjoining pipe and a hole formed in the main tube and subsequently soldered / PCT Application Publication WO 2000504663: SKI F16L41 / 08 A1; 2005 /. The disadvantage of this method, selected as a prototype, is that a copper plate washer is used to fix the overlapping tube to said hole formed in the main tube, which degrades the solder quality as it absorbs some of the heat and solder needed for the main connection. The result is a porous, non-dense, and loose connection, all the more so because the process is confined and cannot be controlled.

The purpose of the proposed technical solution is to increase the quality of the solder. This is accomplished by comparing the soldering method described in the prototype, which is to create an annular hole at the location of the inclined tube in the main tube, then install the overlapping tube and fix it on the same axis with the hole in the main tube, but then soldering, in this invention, the ball is formed around an internal diameter of the soldering tube, the sheets are cut at the opposite sides of the hole in the main tube and folded to the inside diameter of the ball ring, then the ball is applied to the solder and soldered while the ball melts and fills the pipe joint.

The proposed technical solution is explained in the accompanying drawings, where:

Fig. 1 is a longitudinal distortion of a joint after assembly of parts prior to soldering;

FIG. 2 is a cross-sectional view of the joint before soldering;

FIG. Fig. 3 is a top view of the joint before soldering;

Fig. 4 is a cross-sectional view of the joint after soldering.

The soldering process according to the invention proceeds in the following order: Drill a hole (3) in the soldering tube (2) in the main pipe (1): the ball (4) is annular, the outer diameter of this ring being equal to the inner diameter of the soldering pipe (2) ; cutting the sheets (5) at opposite sides of the hole / bore / (3) and tilting them into an upright position, wherein the depth of cut is selected such that, after folding, the sheets (5) are at a distance from the inside diameter of the solder ring (4); then, on the folded leaves (5), a ring-shaped ball (4) and a solder tube (2) are applied thereto, whereby the leaves (5) lock the ball ring (4) and this ring in turn fixes the adjoining tube (2); after performing the above steps, a common heating of the whole structure is carried out, whereby all solder enters the pipe joint.

Experiments on the proposed technique fully confirmed its effectiveness and the achievement of its objective. During the trial, a copper tube with a diameter of 28 mm and a wall thickness of 1 mm was soldered to a copper tube with a diameter of 22 mm and a wall thickness of 1 mm. A hole with a diameter of 10 mm was drilled in the main pipe. A ball of 2 mm diameter was formed into a ball

In the form of a J-ring with an outer diameter of 22 mm, corresponding to the inner diameter of the solder pipe. The leaves were then cut to a depth of 3 mm with a special tool at the edges of the drilled hole and then folded upright. Afterwards, a bullet ring was placed on the folded leaves, and the soldering tube was then secured to it. As a result, a dense ball ring was fixed on the main tube. Finally, the soldering iron flame was used to heat the joint and solder. Compressed air was supplied at 6 atm to check the connection density and durability. During the trial, the soldering site was not destroyed, but the main material, which did not withstand pressure behind the pipe joint, was destroyed.

Thus, the proposed method offers the following advantages over the prototype:

- reduce the heating time of the material at the soldering station at the expense of material reduction,

- increase, at the same consumption of solder, the amount of solder used to form the joint itself,

- eliminates the possibility of soldering due to the lack of solder at the joint, since all solder remains directly at the joint;

- increases the quality of the soldered connection.

Claims (1)

Claims The solder pipe soldering method consists in forming a hole in a foreseeable location of the solder pipe in the main part, such as a pipe, which is then annularly encased in a solder (bullet), then joining the solder pipe to the main pipe and securing it to a single hole. , and performs a soldering process characterized in that, in order to increase the solder strength and quality, the sphere is formed around an internal diameter of the soldering tube, the leaves are cut into the main tube on opposite sides of the hole, and then applied to the but the solder pipe is placed on it and soldered by heating the joint until the ball melts and fills the pipe joint.