LU91361B1 - Flexible neon sign - Google Patents
Flexible neon sign Download PDFInfo
- Publication number
- LU91361B1 LU91361B1 LU91361A LU91361A LU91361B1 LU 91361 B1 LU91361 B1 LU 91361B1 LU 91361 A LU91361 A LU 91361A LU 91361 A LU91361 A LU 91361A LU 91361 B1 LU91361 B1 LU 91361B1
- Authority
- LU
- Luxembourg
- Prior art keywords
- elements
- bar
- outer sheath
- light diffusing
- led
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
The neon sign connected to electric cable (11) has outer sheath (14), bar (02), string of LED elements and light diffusing elements (08). The outer sheath is made from plastic while bar and light diffusing elements are made from soft plastic. The LED elements and light diffusing elements are mounted on outer sheath. The LED elements have LED lamps (04a,04b) mounted in through holes (03a-03d) defined transversely through bar while LED elements are connected to electric wires of bar. The light diffusing elements mounted longitudinally on outer sheath facing LED lamps are made pervious to light.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
LU91361A LU91361B1 (en) | 2007-09-10 | 2007-09-10 | Flexible neon sign |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
LU91361A LU91361B1 (en) | 2007-09-10 | 2007-09-10 | Flexible neon sign |
Publications (1)
Publication Number | Publication Date |
---|---|
LU91361B1 true LU91361B1 (en) | 2009-03-11 |
Family
ID=39247353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
LU91361A LU91361B1 (en) | 2007-09-10 | 2007-09-10 | Flexible neon sign |
Country Status (1)
Country | Link |
---|---|
LU (1) | LU91361B1 (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2409024A (en) * | 2003-12-11 | 2005-06-15 | Ben Fan | Light string using a cladding to scatter light from light emitting diodes to present a neon light effect |
US20050146870A1 (en) * | 2004-01-06 | 2005-07-07 | Jeng-Shyong Wu | Elongated flexible lighting equipment and fabricating method of same |
WO2005074326A1 (en) * | 2004-01-30 | 2005-08-11 | 1 Energy Solutions, Inc. | Led light module and light string |
DE202005006643U1 (en) * | 2005-04-26 | 2005-09-08 | Fan, Ben, Hsitzu | Light emitting diode cable illuminator for decorating e.g. house, has insulating body with slots, wires embedded parallel in body, and protective layer made of transparent material covering insulating body and light emitting diodes |
US20060171135A1 (en) * | 2005-01-17 | 2006-08-03 | Citizen Electronics Co., Ltd. | Light emitting apparatus |
WO2007101384A1 (en) * | 2006-03-06 | 2007-09-13 | He Shan Lide Electronic Enterprise Company Ltd. | A flexible neon light |
CH696771A5 (en) * | 2007-06-14 | 2007-11-30 | He Shan Lide Electronic Entpr | Bendable Light. |
-
2007
- 2007-09-10 LU LU91361A patent/LU91361B1/en active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2409024A (en) * | 2003-12-11 | 2005-06-15 | Ben Fan | Light string using a cladding to scatter light from light emitting diodes to present a neon light effect |
US20050146870A1 (en) * | 2004-01-06 | 2005-07-07 | Jeng-Shyong Wu | Elongated flexible lighting equipment and fabricating method of same |
WO2005074326A1 (en) * | 2004-01-30 | 2005-08-11 | 1 Energy Solutions, Inc. | Led light module and light string |
US20060171135A1 (en) * | 2005-01-17 | 2006-08-03 | Citizen Electronics Co., Ltd. | Light emitting apparatus |
DE202005006643U1 (en) * | 2005-04-26 | 2005-09-08 | Fan, Ben, Hsitzu | Light emitting diode cable illuminator for decorating e.g. house, has insulating body with slots, wires embedded parallel in body, and protective layer made of transparent material covering insulating body and light emitting diodes |
WO2007101384A1 (en) * | 2006-03-06 | 2007-09-13 | He Shan Lide Electronic Enterprise Company Ltd. | A flexible neon light |
CH696771A5 (en) * | 2007-06-14 | 2007-11-30 | He Shan Lide Electronic Entpr | Bendable Light. |
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