LU504474B1 - Heat-Dissipation Apparatus for Industrial Computer - Google Patents
Heat-Dissipation Apparatus for Industrial Computer Download PDFInfo
- Publication number
- LU504474B1 LU504474B1 LU504474A LU504474A LU504474B1 LU 504474 B1 LU504474 B1 LU 504474B1 LU 504474 A LU504474 A LU 504474A LU 504474 A LU504474 A LU 504474A LU 504474 B1 LU504474 B1 LU 504474B1
- Authority
- LU
- Luxembourg
- Prior art keywords
- heat
- dissipation
- support plate
- industrial computer
- dissipation apparatus
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present application discloses a heat-dissipation apparatus for an industrial computer, and relates to the-technical field of industrial devices. The heat-dissipation apparatus for the industrial computer includes a bottom seat and a plurality of heat-dissipation modules stacked and arranged sequentially upwards from the bottom seat; and the heat-dissipation module includes a support plate and a fan assembly arranged below the support plate, the support plate has a plurality of through holes, a bottom portion of the support plate is provided with a support leg, a top portion of the support plate is provided with a positioning column, the support leg is cooperated with the positioning column between upper and lower two adjacent heat-dissipation modules, there are two groups of the fan assemblies arranged, and the two groups of the fan assemblies are arranged symmetrically. The apparatus adopts a modular setting, is convenient to assemble, and occupies small area.
Description
LE Lusoars
HEAT-DISSIPATION APPARATUS FOR INDUSTRIAL
COMPUTER
The present application belongs to the technical field of industrial devices, in particular to a heat-dissipation apparatus for an industrial computer.
At present, in industrial processing processes, the use of automatic devices becomes more and more mature, and is applied to various industries.
However, the automatic devices may not be used without computers, and the operating process of the computers may inevitably generate a large amount of heat. At present, heat-dissipation fans are generally used to cool the computers.
However, due to the large number of the industrial devices, there are also many corresponding computers, and the different computers need to be provided with the heat-dissipation fans respectively, which may occupy larger area and are not easy to maintenance. Therefore, it is necessary to provide a modular heat-dissipation apparatus to solve such technical problems.
A main technical problem solved by the present application is to provide a heat-dissipation apparatus for an industrial computer, which adopts a modular setting, is convenient to assemble, and occupies small area.
In order to solve the above technical problem, a technical scheme adopted by the present application is as follows.
A heat-dissipation apparatus for an industrial computer includes a bottom seat and a plurality of heat-dissipation modules stacked and arranged sequentially upwards from the bottom seat; and the heat-dissipation module includes a support plate and a fan assembly arranged below the support plate, the support plate has a plurality of through holes, a bottom portion of the support plate is provided with a support leg, a top portion of the support plate is LU50447% provided with a positioning column, the support leg is cooperated with the positioning column between upper and lower two adjacent heat-dissipation modules, there are two groups of the fan assemblies arranged, and the two groups of the fan assemblies are arranged symmetrically.
Further, the two groups of the fan assemblies are respectively detachably mounted on two mounting plates, the two mounting plates are arranged symmetrically, and an included angle is formed between the mounting plate and the support plate.
Further, a mounting seat is arranged in the middle of the bottom portion of the support plate, one end of the mounting plate is rotatably connected to the mounting seat, and the other end is fixedly connected with the support leg by a bolt.
Further, the setting range of the included angle is 20° to 35°.
Further, the mounting plate is provided with a plurality of heat-dissipation holes.
Further, a top portion of the positioning column is provided with a groove, and the groove is matched with a bottom portion of the support leg.
Further, the heat-dissipation module on the lowest portion is detachably connected with the bottom seat.
Further, the fan assembly includes two heat-dissipation fans.
The beneficial technical effects of the present application are as follows. . The industrial computer is placed above the support plate, and since the fan assembly is arranged below a heat-dissipation plate, the effective heat dissipation may be achieved, and even better, since there are two groups of the fan assemblies arranged, and the two groups of the fan assemblies are respectively arranged on two mounting plates, the included angle is formed between the mounting plate and the support plate, and finally, the heat dissipation to both sides is achieved, and less hot air is concentrated.
Il. Due to the modular configuration adopted by the present application,
the plurality of the heat-dissipation modules may be mounted and stacked LU50447% upwards according to the requirements, thereby the mounting and heat dissipation of a plurality of the industrial computers are achieved, and the occupied area of devices is reduced. In addition, the above structure is applied to dissipate heat on both sides, so less hot air may move upwards, and the industrial computer above is prevented from being impacted. lll. Since one end of the mounting plate is rotatably connected with the support plate by the mounting seat, and the other end is fixedly connected with the support leg in the manner of the bolt, thus the support plate is rotated after the bolt is disassembled, it is more convenient for disassembly of the fan assembly, it is beneficial to cleaning or replacing, and the service life of the apparatus is improved.
Fig. 1 is an overall structure schematic diagram of the present application;
Fig. 2 is a structure schematic diagram of a heat-dissipation module of the present application;
Fig. 3 is a structure schematic diagram of the heat-dissipation module of the present application; and
Fig. 4 is a structure schematic diagram of the heat-dissipation module of the present application.
Reference signs of each part in the drawings are as follows:
Bottom seat 10;
Heat-dissipation module 20, Support plate 21, Through hole 211, Fan assembly 22, Heat-dissipation fan 221, Support leg 23, Positioning column 24,
Groove 241, Mounting plate 25, Heat-dissipation hole 251, Included angle 26,
Mounting seat 27, and Bolt 28.
In order to understand the technical means of the present application more clearly and implement it according to the content of the description, specific implementation modes of the present application are further described in detail below in combination with drawings and embodiments. The following LU50447% embodiments are used to describe the present application, but are not intended to limit the scope of the present application.
This specific embodiment discloses a heat-dissipation apparatus for an industrial computer in detail, as shown in Figs. 1 to 4, the heat-dissipation apparatus for the industrial computer includes a bottom seat 10 and a plurality of heat-dissipation modules 20 stacked and arranged sequentially upwards from the bottom seat; and the heat-dissipation module includes a support plate 21 and a fan assembly 22 arranged below the support plate, the support plate has a plurality of through holes 211, a bottom portion of the support plate is provided with a support leg 23, a top portion of the support plate is provided with a positioning column 24, the support leg is cooperated with the positioning column between upper and lower two adjacent heat-dissipation modules, there are two groups of the fan assemblies arranged, and the two groups of the fan assemblies are arranged symmetrically.
Preferably, the two groups of the fan assemblies are respectively detachably mounted on two mounting plates 25, the two mounting plates are arranged symmetrically, and an included angle 26 is formed between the mounting plate and the support plate.
Preferably, a mounting seat 27 is arranged in the middle of the bottom portion of the support plate, one end of the mounting plate is rotatably connected to the mounting seat, the other end is fixedly connected with the support leg by a bolt 28, and the bolt passes through the support leg and is threadedly connected with the mounting plate.
Preferably, the setting range of the included angle is 20° to 35°.
Preferably, the mounting plate is provided with a plurality of heat-dissipation holes 251, and it is convenient for circulation of the air.
Preferably, a top portion of the positioning column is provided with a groove 241, and the groove is matched with a bottom portion of the support leg.
Preferably, the heat-dissipation module on the lowest portion is LU50447% detachably connected with the bottom seat, and it may be the above groove structure, or other structures.
Preferably, the fan assembly includes two heat-dissipation fans, 221, and 5 the heat-dissipation capacity is better.
Working principle of the present application is as follows.
The industrial computer is placed above the support plate, and since the fan assembly is arranged below the heat-dissipation plate, the effective heat dissipation may be achieved, and even better, since there are two groups of the fan assemblies arranged, and the two groups of the fan assemblies are respectively arranged on two mounting plates, the included angle is formed between the mounting plate and the support plate, and finally, the heat dissipation to both sides is achieved, and less hot air is concentrated.
At the same time, due to the modular configuration adopted by the present application, the plurality of the heat-dissipation modules may be mounted and stacked upwards according to the requirements, thereby the mounting and heat dissipation of a plurality of the industrial computers are achieved, and the occupied area of devices is reduced. In addition, the above structure is applied to dissipate heat on both sides, so less hot air may move upwards, and the industrial computer above is prevented from being impacted.
In addition, since one end of the mounting plate is rotatably connected with the support plate by the mounting seat, and the other end is fixedly connected with the support leg in the manner of the bolt, thus the support plate is rotated after the bolt is disassembled, it is more convenient for disassembly of the fan assembly, it is beneficial to cleaning or replacing, and the service life of the apparatus is improved.
In the description of the present application, it should be noted that the orientation or position relationship indicated by terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "front", "back" and the like is an orientation or position relationship shown based on the drawings, it is only for the convenience of describing the present application and simplifying the LU50447% description, rather than indicating or implying that a device or an element referred to must have a specific orientation, or constructed and operated in the specific orientation, therefore it may not be understood as limitation to the present application.
In the description of the present application, it should be noted that unless otherwise specified and defined explicitly, terms "mounting", "connection", and "arrangement" should be broadly understood, for example, it may be a fixed connection or arrangement, a detachable connection or arrangement, or an integrated connection or arrangement. For those of ordinary skill in the art, the specific meanings of the above terms in the present application may be understood in specific circumstances.
The above are only preferred embodiments of the present application, and are not intended to limit the present application. It should be pointed out that for those of ordinary skill in the art, a plurality of improvements and variations may also be made without departing from the technical principles of the present application, and these improvements and variations should also be considered as the scope of protection of the present application.
Claims (8)
1. A heat-dissipation apparatus for an industrial computer, characterized in that the heat-dissipation apparatus for the industrial computer comprises a bottom seat (10) and a plurality of heat-dissipation modules (20) stacked and arranged sequentially upwards from the bottom seat; and the heat-dissipation module includes a support plate (21) and a fan assembly (22) arranged below the support plate, the support plate has a plurality of through holes (211), a bottom portion of the support plate is provided with a support leg (23), a top portion of the support plate is provided with a positioning column (24), the support leg is cooperated with the positioning column between upper and lower two adjacent heat-dissipation modules, there are two groups of the fan assemblies arranged, and the two groups of the fan assemblies are arranged symmetrically.
2. The heat-dissipation apparatus for the industrial computer as claimed in claim 1, characterized in that the two groups of the fan assemblies are respectively detachably mounted on two mounting plates (25), the two mounting plates are arranged symmetrically, and an included angle (26) is formed between the mounting plate and the support plate.
3. The heat-dissipation apparatus for the industrial computer as claimed in claim 2, characterized in that a mounting seat (27) is arranged in the middle of the bottom portion of the support plate, one end of the mounting plate is rotatably connected to the mounting seat, and the other end is fixedly connected with the support leg by a bolt (28).
4. The heat-dissipation apparatus for the industrial computer as claimed in claim 2, characterized in that the setting range of the included angle is 20° to
35°.
5. The heat-dissipation apparatus for the industrial computer as claimed in claim 2, characterized in that the mounting plate is provided with a plurality of heat-dissipation holes (251).
6. The heat-dissipation apparatus for the industrial computer as claimed in claim 1, characterized in that a top portion of the positioning column is LU50447% provided with a groove (241), and the groove is matched with a bottom portion of the support leg.
7. The heat-dissipation apparatus for the industrial computer as claimed in claim 1, characterized in that the heat-dissipation module on the lowest portion is detachably connected with the bottom seat.
8. The heat-dissipation apparatus for the industrial computer as claimed in claim 1, characterized in that the fan assembly comprises two heat-dissipation fans (221).
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320755319.XU CN219552955U (en) | 2023-04-07 | 2023-04-07 | Industrial computer heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| LU504474B1 true LU504474B1 (en) | 2023-09-21 |
Family
ID=87563722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| LU504474A LU504474B1 (en) | 2023-04-07 | 2023-04-29 | Heat-Dissipation Apparatus for Industrial Computer |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN219552955U (en) |
| LU (1) | LU504474B1 (en) |
| WO (1) | WO2023151716A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023151716A3 (en) * | 2023-04-07 | 2024-02-08 | 苏州瑞领克信息科技有限公司 | Heat dissipation device for industrial computer |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7372695B2 (en) * | 2004-05-07 | 2008-05-13 | Rackable Systems, Inc. | Directional fan assembly |
| CN208141318U (en) * | 2018-04-20 | 2018-11-23 | 阜阳师范学院 | A kind of computer heat radiating device |
| CN209130433U (en) * | 2018-11-14 | 2019-07-19 | 秦鲜 | A kind of computer heat-radiation bracket |
| CN212906103U (en) * | 2020-07-21 | 2021-04-06 | 山东超越数控电子股份有限公司 | Portable modularized multi-unit reinforcing server |
| CN219552955U (en) * | 2023-04-07 | 2023-08-18 | 苏州瑞领克信息科技有限公司 | Industrial computer heat abstractor |
-
2023
- 2023-04-07 CN CN202320755319.XU patent/CN219552955U/en active Active
- 2023-04-29 LU LU504474A patent/LU504474B1/en active IP Right Grant
- 2023-04-29 WO PCT/CN2023/091920 patent/WO2023151716A2/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023151716A3 (en) * | 2023-04-07 | 2024-02-08 | 苏州瑞领克信息科技有限公司 | Heat dissipation device for industrial computer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN219552955U (en) | 2023-08-18 |
| WO2023151716A3 (en) | 2024-02-08 |
| WO2023151716A2 (en) | 2023-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| LU504474B1 (en) | Heat-Dissipation Apparatus for Industrial Computer | |
| US6506111B2 (en) | Cooling airflow distribution device | |
| AU2015101865A4 (en) | LED lamp panel assembly | |
| CN107179810A (en) | A kind of computer cabinet with radiating purification function | |
| US9826664B2 (en) | Apparatus for cooling server cabinet, server cabinet apparatus, and internet data center | |
| CN201008247Y (en) | Large scale switch matrix cabinet | |
| CN203691848U (en) | Server rack cooling device, server rack device and cloud calculation data center | |
| CN202253987U (en) | Module combination type air conditioner | |
| CN210093809U (en) | Computer network switch board that heat dispersion is good | |
| WO2021000603A1 (en) | Computer case convenient for installing internal parts | |
| CN209895286U (en) | Cooling device of computer hardware | |
| CN209964523U (en) | Video information collection box that heat dispersion is good | |
| CN202121490U (en) | Small size high voltage frequency converter | |
| CN202432654U (en) | Variable-air-volume auxiliary-refrigerating floor module with adjustable wind-direction and height | |
| CN212786334U (en) | Computer lab power rack device | |
| CN218295192U (en) | Computer heat dissipation support | |
| CN220964088U (en) | Novel resonance eliminating device | |
| CN219248422U (en) | Overhead refrigerating system and container data center | |
| CN219225412U (en) | Computer cabinet with good heat dissipation effect | |
| CN215679294U (en) | Radiator of special case for electronic contest | |
| CN210926793U (en) | Power distribution cabinet with good heat dissipation | |
| CN210119739U (en) | Modularized communication server case | |
| CN114828565A (en) | Server room with built-in heat dissipation system | |
| CN211084026U (en) | Horizontal L ED power | |
| CN212934009U (en) | LED display screen with good heat dissipation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Patent granted |
Effective date: 20230921 |