LU502851B1 - A New Measuring Method of Elastic Modulus of Sn-Pb Alloy Solder Paste In Reflow Soldering Process - Google Patents
A New Measuring Method of Elastic Modulus of Sn-Pb Alloy Solder Paste In Reflow Soldering Process Download PDFInfo
- Publication number
- LU502851B1 LU502851B1 LU502851A LU502851A LU502851B1 LU 502851 B1 LU502851 B1 LU 502851B1 LU 502851 A LU502851 A LU 502851A LU 502851 A LU502851 A LU 502851A LU 502851 B1 LU502851 B1 LU 502851B1
- Authority
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- Luxembourg
- Prior art keywords
- copper foil
- solder
- elastic modulus
- temperature zone
- strain
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 88
- 238000000034 method Methods 0.000 title claims abstract description 48
- 230000008569 process Effects 0.000 title abstract description 18
- 238000005476 soldering Methods 0.000 title abstract description 15
- 229910045601 alloy Inorganic materials 0.000 title description 6
- 239000000956 alloy Substances 0.000 title description 6
- 229910020816 Sn Pb Inorganic materials 0.000 title description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 title description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 title description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 102
- 239000011889 copper foil Substances 0.000 claims abstract description 101
- 230000007246 mechanism Effects 0.000 claims description 10
- 239000011888 foil Substances 0.000 claims description 6
- 230000035945 sensitivity Effects 0.000 claims description 4
- 238000005259 measurement Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000010992 reflux Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 229910018082 Cu3Sn Inorganic materials 0.000 description 1
- 229910018471 Cu6Sn5 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
- G01N3/18—Performing tests at high or low temperatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M99/00—Subject matter not provided for in other groups of this subclass
- G01M99/002—Thermal testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/62—Manufacturing, calibrating, or repairing devices used in investigations covered by the preceding subgroups
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/003—Generation of the force
- G01N2203/0057—Generation of the force using stresses due to heating, e.g. conductive heating, radiative heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
- G01N2203/0069—Fatigue, creep, strain-stress relations or elastic constants
- G01N2203/0075—Strain-stress relations or elastic constants
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/022—Environment of the test
- G01N2203/0222—Temperature
- G01N2203/0226—High temperature; Heating means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/022—Environment of the test
- G01N2203/0244—Tests performed "in situ" or after "in situ" use
- G01N2203/0246—Special simulation of "in situ" conditions, scale models or dummies
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/022—Environment of the test
- G01N2203/0248—Tests "on-line" during fabrication
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/026—Specifications of the specimen
- G01N2203/0296—Welds
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/20—Metals
- G01N33/207—Welded or soldered joints; Solderability
Abstract
The invention disclose a method for obtaining the elastic modulus of solder by difference method is characterized in that the stress and strain values of copper foil or copper foil and solder in each temperature zone are collected by pressure sensor and strain gauge respectively, and the elastic modulus of solder in each temperature zone is calculated by difference method. device required for measure that elastic modulus of solder in the reflow soldering process, which comprise a bracket, a copper foil and bolts and nuts, the invention has simple structure and easy realization, and this method can provide a new idea for the measurement of elastic modulus.
Description
A New Measuring Method of Elastic Modulus of Sn-Pb Alloy Solder LUS02851
Paste In Reflow Soldering Process
The invention belongs to the field of electronic materials, and relates to a method for measuring elastic modulus, in particular to a method for measuring elastic modulus of solder paste during reflow soldering, which can be used for measuring elastic modulus of solder paste during reflow soldering,
With the continuous emergence of various new electronic products and the continuous improvement of people's living standards, people have put forward new requirements for the quality of electronic products, and electronic products are constantly developing towards miniaturization, thinness and high density. Accordingly, it also poses a great challenge to
SMT technology. The main processes in SMT include printing, mounting and welding, and solder paste printing is the key technology. According to relevant data, the solder defects caused by solder paste printing account for 60% ~ 70% of the total defects in SMT. The development of SMT technology is closely related to the accurate measurement of various parameters of solder paste, and the elastic modulus of solder paste is one of them.
Solder paste is a homogeneous mixture, which is made up of solder alloy powder, flux and some additives. It has a certain viscosity and good thixotropy. In the welding process, the solder paste will stick the electronic components in a given position at room temperature.
When heated to a certain temperature, with the volatilization of solvent and some additives, the alloy powder will melt, which will connect the components to be welded with the pads, and cool them to form permanently connected solder joints. At the same time, in the welding process, the solder paste will react chemically with the copper foil, and the interface metal layer IMC will be formed at the contact between the solder paste and the copper foil, and the thickness of IMC will change with the change of reflow temperature. The volatilization phenomenon in the reflow process and the formed interface metal layer IMC (mainly composed of Cu6Sn5 and Cu3Sn) make it difficult to measure the elastic modulus in the reflow process. Therefore, the invention has high application value and prospect for the study of the elastic modulus of solder paste in the reflow process. 1
At present, there are many methods to measure the elastic modulus, but they still can't LU502851 solve the difficulties mentioned above. For example, Zhao Weijuan, Zhang Chuntang and Yu
Lijun wrote an article entitled "Measurement of Low Temperature Elastic Modulus and
Poisson's Ratio of Alloys", which introduced the static measurement method of low temperature (-196°C) elastic modulus and Poisson's ratio of 1Cr18Ni9Ti austenitic stainless steel and hot rolled 16Mn steel plate with metastable structure. Connect the attached sample bridge to the strain gauge, put the sample in a thermostatic bath, and give the sample a preload, and a pre-strain output will be obtained. The elastic modulus of the sample can be obtained by setting the strain gauge to zero for several times. The invention is simple in structure and easy to realize, but it can only measure the elastic modulus of a single material at a constant temperature. This method cannot take into account the volatilization of solder paste and the reaction between copper foil and solder paste during reflow soldering, so it has limitations.
Many enterprises and research institutes often use rheometers to measure the elastic modulus of solder paste. Rheometers characterize the rheological properties of soft materials by shearing them and measuring the change of shearing force. Although rheometer can take into account the volatilization of solder paste during reflow soldering, rheometer can only measure the elastic modulus of individual solder paste during reflow soldering, without considering the influence of the interface metal layer formed between copper foil and solder paste, which makes the measured elastic modulus inaccurate and limited.
The invention aims at overcoming the existing defects of the above methods, and proposes a method for measuring the elastic modulus of solder paste in the reflow process, which is used to solve the problem that the elastic modulus is difficult to measure due to the volatilization of solder paste and the reaction between solder paste and copper foil in the reflow process.
To achieve the above purpose, the technical scheme adopted by the invention is as follows:
A method for obtaining the elastic modulus of solder by difference method is characterized in that the stress and strain values of copper foil or copper foil and solder in each temperature zone are collected by pressure sensor and strain gauge respectively, and the elastic modulus of solder in each temperature zone is calculated by difference method. The method includes the following steps: 2
(1) Setting up measuring device: LU502851
(1a) Fix a bolt which reversely passes through a threaded through hole in that cent of the groove on the copper foil by a nut, and then fixing the copper foil with the groove in the cent on a bracket by the bolt by a nut to obtain an operating mechanism in the measuring device, wherein the length of the copper foil and the bracket are equal, and strain gauges are uniformly stuck on the lower surface of the copper foil;
(1b) Zero the strain gauge and the pressure sensor and check their sensitivity, then connect the strain gauge on the lower surface of the copper foil with the pressure sensor and the strain gauge through wires to obtain a signal acquisition unit in the measuring device;
(2) Measure the stress value and strain value of each temperature zone of copper foil:
(2a) Rotate the nut on the bolt located in the center of the groove of the copper foil to apply a force load to the surface of the copper foil until the copper foil is obviously deformed, and then place the operating mechanism on the conveyor belt of the reflow oven;
(2b) When the conveyor belt passes through each temperature zone of the reflow oven, the stress value and strain value of the copper foil collected by the pressure sensor and strain gauge in the signal acquisition unit through the strain gauge are recorded,
(3) Measure the stress and strain of copper foil and solder in each temperature zone;
(3a) When that pressure sensor and strain gauge in the signal acquisition unit acquire the stress value and strain value of the copper foil in all temperature zone, take out the operating mechanism from the reflow furnace, rotate the nut on the bolt located in the center of the groove of the cop foil, and place solder in the groove of the copper foil after removing the nut from the bolt;
(3b) Place the nut on the bolt located in the center of the copper foil groove, and then rotate the nut again to apply a force load to the solder surface until the solder and the copper foil are obviously deformed, and then place the operating mechanism on the conveyor belt of the reflow oven;
(3c) When the conveyor belt passes through each temperature zone of the reflow oven, the stress and strain values of the copper foil and solder collected by the pressure sensor and strain gauge in the signal acquisition unit through the strain gauge are recorded,
(3d) When that pressure sensor and strain gauge in the signal acquisition unit acquire the stress and strain values of the cop foil and the solder in all temperature zones, the operating mechanism is taken out of the reflow oven;
3
(4) The elastic modulus of copper foil in each temperature zone and the elastic modulus LY902851 of copper foil and solder in each temperature zone are calculated by using the elastic modulus formula. (5) Using difference method to calculate the elastic modulus of solder in each temperature zone;
Calculate the elastic modulus of solder in each temperature zone by using the difference formula C, = An — B,, where C, represents the elastic modulus of solder in the nth temperature zone, A, represents the elastic modulus of copper foil and solder in the nth temperature zone, and B,, represents the elastic modulus of copper foil in the nth temperature zone; (6) Fitting the elastic modulus of solder in each temperature zone into a curve.
The method for obtaining the elastic modulus of solder by difference method according to claim 1 is characterized in that the elastic modulus formula in step (4) is as follows:
E, represents the elastic modulus of copper foil or copper foil and solder in the nth temperature zone, g,, represents the stress value of copper foil or copper foil and solder in the nth temperature zone collected by pressure sensor, and €, represents the strain value of copper foil or copper foil and solder in the nth temperature zone collected by strain gauge.
Compared with the prior art, the invention has the following advantages: 1) According to the invention, the copper foil and the solder paste are regarded as a whole to measure the elastic modulus, and in the measurement process, not only the influence of the volatilization of the solder paste in reflow soldering on the elastic modulus is considered, but also the influence of the IMC of the interface metal layer generated by the chemical reaction between the solder paste and the copper foil on the elastic modulus is considered, so that the measurement of the elastic modulus of the solder paste in the reflow soldering process is more accurate. 2) The invention has simple structure and easy realization, and this method can provide a new idea for the measurement of elastic modulus.
1) Fig. 1 is a schematic diagram of the overall structure of an embodiment of the present invention. 4
2) Fig. 2 is a schematic structural diagram of a copper foil according to an embodiment LU502851 of the present invention. 3) Fig. 3 is a structural diagram of a bracket according to an embodiment of the present invention.
The present invention will be further described in detail with reference to the drawings and specific embodiments.
The invention disclose a device required for measure that elastic modulus of solder in the reflow soldering process, which comprise a bracket, a copper foil and bolts and nuts.
The bolt nut comprises five bolt nuts, a bolt nut 1 and four bolt nuts 4.
The above bolts 1 for applying force load vertically penetrate through the lower and upper surfaces of the center of the copper foil in turn, and are fixed by nuts on the upper surface, and the force applied to the copper foil can be changed by turning the nuts.
The remaining four bolts 4 vertically penetrate through the upper and lower surfaces of the four corners of the copper foil and the bracket in turn, and are fixed by nuts.
The copper foil 2 is composed of a copper foil 21 and a groove 22, and the groove 22 is used for placing solder paste.
The bracket 3 1s used for fixing the copper foil.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
Before the experiment, the strain gauge was uniformly pasted on the lower surface of the copper foil, and the strain gauge and pressure sensor were zeroed and their sensitivity was checked. Firstly, the device is placed on the conveyor belt of the reflow oven, the strain gauge on the lower surface of the copper foil is connected with the strain gauge and pressure sensor through wires, and the force load is applied to the upper surface of the copper foil by turning the nut. Then, turn on the switch of the reflow oven, and the device can accurately simulate the reflow soldering process as the conveyor belt passes through various temperature zones of the reflow oven. Then, the strain gauge will deform with the deformation of the copper foil, and the pressure sensor and strain gauge will respectively collect the stress and strain of the strain gauge and output them to the display screen, recording the stress and deformation values in different temperature zones. Place the solder paste in the groove of the copper foil and measure according to the above aspects, and record the stress and deformation values in different temperature zones again. After the experiment, the corresponding elastic modulus is obtained by the applied stress and the output strain, and the elastic modulus curves of copper LY502851 foil and copper foil and solder paste with temperature change are fitted respectively. Then, using the difference method, the elastic modulus curve of the solder paste can be obtained by subtracting the elastic modulus curve of the copper foil alone from the elastic modulus curve of the copper foil together.
Referring to fig. 1, the overall structure diagram of the embodiment of the invention is composed of a bolt and nut 1, a copper foil 2, a strain gauge 3 and four bolts and nuts 4 from top to bottom.
Referring to fig. 2, the structure diagram of the copper foil of the embodiment of the present invention, there is a groove in the middle of the copper foil for placing solder paste.
In this example, tin-lead solder paste 63Sn37Pb is used, and the solder paste is placed in the groove on the upper surface of the copper foil, The strain gauge adopts the medium- temperature foil resistance strain gauge made of Kama alloy, and the strain gauge is uniformly pasted on the lower surface of the copper foil, The pressure sensor adopts strain gauge pressure sensor; The strain gauge adopts dynamic resistance strain gauge.
The specific steps are as follows:
Step 1: Prepare before the experiment, uniformly paste strain gauges on the lower surface of copper foil, zero the strain gauges and pressure sensors and check their sensitivity.
Step 2: Stick four strain gauges on the lower surface of the copper foil evenly, and then connect the strain gauges with the pressure sensor and strain gauge.
Step 3: Turn the bolt and nut 1 to apply a certain force load to the copper foil.
Step 4: Place the device on the conveyor belt of the reflux furnace, and turn on the switch of the reflux furnace.
Step 5: The device will follow the conveyor belt through various temperature zones, and the pressure sensor and strain gauge will respectively collect the stress and strain of the strain gauge and output them to the display screen to record the stress and deformation values in different temperature zones.
Step 6: Take the device out of the reflow oven, turn the nut to remove the nut, and place the solder paste in the groove on the upper surface of the copper foil.
Step 7: Turn the nut again and load the same force load on the surface of the solder paste.
Step 8: Place the device on the conveyor belt of the reflux furnace again, and turn on the switch of the reflux furnace.
Step 9: Similarly, as the conveyor belt passes through various temperature zones, the pressure sensor and strain gauge will respectively collect the stress and strain of the strain 6 gauge and output them to the display screen, recording the stress and deformation values in LUS02851 different temperature zones.
Step 10: Overall data, respectively fitting the elastic modulus curves of the copper foil alone and the copper foil with solder paste with temperature.
Step 11: By using the difference method, the elastic modulus curve of the solder paste can be obtained by subtracting the elastic modulus curve of the copper foil alone from the elastic modulus curve of the copper foil together.
The working principle of the invention is as follows:
After a certain force load is applied to the copper foil, the copper foil will be deformed, and the strain gauge uniformly adhered to the copper foil will also be deformed along with the deformation of the copper foil. Then, the strain gauge will collect the strain, and the elastic modulus can be obtained through small force load and deformation. As long as the temperature control box is used to simulate the temperature loaded in the reflow oven, the reflow soldering process can be reduced, and the elastic modulus of solder paste in the reflow soldering process can always be obtained.
Because it is difficult to measure the elastic modulus of the solder paste in the reflow soldering process alone, the invention skillfully avoids the direct measurement of the elastic modulus of the solder paste, but indirectly obtains the elastic modulus of the solder paste by measuring the elastic modulus of the copper foil and the elastic modulus of the copper foil and the solder paste by using the difference method.
The above description is only a specific example of the present invention, and does not constitute any limitation on the present invention. Obviously, after knowing the content and principle of the present invention, it is possible for those skilled in the art to make various modifications and changes in form and details without departing from the principle and structure of the present invention, but these modifications and changes based on the idea of the present invention are still within the scope of protection of the claims of the present invention. 7
Claims (2)
1. A method for obtaining the elastic modulus of solder by difference method is LUV502851 characterized in that the stress and strain values of copper foil or copper foil and solder in each temperature zone are collected by pressure sensor and strain gauge respectively, and the elastic modulus of solder in each temperature zone is calculated by difference method. The method includes the following steps: (1) Setting up measuring device: (1a) Fix a bolt which reversely passes through a threaded through hole in that cent of the groove on the copper foil by a nut, and then fixing the copper foil with the groove in the cent on a bracket by the bolt by a nut to obtain an operating mechanism in the measuring device, wherein the length of the copper foil and the bracket are equal, and strain gauges are uniformly stuck on the lower surface of the copper foil; (1b) Zero the strain gauge and the pressure sensor and check their sensitivity, then connect the strain gauge on the lower surface of the copper foil with the pressure sensor and the strain gauge through wires to obtain a signal acquisition unit in the measuring device; (2) Measure the stress value and strain value of each temperature zone of copper foil: (2a) Rotate the nut on the bolt located in the center of the groove of the copper foil to apply a force load to the surface of the copper foil until the copper foil is obviously deformed, and then place the operating mechanism on the conveyor belt of the reflow oven; (2b) When the conveyor belt passes through each temperature zone of the reflow oven, the stress value and strain value of the copper foil collected by the pressure sensor and strain gauge in the signal acquisition unit through the strain gauge are recorded, (3) Measure the stress and strain of copper foil and solder in each temperature zone; (3a) When that pressure sensor and strain gauge in the signal acquisition unit acquire the stress value and strain value of the copper foil in all temperature zone, take out the operating mechanism from the reflow furnace, rotate the nut on the bolt located in the center of the groove of the cop foil, and place solder in the groove of the copper foil after removing the nut from the bolt; (3b) Place the nut on the bolt located in the center of the copper foil groove, and then rotate the nut again to apply a force load to the solder surface until the solder and the copper foil are obviously deformed, and then place the operating mechanism on the conveyor belt of the reflow oven; (3c) When the conveyor belt passes through each temperature zone of the reflow oven, the stress and strain values of the copper foil and solder collected by the pressure sensor and strain gauge in the signal acquisition unit through the strain gauge are recorded, 8
(3d) When that pressure sensor and strain gauge in the signal acquisition unit acquire LV502851 the stress and strain values of the cop foil and the solder in all temperature zones, the operating mechanism is taken out of the reflow oven; (4) The elastic modulus of copper foil in each temperature zone and the elastic modulus of copper foil and solder in each temperature zone are calculated by using the elastic modulus formula. (5) Using difference method to calculate the elastic modulus of solder in each temperature zone; Calculate the elastic modulus of solder in each temperature zone by using the difference formula C, = An — B,, where C, represents the elastic modulus of solder in the nth temperature zone, A, represents the elastic modulus of copper foil and solder in the nth temperature zone, and B,, represents the elastic modulus of copper foil in the nth temperature zone; (6) Fitting the elastic modulus of solder in each temperature zone into a curve.
2. The method for obtaining the elastic modulus of solder by difference method according to claim 1 is characterized in that the elastic modulus formula in step (4) is as follows: E, represents the elastic modulus of copper foil or copper foil and solder in the nth temperature zone, g,, represents the stress value of copper foil or copper foil and solder in the nth temperature zone collected by pressure sensor, and €, represents the strain value of copper foil or copper foil and solder in the nth temperature zone collected by strain gauge. 9
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| LU502851A LU502851B1 (en) | 2022-09-28 | 2022-09-28 | A New Measuring Method of Elastic Modulus of Sn-Pb Alloy Solder Paste In Reflow Soldering Process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| LU502851A LU502851B1 (en) | 2022-09-28 | 2022-09-28 | A New Measuring Method of Elastic Modulus of Sn-Pb Alloy Solder Paste In Reflow Soldering Process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| LU502851B1 true LU502851B1 (en) | 2024-03-28 |
Family
ID=90526805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| LU502851A LU502851B1 (en) | 2022-09-28 | 2022-09-28 | A New Measuring Method of Elastic Modulus of Sn-Pb Alloy Solder Paste In Reflow Soldering Process |
Country Status (1)
| Country | Link |
|---|---|
| LU (1) | LU502851B1 (en) |
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2022
- 2022-09-28 LU LU502851A patent/LU502851B1/en active IP Right Grant
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| FG | Patent granted |
Effective date: 20240328 |