LU500440B1 - Electrode Type Electric Field Sensor Package Element and Application Thereof - Google Patents

Abstract

An electrode type electric field sensor package element comprises a package tube shell; An electric field sensor chip fixed in the package tube shell; A package cover covering the opening of the tube shell to form an inner cavity for accommodating the electric field sensor chip; The package electrode is located on the side of the package cover away from the inner cavity, and is divided into a head end, a middle section and a tail end according to the relationship from near to far with the package cover, and an application of the package element of the electrode type electric field sensor. According to the invention, the spatial resolution of the electric field sensor is improved, the sensitivity of the sensor is improved, and the environmental adaptability of the sensor is enhanced through various package electrode designs.

Description

DESCRIPTION Electrode Type Electric Field Sensor Package Element and Application Thereof

TECHNICAL FIELD The invention relates to the technical field of electric field monitoring, in particular to an electric field sensor packaged element, and also relates to monitoring an electric field area to be measured by applying the electrode type electric field sensor packaged element.

BACKGROUND Electric field monitoring 1s of great significance. In the meteorological field, the development and occurrence of lightning can be known by monitoring the change of electric field on the surface and high altitude atmosphere, which provides important indicators for lightning early warning, thus providing important safety guarantee for the launch of aircraft such as missiles and satellites; It can also provide early warning information for forests, scenic spots, transmission lines and petrochemical refineries. In the field of power grid, monitoring the electric field near transmission lines and substations can accurately obtain AC and DC voltage and phase information, which provides an important reference for the transmission state of smart grid; The electric field intensity near residential buildings and other facilities near the transmission line can also be known, which provides a basis for evaluating the electromagnetic environment impact of the power grid. In petrochemical field, static charges such as human body, equipment, oil and gas are easy to cause discharge after accumulating to a certain extent, resulting in serious safety accidents such as fire and explosion. By monitoring the electric field, the electrification situation in high-risk areas of static electricity is evaluated, which provides strong support for safe production in petrochemical field.

In general, the high-altitude electric field is detected by a one-time-use balloon, which requires small size, light weight and low cost electric field sensors; The ground electric field detection needs long-term network detection, which requires long service life and high stability of the sensor; In the field of power grid, there are requirements for AC and DC electric field detection, and sensors are required to be low in power consumption and easy to integrate; In petrochemical field, sensors are required to have no exposed moving parts and no electrostatic discharge risk. The existing electric field sensors are mostly fabricated by traditional machining processes, which cannot be used in the above fields or applied in large quantities, which restricts the development of related fields. The electric field sensor based on micro-nano technology has the outstanding advantages of low cost, small size, low power consumption, mass production, easy integration, wide working frequency and high spatial resolution of electric field detection, which is an important development direction of electric field detection sensors and attracts more and more attention in the world.

In practical applications, the sensitive chip of micro electric field sensor is easily affected by dust, air flow, rain, snow, high humidity and other harsh environments, and cannot work normally. Packaging is an important way to solve the above environmental problems. However, the sensor package also has the problem of environmental adaptability. For example, the packaged sensor is still bulky and cannot be detected in a narrow space, the sensitivity of the sensor 1s attenuated due to package, the performance of the package material itself is degraded due to harsh environment, and the package cannot solve the sensor temperature drift problem.

SUMMARY In view of the above technical problems, the present invention provides an electrode type electric field sensor package element and an electric field area to be measured monitored by using the electrode type electric field sensor package element.

(1) Technical scheme According to the present invention, the provided electrode type electric field sensor package element includes: Package tube shell; An electric field sensor chip fixed in the package tube shell; A package cover covering the opening of the tube shell to form an inner cavity for accommodating the electric field sensor chip; And the package electrode 1s located at one side of the package cover away from the inner cavity, and is divided into a head end, a middle section and a tail end according to the relationship from near to far with the package cover.

According to a specific embodiment of the present invention, the package electrode is a metal material and/or a semiconductor material.

According to a specific embodiment of the invention, the head end is directly connected with the package cover; Or there is a preset distance between the head end and the package cover, at which the electric field sensor senses the electric field generated by the head end of the package electrode.

According to a specific embodiment of the present invention, the size of the tail end is smaller than or equal to the gap near the object to be measured, the electric field sensor chip or the object to be measured.

According to a specific embodiment of the invention, the tail end is also connected with a conductor whose size is larger than or equal to the object to be measured or the electric field sensor chip.

According to a specific embodiment of the invention, the shape of the conductor is a circular plate, a square plate or a sphere.

According to a specific embodiment of the invention, the shape of the middle section is linear, arc or any combination of the two.

According to a specific embodiment of the invention, the middle section 1s wrapped by a shielding layer which comprises at least two layers of materials, one of which is a metal shielding layer; An insulating layer exists between the metal shielding layer and the middle section for isolation; Preferably, the shielding layer is connected with the zero potential or other fixed potential of the sensor, and extends to one end of the sensor and wraps the package shell and the package cover.

According to a specific embodiment of the present invention, one or more package electrodes are assembled near the same sensor chip to realize simultaneous measurement of electric fields in multiple directions.

According to the present invention, an electric field area to be measured is monitored by applying any of the electrode type electric field sensor package elements; The tail end is located in an electric field area to be measured, and the electric field area to be measured is in the atmosphere, in vacuum, in charged solution, in powder, in oil, on the surface of charged objects or in slits.

2. Beneficial effects It can be seen from the above technical scheme that the electrode type electric field sensor package element and the application thereof have the following beneficial effects: (1) The sensor sensitive chip and package shell are effectively prevented from being exposed to the environment to be measured, so that the sensor is far away from severe environmental influences such as severe temperature changes and high humidity, and the environmental adaptability of the sensor is improved, (2) By reducing the volume of the electrode end, the sensor can detect the electric field in a narrower range than the chip size, and expand the application range of the sensor; (3) By increasing the volume of the electrode end, the sensitivity of the sensor is improved, and the ability of the sensor to detect small electric fields is improved, (4) By changing the electrode direction, the sensor can sense the electric field in any direction, and improve the spatial three-dimensional electric field detection ability of the sensor;

(5) Using the sensor package element, the high-reliability package of the electric field sensor is realized, and the detection capability and environmental adaptability of the electric field sensor are improved.

BRIEF DESCRIPTION OF THE FIGURES Figure 1 is a schematic cross-sectional view of an electrode type electric field sensor package element according to example 1 of the present invention; Figure 2 1s a schematic sectional view of an electrode type electric field sensor package element according to example 2of the present invention; Figure 3 1s a schematic sectional view of an electrode type electric field sensor package element according to example 3 of the present invention; Figure 4 is a schematic sectional view of an electrode type electric field sensor package element according to example 4 of the present invention; Figure 5 1s a schematic sectional view of an electrode type electric field sensor package element according to example 5 of the present invention; Figure 6 1s a schematic sectional view of an electrode type electric field sensor package element according to example 6 of the present invention; Figure 7 1s a schematic sectional view of an electrode type electric field sensor package element according to example 7 of the present invention.

Icons: 1- Package tube shell; 2- Flectric field sensor chip; 3- Lead wire;

4- Package cover; 5(a), 5(b)- Package electrodes; 6(a)- Tip probe, 6(b)- Plate probe; 7- Shielding layer; 8- Sensor shield.

DESCRIPTION OF THE INVENTION In order to make the object, technical scheme and advantages of the present invention clearer, the present invention will be further described in detail with reference to specific embodiments and figures. It should be noted that in the figures or descriptions, similar or identical parts use the same numbers. Implementations not shown or described in the figures are known to those of ordinary skill in the technical field. In addition, although an example of a parameter containing a specific value may be provided herein, it should be understood that the parameter need not be exactly equal to the corresponding value, but may be approximated to the corresponding value within an acceptable error tolerance or design constraint.

In addition, the directional terms mentioned in the following embodiments, such as "up", "down", "front", "back", "left", "right", etc, are only the directions with reference to the figures. Therefore, directional terms used are for illustration and not for limitation of the present invention.

The invention provides an electrode type electric field sensor package element, which expands the detection capability of the sensor, improves the sensitivity of the sensor, improves the environmental adaptability of the sensor, and meets the practical application requirements by changing the volume and shape of the sensor package electrode.

In the present invention, the package electrode is divided into a head end, a middle section and a tail end according to the relationship from near to far from the package cover. Wherein, that head end is the part contact with the package cover of the electric field sensor chip or the part close to the electric field sensor chip; The tail end is the farthest part from the package cover, and the middle section is the rest.

Example 1 of the invention provides an electrode type electric field sensor package element. Referring to fig. 1, the electrode type electric field sensor package element comprises a package tube shell 1; An electric field sensor chip 2 fixed in the package tube shell; The lead wire 3, which is used for leading out the sensor signal from the tube shell; The package cover 4, which is fixed at the opening of the package tube shell 1 and forms an inner cavity together with the package tube shell 1 to accommodate the electric field sensor chip 2. The package electrode 5(a), which is fixed outside the package cover and extends a distance away from the electric field sensor chip 2.

Each component of the electric field sensor package element of this embodiment will be described in detail.

The package cover 1 may be any of metal package, ceramic package, plastic package or other types of package; The package cover 1 should include metal pads and signal paths to facilitate the electrical interconnection of the electric field sensor chip 2. According to different package types, the package can contain pins, pads, chip slots, through holes, connectors and other components.

The electric field sensor chip 2 is fixed in the package tube shell 1, and connected with its metal pads through lead wire 3 to transmit signals. The way of fixing the electric field sensor chip 2 is any one of double-sided adhesive bonding, solder bonding or other ways of fixing the chip. The bonding method of the wire 3 includes any one of gold wire ball bonding, silicon-aluminum wire bonding, flip-chip bonding or other bonding methods.

The electric field sensor chip 2 is an electrostatic field sensor chip or an alternating current electric field sensor chip, including a micro-mechanical structure chip, a microelectronic sensitive chip, an optical sensitive chip or other types of sensitive chips prepared by micro-nano machining technology.

The package cover 4 is fixed at the opening of the package tube shell 1, and the package cover 4 forms a closed cavity to accommodate the electric field sensor chip 2 and improve the environmental adaptability of the electric field sensor chip 2.

The package electrode 5(a) is fixed outside the closed cavity formed by the package case 1 and the package cover 4, and is in direct contact with the package cover. When the upper end of the package electrode 5(a) is exposed to the measured electric field, a charge signal proportional to the measured electric field will be generated on the surface of the upper end, thus generating an equivalent opposite charge signal at the lower end of the probe. The electric field sensor chip 2 can invert the measured electric field after testing the electric field generated by the charge at the lower end of the probe. The material of the package electrode 5(a) can be any material such as metal, semiconductor, etc. while different materials have different response sensitivities to the electric field.

Example 2 of the present invention provides a tip electrode type electric field sensor package element. Referring to fig. 2, compared with the example 1, a tip probe 6(a) is added at the upper end of the package electrode 5(a), and the diameter of the tip probe is smaller than or equal to the size of the object to be measured and the gap to be measured, so that it can be closer to the object to be measured, improve the spatial resolution of the sensor, improve the detection ability of the sensor to the electric field in a narrow space, and avoid the interference of the electric field by nearby charged bodies. The tip probe 6(a) may be made of the same or different material as the package electrode 5(a).

Example 3 of the present invention provides a flat electrode type electric field sensor package element. Referring to fig. 3, compared with the example 1, a flat probe 6(b) is added at the upper end of the package electrode 5(a), and the diameter of the flat probe is larger than or equal to the size of the sensor chip, so that more induced charges can be collected in the measured electric field, and the electric field sensitivity, resolution and detection ability of the sensor are improved. The flat probe 6(b) can be made of the same or different materials as the package electrode 5(a).

Example 4 of the present invention provides a flat electrode type electric field sensor package element. Referring to fig. 4, compared with example 3, the lower end of the package electrode 5(a) is not connected with the sensor package cover 4, and a certain gap is left between them. The package electrode 5(a) and the flat probe 6(b) are fixed to other components of the sensor system by means of screws, gluing, etc. The upper end of the package electrode induces an electric field to generate an induced charge, while the lower end has an opposite induced charge. The electric field generated between the lower end of the probe and the sensor chip is proportional to the measured electric field.

Example 5 of the present invention provides a bending electrode type electric field sensor package element. Referring to fig. 5, compared with example 1, the package electrode 5(b) has an arbitrarily curved flexible shape compared with the package electrode 5(a). The packaged electrode 5(b) can be bent according to the specific test requirements, so as to change the sensitive direction of the sensor and improve the sensor's sensing ability for the spatial three-dimensional electric field.

Example 6 of the present invention provides an electric field sensor package element with a curved shield electrode. Referring to fig. 6, compared with example 5, a shielding layer 7 is wrapped around the package electrode 5(b). The shielding layer includes at least two layers of materials, an insulating layer in contact with the package electrode 5(b), and a grounding metal layer wrapping the insulating layer. By adding the shielding layer 7, the induction of the external electric field in the middle of the package electrode 5(b) or the influence of charge conduction such as contact on the test can be avoided, and the detection directionality and stability of the sensor can be increased.

Example 7 of the present invention provides an electrode type electric field sensor package element with double shielding layers. Referring to fig. 7, compared with example 6, a flat probe 6(b) is added at the end of the package electrode 5(a), and a sensor shield 8 1s added outside the package tube shell 1 and the package cover

4. The package electrode 5(a) may be replaced by a curved package electrode 5(b). The sensor shield 8 is connected to the sensor signal ground, and a hole is reserved at the top for the package electrode 5(a) to pass through and connect with the package cover 4.

The above examples describe the electrode type electric field sensor package element of the present invention in detail with reference to the attached drawings. According to the above description, those skilled in the art should have a clear understanding of the electric field sensor package assembly of the present invention.

In addition, the above definition of each element 1s not limited to various specific structures or shapes mentioned in the examples, and those of ordinary skill in the art can simply replace them well-known.

To sum up, the present invention provides an electrode type electric field sensor package element, which comprises at least one sensor package tube shell, an electric field sensor sensitive chip, an electric field sensor lead wire, a sensor package cover plate and a sensor package electrode. The sensor package electrode is improved according to the size of the measured space and the sensitivity requirements of the sensor, and the sensor package electrode end, sensor package electrode shielding layer, sensor shielding cover and the like can be added. Due to the adoption of the electrode type package structure, the sensor sensitive chip can be prevented from being exposed to the tested environment; The environmental adaptability of the sensor is enhanced; The ability of the sensor system to test narrow areas is improved, and the sensitivity of the sensor system 1s improved.

The above examples further illustrate the purpose, technical scheme and beneficial effects of the present invention. It should be understood that the above- mentioned are only specific embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

CLAIMS:

1. The electrode type electric field sensor package element is characterized by comprising: a package tube shell; an electric field sensor chip fixed in the package tube shell; a package cover covering the opening of the tube shell to form an inner cavity for accommodating the electric field sensor chip; the package electrode is located on the side of the package cover away from the inner cavity, and 1s divided into a head end, a middle section and a tail end according to the relationship from near to far with the package cover.

2. The electrode type electric field sensor package element according to claim 1, which is characterized in that the package electrode is made of metal material and/or semiconductor material.

3. The electrode type electric field sensor package element according to claim 1, which is characterized in that the head end is directly connected with the package cover; or there is a preset distance between the head end and the package cover, at which the electric field sensor senses the electric field emitted by the head end of the package electrode.

4. The electrode type electric field sensor package element according to claim 1, which is characterized in that the size of the tail end is smaller than or equal to the gap near the object to be measured, the electric field sensor chip or the object to be measured.

5. The electrode type electric field sensor package element according to claim 1, which is characterized in that the tail end is connected with a conductor whose size is larger than or equal to the object to be measured or the electric field sensor chip.

6. The electrode type electric field sensor package element according to claim 5, which is characterized in that the conductor shape is a circular plate, a square plate or a sphere.

7. The electrode type electric field sensor package element according to claim 1, which is characterized in that the shape of the middle section is straight, arc or any combination of the two.

8. The electrode type electric field sensor package element according to claim 7, which is characterized in that the middle section is wrapped by a shielding layer; the shielding layer comprises at least two layers of materials, one of which is a metal shielding layer, and an insulating layer exists between the metal shielding layer and the middle section for isolation; preferably, the shielding layer is connected with the zero potential or other fixed potential of the sensor, and extends to one end of the sensor and wraps the package tube shell and the package cover.

9. The packaged element of electrode type electric field sensor according to claim 1, which is characterized in that there are one or more packaged electrodes, which are assembled near the same sensor chip to realize simultaneous measurement of electric fields in multiple directions.

10. The electrode type electric field sensor package element according to claim 1 is applied to monitor the electric field area to be measured, which 1s characterized in that the tail end is located in the electric field area to be measured, and the electric field area to be measured is in the atmosphere, in vacuum, in charged solution, in powder, in oil, on the surface of charged objects or in slits.