LU500194B1 - Evaluation method of distribution uniformity of abrasive particles on surface of diamond wire saw - Google Patents

Evaluation method of distribution uniformity of abrasive particles on surface of diamond wire saw Download PDF

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LU500194B1
LU500194B1 LU500194A LU500194A LU500194B1 LU 500194 B1 LU500194 B1 LU 500194B1 LU 500194 A LU500194 A LU 500194A LU 500194 A LU500194 A LU 500194A LU 500194 B1 LU500194 B1 LU 500194B1
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Prior art keywords
diamond wire
wire saw
denotes
abrasive particles
image
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LU500194A
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French (fr)
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Yukang Zhao
Wenbo Bi
Peiqi Ge
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Univ Shandong
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/10Segmentation; Edge detection
    • G06T7/11Region-based segmentation
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/60Analysis of geometric attributes
    • G06T7/62Analysis of geometric attributes of area, perimeter, diameter or volume
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/60Analysis of geometric attributes
    • G06T7/66Analysis of geometric attributes of image moments or centre of gravity
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/10Image acquisition modality
    • G06T2207/10004Still image; Photographic image

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Geometry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention provides an evaluation method of distribution uniformity of abrasive particles on the surface of a diamond wire saw, and relates to the field of surface quality detection and evaluation of diamond wire saws. In the method, based on an existing surface expanded image of the diamond wire saw, the surface expanded image of the diamond wire saw is pretreated by utilizing Gaussian filtering and gamma transformation, center-of-gravity positions of abrasive particles in the image are obtained through methods of global adaptive binarization, connected domain searching and the like, Voronoi subdivision is carried out on the image by taking the center-of-gravity positions of the abrasive particles in the image as seed points to obtain a Voronoi diagram, and further the area of each small region in the Voronoi diagram is corrected. Based on this, a characterization method of abrasive particles on the surface of the diamond wire saw is proposed. According to the method, an evaluation parameter is provided for the distribution uniformity of the abrasive particles on the surface of the diamond wire saw, the quantitative evaluation on the uniformity is realized, a surface quality evaluation system of the diamond wire saw is perfected, and the method has guiding values for production and application of the diamond wire saw.

Description

EVALUATION METHOD OF DISTRIBUTION UNIFORMITY OF ABRASIVE PARTICLES ON SURFACE OF DIAMOND WIRE SAW
TECHNICAL FIELD The present invention provides an evaluation method of distribution uniformity of abrasive particles on the surface of a diamond wire saw, and relates to the field of surface quality detection and evaluation of diamond wire saws.
BACKGROUND A diamond wire saw has the advantages of high processing efficiency and small kerf, and is widely applied to the field of slicing processing of hard and brittle materials such as monocrystalline silicon, sapphire, monocrystalline silicon carbide and ceramics. At present, the indexes for evaluating the surface quality of the diamond wire saw mainly include the diameter, the breaking force, the number of exposure abrasive particles per unit length and the exposure height of the abrasive particles. In addition to the parameters, the distribution uniformity of abrasive particleson the surface of the diamond wire sawcan also have an important influence on the slicing processing efficiency and the processing quality of the diamond wire saw. However, there are no parameters and methods to evaluate the distribution uniformity of abrasive particleson the surface of the diamond wire saw quantitatively. On the basis of a cylindrical surface expanded view of a diamond wire saw surface image, the image is preprocessed through Gaussian filtering and gamma transformation in the present invention. The center-of-gravity positions of the abrasive particles in the image are obtained through global adaptive binarization and connected domain searching, and a Voronoi diagram is obtained through Voronoi subdivision by taking the center-of-gravity positions of the abrasive particles in the image as seed points. The area of each small region in the Voronoi diagram is corrected, and based on this, an evaluation parameter of distribution uniformity of abrasive particles on the surface of the diamond wire saw is proposed. The method can quantitatively evaluate the distribution uniformity of the abrasive particles on the surface of the diamond wire saw , and the method has an important value for improving asurface quality evaluation system of the diamond wire saw and enhancing the effectiveness of quality evaluation of the diamond wire saw.
SUMMARY In order to solve the problem of evaluating the distribution uniformity of abrasive particles on the surface of a diamond wire saw, the present invention provides an evaluation method of distribution uniformity of abrasive particles on the surface of the diamond wire saw.
The method is suitable for diamond wire saws with different diameters and different abrasive particle densities, can uniformly and quantitatively characterize the distribution uniformity of the abrasive particles on the surface of the diamond wire saw, and accordingly can solve the problem of evaluating the distribution uniformity of the abrasive particles on the surface of the diamond wire saw.
Further, the method also can be suitable for other fields needing to evaluate the distribution uniformity of abrasive particles, such as evaluation of distribution uniformity of abrasive particles on the surfaces of grinding wheels and the like.
The technical solution of the present invention is as follows: An evaluation method of distribution uniformity of abrasive particles on the surface of a diamond wire sawincludes the steps: (1) a surface expanded image of the diamond wire saw is pretreated through methods such as Gaussian filtering, gamma transformation and the like; (2) the surface expanded image of the diamond wire saw is subjected to binarization segmentation through global adaptive binarization to be transformed into a binary image; (3) center-of-gravity positions of the abrasive particles on the surface of the diamond wire saw in the image are obtained through connected domain searching; and (4) a Voronoi diagram is generated through Voronoi subdivision by taking the center-of-gravity positions of the abrasive particles on the surface of the diamond wire saw in the image as seed points, and an abrasive particle distribution uniformity characterization parameter is obtained through the Voronoi diagram.
Further, the step (4) includes the following steps: (4.1) the area of the diamond wire saw with an outer diameter of do in the image is calculated according to formula (1), and is taken as a standard area So, On qdk,, y hg = v TEV © (1) wherein in the formula, do denotes the substrate diameter of the diamond wire saw, km denotes the magnification of a camera, vp denotes the size of a pixel in the vertical direction, Nn denotes the horizontal resolution of the camera, and So denotes the area (in pixels) of the surface expanded image of the diamond wire saw with the substrate diameter of do;
Lo . . . LU500194 (4.2) the area (in pixels) of thesurface expanded image of a diamond wire saw to be evaluated is calculated according to formula (2), fad 2) wherein in the formula, sidenotes the area of thei small region in the Voronoi diagram, and n denotes the number of small regions in the Voronoi diagram; (4.3) the area si of each small region in the Voronoi diagram is corrected through formula (3), + Se Xi = Ree fy G3) Lo Si . wherein in the formula, ~ denotes a corrected value of the area of the i small region in the Voronoi diagram; (4.4) after the areas of the regions in the Voronoi diagram are corrected, an average value of the corrected values is calculated according to formula (4), Hem Ds Scan = ns i (4) 0 # mean 5 wherein in the formula, ‘mes denotes the average value of ; and (4.5) as shown in formula (5), quadratic sums of a difference between * and FES are accumulated, a square root of a quotient between an accumulated value and the number n of the small regions in the Voronoi diagram 1s calculated, and a uniformity characterization parameter Ax is obtained, } # RN N. à > 1€; > Saver } i (5) wherein in the formula, AS denotes an evaluation parameter of distribution uniformity of the abrasive particles on the surface of thediamond wire saw. 0500136 The method provides the evaluation parameter of distribution uniformity of the abrasive particles on the surface of thediamond wire saw, is suitable for diamond wire saws with different diameters and different abrasive particle densities, can uniformly and quantitatively characterize the distribution uniformity of theabrasive particles, and accordingly can improve the effectiveness of a surface quality detection result of the diamond wire saw. The method has wide popularization and application prospects in the field of machine vision on-line detection of diamond wire saws.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a surface expanded image of a diamond wire saw.
Fig. 2 1s a surface pretreated image of the diamond wire saw.
Fig. 3 is a distribution diagram of center-of-gravity positions of abrasive particles on the surface of the diamond wire sawin an image.
Fig. 4 is a Voronoi diagram obtained based on the center-of-gravity positions of abrasive particles on the surface of the diamond wire saw.
DETAILED DESCRIPTION The present invention is further described below in combination with embodiments. The advantages and characteristics of the present invention will become clearer along with the description. However, the embodiments are exemplary only and do not constitute any limitation on the scope of the present invention. Those skilled in the art may understand that the details and forms of the technical solution of the present invention can be modified or replaced without departing from the spirit and the scope of the present invention, and these modifications and replacements shall fall within the protection scope of the present invention.
The present invention is described in detail below with reference to examples.
An evaluation method of distribution uniformity of abrasive particles on the surface of a diamond wire saw, namely an abrasive particle distribution uniformity characterization method based on a surface expanded image of the diamond wire saw, includes the following specific implementation steps: (1) the surface expanded image of the diamond wire saw shown in the Fig. 1 is pretreated through methods such as Gaussian filtering, gamma transformation and the like, and the result is shown in the Fig. 2;
(2) the surface expanded image of the diamond wire saw is subjected to binarization segmentation through global adaptive binarization to be transformed into a binary image; (3) center-of-gravity positions of abrasive particles on the surface of the diamond wire saw in the image are obtained through connected domain searching, and the result 1s 5 shown in Fig. 3; (4) a Voronoi diagram is generated through Voronoi subdivision by taking the center-of-gravity positions of abrasive particles on the surface of the diamond wire saw in the image as seed points, an uniformity characterization index is obtained through the Voronoi diagram, and the result is shown in the Fig. 4; (4.1) the area of the diamond wire saw with an outer diameter of do in the image is calculated according to formula (1), and is taken as a standard area So, ¢ = wk, y f (1) wherein in the formula, do denotes the substrate diameter of the diamond wire saw, km denotes the magnification of a camera, vp denotes the size of a pixel in the vertical direction, Nn denotes the horizontal resolution of the camera, and So denotes the area (in pixels) of the surface expanded image of the diamond wire saw with the substrate diameter of do: (4.2) the area (in pixels) of the surface expanded image of a diamond wire saw to be evaluated is calculated according to formula (2),
HB fur 2) wherein in the formula, si denotes the area of thei small region in the Voronoi diagram, and n denotes the number of small regions in the Voronoi diagram; (4.3) the area siof each small region in the Voronoi diagram is corrected through formula (3), © Sa 5 3) wherein in the formula, * denotes a corrected value of the area of the i® small oo Co LU500194 region in the Voronoi diagram; (4.4) after the areas of the regions in the Voronoi diagram are corrected, an average value of the corrected values 1s calculated according to formula (4), >, 8 (4)
wherein in the formula, Swe denotes the average value of ; and (4.5) as shown in formula (5), quadratic sums of a difference between and Sma are accumulated, a square root of a quotient between an accumulated value and the number n of the small regions in the Voronoi diagram is calculated, and an uniformity characterization parameter AS is obtained, | N ” ~ 7 8 6) wherein in the formula, (A ytes an evaluation parameter of distribution uniformity of the abrasive particles on the surface of thediamond wire saw.
Experimental case: taking a brand of diamond wire silver with a wire diameter of 160um as an example, a Voronoi diagram obtained based on a surface expanded image of the diamond wire silver is shown in Fig. 4.

Claims (2)

Claims
1. An evaluation method of distribution uniformity of abrasive particles on the surface of a diamond wire saw surface, comprising the following steps: (1) pretreating a surface expanded image of the diamond wire saw through methods such as Gaussian filtering, gamma transformation and the like; (2) performing binarization segmentation on the surface expanded image of the diamond wire sawthrough global adaptive binarization to transform the same into a binary image; (3) obtaining center-of-gravity positions of the abrasive particles on the surface of the diamond wire saw in the image through connected domain searching; and (4) generating a Voronoi diagram through Voronoi subdivision by taking the center-of-gravity positions of the abrasive particles on the surface of the diamond wire saw in the image as seed points, and obtaining an abrasive particle distribution uniformity characterization parameter through the Voronoi diagram.
2. The diamond wire saw surface abrasive particle distribution uniformity evaluation method of claim 1, wherein the step (4) comprises the following steps: (4.1) calculating the area of the diamond wire saw with an outer diameter of do in the image according to formula (1), and taking the area as a standard area So, 5, w= dik N, 6 (1) wherein in the formula, do denotes the substrate diameter of the diamond wire saw, km denotes the magnification of a camera, vp denotes the size of a pixel in the vertical direction, N» denotes the horizontal resolution of the camera, and So denotes the area (in pixels) of the surface expanded image of the diamond wire saw with the substrate diameter of do; (4.2) calculating the area (in pixels) of the surface expanded image of a diamond wire saw to be evaluated according toformula (2), 8 ft &
oo I LU500194 wherein in the formula,si denotes the area of thei small region in the Voronoi diagram, and n denotes the number of small regions in the Voronoi diagram; (4.3) correcting the area si of each small region in the Voronoi diagram through formula (3),
SE AS ° G) Lo Xi . wherein in the formula, ~ denotes a corrected value of the area of the i™® small region in the Voronoi diagram; (4.4) after the areas of the regions in the Voronoi diagram are corrected, calculating an average value of the corrected values according toformula (4), N &; ~ pe À cesser = tree 8 (4) 2 S peu 8; wherein in the formula, Fm denotes the average value of ; and (4.5) as shown in formula (5), accumulating quadratic sums of a difference between Sand Pme calculating a square root of a quotient between an accumulated value and the number n of the small regions in the Voronoi diagram, and obtaining a uniformity characterization parameter As , oy 2. A | > {3 — Saas } j a ©) wherein in the formula, AS denotes an evaluation parameter of distribution uniformity of the abrasive particles on the surface of thediamond wire saw.
LU500194A 2021-01-27 2021-05-24 Evaluation method of distribution uniformity of abrasive particles on surface of diamond wire saw LU500194B1 (en)

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CN113409229B (en) * 2021-08-20 2022-04-08 南京航空航天大学 Method for evaluating contour of abrasive particles of large-abrasive-particle superhard abrasive grinding wheel
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JP4236540B2 (en) * 2003-09-02 2009-03-11 株式会社ノリタケスーパーアブレーシブ Wire saw
DE102010030260A1 (en) * 2010-06-18 2011-12-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Apparatus and method for testing the adhesion of a coating to a substrate
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