LU102765B1 - Green nano-coating device for continuous coating of micron-sized bonding wire rod and method thereof - Google Patents

Green nano-coating device for continuous coating of micron-sized bonding wire rod and method thereof Download PDF

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Publication number
LU102765B1
LU102765B1 LU102765A LU102765A LU102765B1 LU 102765 B1 LU102765 B1 LU 102765B1 LU 102765 A LU102765 A LU 102765A LU 102765 A LU102765 A LU 102765A LU 102765 B1 LU102765 B1 LU 102765B1
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Luxembourg
Prior art keywords
coating
bonding wire
wire rod
die
micron
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LU102765A
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German (de)
Inventor
Ding Yong
Chen Dingbiao
CHENG Haoyan
Lyu Changchun
Li Shaolin
Song Kexing
Hu Hao
Cao Jun
Lu Weiwei
Zhou Yanjun
Ding Yutian
Original Assignee
Univ Henan Science & Tech
Changzhou Hengfeng Special Conductor Co Ltd
Henan Youke Electronic Mat Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/15—Nano-sized carbon materials
    • C01B32/182—Graphene
    • C01B32/194—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0241—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to elongated work, e.g. wires, cables, tubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B05D3/0272—After-treatment with ovens
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • B05D2202/40—Metallic substrate based on other transition elements
    • B05D2202/45—Metallic substrate based on other transition elements based on Cu
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2256/00—Wires or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2401/00—Form of the coating product, e.g. solution, water dispersion, powders or the like
    • B05D2401/10—Organic solvent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2401/00—Form of the coating product, e.g. solution, water dispersion, powders or the like
    • B05D2401/20—Aqueous dispersion or solution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2401/00—Form of the coating product, e.g. solution, water dispersion, powders or the like
    • B05D2401/20—Aqueous dispersion or solution
    • B05D2401/21—Mixture of organic solvent and water
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/002—Pretreatement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/20—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Wire Bonding (AREA)

Abstract

The invention provides a green nano-coating device for continuous coating of micron-sized bonding wire rod and a method thereof. The coating device in the present invention ensures the continuous and stable coating process and improves the service life and service performance of the bonding wire rod. The coating method makes the coating material deposit and adhere to the surface of the bonding wire to form a uniform coating, avoiding the problems such as the environmental pollution caused by the electroplating process, wire breakage in the drawing process and coating falling off, and avoiding the problem of the instability of the plating quality caused by drawing after electroplating process.

Description

BL-5220 SPECIFICATION LU102765 Green nano-coating device for continunns coating of wmicron-sized bonding wirerod _ _ _ _ _- and method thereof
FIELD OF THE INVENTION The invention relates to the technical field of packaging bonding wire rod, and particularly relates to a green nano-coating device for continuous coating of micron-sized bonding wire rod and method thereof.
BACKGROUND OF THE INVENTION With the rapid development of integrated circuit industry, the requirement of chip integration level is higher and higher. The bonding copper wire and the silver wire are easy to be corroded (oxidized) in the practical application of the microelectronic packaging, and are easy to fail in a high-temperature and high-humidity environment. In order to effectively improve the corrosion resistance of copper wire or silver wire and the reliability of the device under the high-temperature and high-humidity environment, it is often necessary to add coatings on the surface of copper or silver wire rod to improve their service performance. The bonding copper wire and the silver wire gradually replace the bonding gold wire in large-scale integrated circuits and LEDs to be applied to the connection of chips and pins.
At present, electroplating is mainly adopted to plate a noble metal coating such as metal palladium or gold on thin copper or silver wire so as to improve the service performance of the material. The traditional electroplating process has some problems, such as serious environmental pollution, peeling off of the plating layer and uneven thickness of the palladium layer during the further drawing process. In addition, due to the different plastic deformation properties of the plated wire and the plating layer during the drawing process, it is difficult to draw a fine (diameter <0.05 mm) bonding wire that matches the market demand. In contrast, the direct coating method can effectively avoid the problem of unstable coating quality caused by the electroplating and then drawing process.
Moreover, in order to improve the bonding between the plating layer and the plating material in the traditional electroplating process. it is often necessary to add some organic halogen compounds to the plating solution. However, the harm of organic halogen compound and the 1
BL-5220 combustion treatment thereof to human body and natural ecological environment has become an °° ~~ indisputable fact. With the promulgation of the standard IPC/JEDEC i=STD-709 of " no/low - halogen " in the field of electronic products in 2008, more and more countries have implemented halogen restriction laws, and halogen-free technology in the field of bonding wire rod has become urgent.
Therefore, there is a need to provide an improved technical solution for the above-mentioned deficiencies of the prior art.
SUMMARY OF THE INVENTION The present invention aims to provide a green nano-coating device for continuous coating of micron-sized bonding wire rod and a method thereof, which are used for solving the problems of unstable coating quality caused by a first electroplating and then drawing process in the prior art and harm to human bodies and natural ecological environment caused by organic halogen compounds added in a coating solution.
In order to achieve the above object, the invention provides a green nano-coating device for continuous coating of micron-sized bonding wire rod. The coating device comprises a motion control system, a cleaning system, a coating system and a heating deposition system, wherein the cleaning system, the coating system and the heating deposition system are arranged in sequence. A continuous coating method of the micron-sized bonding wire rod is also provided, which adopts a green-nano coating device for continuous coating.
The beneficial effects are as follows.
According to the coating device disclosed by the present invention, the coating system realizes the conveying, coating and recycling of the coating solution, wherein, the conveying speed of the coating solution is accurately controlled by a sample injection pump, the generation of residual coating solution is reduced as much as possible, the size of a die hole is adjusted through a die core, and the thickness and uniformity of the coating solution covered on the surface of the bonding wire are controlled, meanwhile, the setting of a recycling die improves the utilization rate of the coating solution; the motion control system controls the coating speed and the tightness degree of the bonding wire to ensure the coating thickness and uniform stability; the heating deposition system avoids oxidation of the bonding wire and the coating material by introducing protective gas, the 2
BL-5220 heating treatment time is adjusted by the length of each section of the heating furnace and ha 0276° “ "coating speed of the bonding wire, thé bonding strength of tiie coating material and the surfaceof ~~ the bonding wire is further strengthened, and finally the bonding wire uniformly coated with the coating material is obtained. Through coordinated control among the motion control system, the coating system and the heating deposition system, continuous and stable coating process is guaranteed, service life and service performance of the bonding wire rod are prolonged, and product requirements in the fields of lead frames, electronic information, high-end connectors and the like can be met.
According to the continuous coating method disclosed by the invention, the coating material is directly coated on the surface of the finished bonding wire rod, and then the solvent and other volatile components in the coating solution are volatilized by means of heat treatment of heating deposition, so that the coating material is deposited and attached on the surface of the bonding wire rod to form a uniform coating, which avoids the problems such as environmental pollution caused by an electroplating process, wire breakage in a drawing process, coating falling off, meanwhile, the problem of the unstability of coating quality caused by a drawing after electroplating process is avoided.
The coating solution in the present invention is a halogen-free high-efficiency dispersion wetting type coating solution, so that harm to human bodies and natural ecological environment is avoided, corrosion of the coating on the bonding wire rod is slowed down or prevented by adding a corrosion inhibitor in the coating solution, and the coating solution is promoted to form a uniform coating on the surface of the bonding wire rod by adding a film forming agent.
THE DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of the structure of a coating device in an example of the present invention.
Fig. 2 is a TEM image of an interface between the palladium-plated layer and the bonding copper wire rod body in Example 1 of the present invention.
Fig. 3 is an SEM image of the bonding copper wire uniformly coated with graphene nanoplatelets prepared in Example 2 of the present invention.
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BL-5220 DETAILED EMBODIMENTS (0108765 70777 As shown in Fig. 1, the invention provides a green haño-coatinig device for continuous coating of 7 micron-sized bonding wire rod. The coating device comprises a motion control system, a cleaning system, a coating system and a heating deposition system, wherein the cleaning system, the coating system and the heating deposition system are arranged in sequence.
The motion control system is used for releasing and furling the bonding wire rod. The bonding wire rod released by the motion control system passes through the cleaning system, the coating system and the heating deposition system in turn to realize continuous coating of the bonding wire rod.
The motion control system comprises a conveying unit, a tension unit and a winding unit. The conveying unit comprises a plurality of conveying wheels 1, and a plurality of the conveying wheels 1 are used to release and convey the bonding wire. The tension unit is arranged between the two conveying wheels 1, and the tension unit comprises a tension wheel 21, a tension rod 22, and an angular displacement sensor 23. One end of the tension rod 22 is connected with the tension wheel 21, the other end is connected with the angular displacement sensor 23. The angular displacement sensor 23 receives the tension signal and drives the tension rod 22 to rotate. The tension rod 22 drives the tension wheel 21, and the coating speed and tightness of the bonding wire rod are regulated and controlled by the position change of the tension wheel 21. The winding unit includes a winding wheel 3, and the winding wheel is used to furl the coated bonding wire rod.
A laser thickness gauge 31 is also arranged between the tension unit and the winding unit. The laser thickness gauge 31 includes two laser displacement sensors. The two laser displacement sensors are respectively arranged on the upper and lower sides of the bonding wire rod. The laser displacement sensors on the upper and lower sides measure the positions of the upper and lower surfaces of the bonding wire rod, respectively. The thickness of the measured body is obtained through calculation, thus the thickness of the bonding wire rod is calculated.
Among them, the motion control system 1s a control system for actively releasing, tensioning and winding wires and a servo motor is used as the drive. The coating speed can be adjusted through the motion control system, so as to ensure the coating thickness and the uniform stability of the coating.
The cleaning system is used to remove impurities on the surface of the bonding wire rod released by the motion control system.
4
BL-5220 The cleaning system comprises a cleaning unit 91 and a drying unit 92, and the bonding wire od 270° oo passes through the cieaning unit 91 and the drying unit 52 in sequence. The cleaning unit 91 = comprises a high-pressure water gun which is arranged annularly, and the high-pressure water gun is used to remove impurities on the surface of the bonding wire rod. The drying unit 92 comprises a high-pressure air gun, and the high-pressure air gun sprays dry air to dry the cleaned bonding wire rod.
The coating system includes liquid storage tank 4, sampling pump 5 and a coating die. The liquid storage tank 4 is used to hold the coating solution, the sampling pump 5 transports the coating solution to the coating die. The bonding wire rod cleaned by the cleaning system passes through the coating die for continuous coating.
One end of the sampling pump 5 is connected with a liquid storage tank 4 through the first flow guide pipe 51, and the other end is connected with the coating die through the second flow guide pipe 52.
The sampling pump 5 is a micro sampling pump 5. The micro sampling pump 5 is used to control the delivery rate of the coating solution precisely, and to minimize the generation of remaining coating solution as much as possible under the condition that the coating solution is sufficient.
The coating die comprises a die body 61 and a die core 62, and both of the die body 61 and the die core 62 are provided with two. The two die bodies 61 are arranged oppositely to form an inlet area 63 and an outlet area 64. The inlet area 63 and the outlet area 64 serve as an input port and an output port of the bonding wire rod, respectively. The two die cores 62 are arranged oppositely on the inner side of the die body 61 to form a die hole respectively. The die core 62 is mainly used to control the thickness and uniformity of the coating solution covered on the surface of the bonding wire rod to prevent the coating solution from wetting the die core 62 for secondary coating, and the bonding wire rod passes through the inlet area 63, the die hole and the outlet area 64 in sequence. Wherein, the bonding wire rod after impurity treatment by the cleaning system enters from the inlet area 63, passes through the die holes between the die cores 62, and then passes through the outlet area 64. The die core 62 of the present invention is made of diamond which is a wear-resistant material, so as to prevent the diameter of the die hole from being changed under the continuous friction of the bonding wire.
The coating system further comprises a recovery mold 65. The upper end of the recovery mold
BL-5220 65 is provided with a cavity. The cavity is positioned below the inlet area 63, and the cavity is used 2 °° © "to recover the exEeSs coating solution in the inlet area 63. A liquid discharge channel is arranged at = the bottom of the cavity of the recovery mold 65. A liquid discharge pipeline 66 is arranged at the liquid discharge channel, and the other end of the liquid discharge pipeline 66 is connected with the liquid storage tank 4. The recycling mold 65, the coating die, liquid storage tank 4 and sampling pump 5 are sealed systems. The liquid storage tank 4 is a container with a closed upper end. The coating solution is transported and flows in the closed system to avoid the secondary pollution of the coating solution and improve the utilization rate of the coating solution.
The heating deposition system comprises a heating pipe 7. The bonding wire passes through the inside of the heating pipe 7. A heating device 8 is provided circumferentially on the outer side of the heating pipe 7, and the heating device 8 is used to heat the bonding wire passing through the heating pipe 7 to deposit a coating solution.
Two ends of the heating pipe 7 are provided with a gas inlet 71 and a gas outlet 72, respectively. The gas inlet 71 and gas outlet 72 are used to pass protective gas into the heating pipe 7 so as to avoid oxidation of the bonding wire and the coating layer. The heating device 8 comprises a multi-section resistance furnace, and the heating power of the multi-section resistance furnace can be controlled independently. As shown in FIG. 1, the gas outlet is provided in an upward opening type, which is favorable for the fluidity of the protective gas, so that the coating solution is attached to the bonding wire evenly.
Among them, the multi-section resistance furnace heats the bonding wire passing through the heating pipe 7. The multi-temperature zone heating is realized through the multi-section resistance furnace, and the solvent and additives in the coating solution covered on the bonding wire are removed, so that the interface of the coating material and the bonding wire is regulated and controlled accurately, and the stability of the coating quality of the bonding wire is further improved. The heating treatment time of each section of resistance furnace on the coated bonding wire rod is adjusted according to the length of each section of the resistance furnace and the coating rate of the bonding wire.
The present invention further provides a continuous coating method for micron-sized bonding wire rod. The continuous coating method adopts the green nano-coating device of the present invention to carry out continuous coating. and the continuous coating method comprises the 6
BL-5220 following steps. LU102765 “81, removing impurities on the surface of the bonding wire and drying the bonding wire: The bonding wire passes through the cleaning unit 91 firstly to remove the impurities adsorbed on the surface under the washing of the annular high-pressure water gun, and then passes through the drying unit 92 to dry the bonding wire under the dry air sprayed by the annular high-pressure air gun.
S2, the sampling pump 5 injects the coating solution into the coating die at a certain speed, the coating speed is adjusted through the motion control system, and the bonding wire covered with the coating solution is obtained after the bonding wire passes through the coating die. After the bonding wire enters the coating die, the coating solution is injected into the inlet area 63 of the coating die through the micro sampling pump 5. The thickness of the coating is adjusted through the aperture of the die hole between the die cores 62 and the content of the coating material in the coating solution, and the remaining coating solution is recycled.
The coating solution comprises the following components in percentage by mass: 1~30 % of coating material, 55~99 % of solvent and 0~15 % of additives. The coating material is one or more of noble metal, noble metal salt and graphene. The solvent is a mixture of one or more of water, ethanol, ethylene glycol, polyethylene glycol 600 and polyethylene glycol 800. The additives comprise a dispersing agent, a corrosion inhibitor, a film forming agent and a regulator, wherein the dispersing agent is one or more of oleic acid, octylphenol polyoxyethylene ether, polypyrrolidone and sodium dodecyl benzene sulfonate, and is mainly used to prevent the agglomeration of nano-materials and make them uniformly dispersed in the solvent; the corrosion inhibitor is one or two of polyaspartic acid and modified phytate, and is mainly used to slow down or prevent the corrosion of the bonding wire caused by coating; the film-forming agent is one or more of polyacrylamide modified rosin, hydroxyethyl cellulose and chitosan, and is mainly used to promoting the coating solution to form a uniform coating on the surface of the bonding wire; the regulator is one or two of glutamic acid and arginine, and is mainly used to regulate the pH of the coating solution.
In addition, the preparation method of the coating solution in the present invention is as follows: firstly, the additive is dissolved in the solvent to obtain the solution, then, a certain amount of coating material is weighed and dispersed in the above solution by ultrasonic or stirring to form a 7
BL-5220 uniform coating solution, and finally, the uniform coating solution is obtained by carrying out filter 270° "pressing under the filter screen of 50-300 pin fo remove impurities. Co - The noble metal is nano-palladium. The noble metal salt is tetraammonium palladium sulfate.
In step S2, the sampling pump 5 injects the coating solution into the coating die at a rate of 1.5~2 ml/h, and the coating speed is 50 ~100 m/min.
S3. The bonding wire covered with the coating solution obtained in step S2 is transported to the heating deposition system. Under a protective gas atmosphere, the heating temperature of the heating device 8 is adjusted to remove the solvent and other components in the coating solution, so that the coating material is deposited on the bonding wire, and the bonding wire covered with the coating material is obtained. The protective gas in step S3 is a mixed gas of Nz and Ha, and the volume ratio of N3 and Hz is 19:1.
Example 1 This example provides a coating solution which comprises the following components in percentage by mass: nano palladium 15% with a size of 10 nm, solvent 77%, additive 8%; wherein, in percentage by mass, the solvent comprises 22% ethanol, 20% ethylene glycol, 20% polyethylene glycol 600 and 15% polyethylene glycol 800; the additives include dispersant (3% oleic acid and
0.5% octylphenol polyoxyethylene ether), corrosion inhibitor (2% modified phytate), film forming agent (2% polyacrylamide modified rosin) and regulator (0.5% glutamic acid).
The preparation method of the coating solution in this example comprises the following steps: firstly, an additive is dissolved in the solvent to obtain the solution; then, nano palladium of 10 nm is added into the solution, and a uniform coating solution is formed by stirring for 6 hours and then ultrasonic for 12 hours; finally, a coating solution is obtained after the impurities are removed by filter pressing under a filter screen of 50 um.
The example of the present invention also provides a continuous coating method for micron-sized bonding wire rod, which comprises the following steps: S1, adopting a 0.020 mm bonding copper wire, removing impurities on the surface of the bonding copper wire and drying.
S2, the micro sampling pump 5 injected the coating solution into the coating die at the rate of 1.5 8
BL-5220 ml/h, the coating speed was adjusted to 90 m/min through the motion control system, and he 270° "7" 7 "bonding copper wire passed through the die hole with a aperture of 0.023 mim to Gbtain the bonding = wire covered with the coating solution.
S3, conveying the bonding wire covered with the coating solution obtained in the step S2 to a heating deposition system, heating for 1second under a mixed gas atmosphere of 95% N2 + 5% H> at 450 degree Celsius to remove solvents and other components in the coating solution, and finally obtaining the bonding copper wire evenly coated with palladium. It can be seen from Figure 2 that the palladium plating layer is directly combined with the copper-based material, and has good film-forming property, uniform plating layer thickness and no obvious cracks.
Example 2 This example provides a coating solution which comprises the following components in percentage by mass: single-layer graphene nanoplatelets 5% , solvent 82%, additive 13%; wherein, in percentage by mass, the solvent comprises 17% ethanol, 20% ethylene glycol, 25% polyethylene glycol 600 and 20% polyethylene glycol 800; the additives include dispersant (5% oleic acid and 1% sodium dodecyl benzene sulfonate), corrosion inhibitor (2% Polyaspartic acid), film forming agent (3.5% polyacrylamide modified rosin and 1% chitosan) and regulator (0.5% arginine).
The preparation method of the coating solution in the example is as follows: firstly, the additive is dissolved in the solvent to obtain the solution; then, the single-layer graphene nanosheets are added into the above solution, and the ultrasonic wave is applied for 12 hours to form a uniform coating solution; finally, the coating solution is obtained after the impurities are removed by filter pressing under a filter screen of 300 um.
The example of the present invention also provides a continuous coating method for micron-sized bonding wire rod. Wherein, in step S1 a bonding copper wire of 0.050 mm is used; in step S2, the injection rate of the micro sampling pump 5 is 2.0 ml/h, the coating speed is 60 m/min, and the hole size of the die hole in the coating die is 0.055 mm; in step S3, heat treatment is carried out at 500 degree Celsius for 0.8 seconds. The other steps and methods are the same as those in Example 1, which will not be repeated here. Finally, the bonding copper wire coated with graphene nanoplatelet uniformly is obtained. It can be seen from Fig. 3 that the combination between graphene coating and copper-based material is good. the thickness of the coating is uniform, and there are no obviously large holes and cracks in the coating.
9
BL-5220 Example 3 LU102765 7 7 This example provides a coating solution which comprises the following components in” 77 ~ percentage by mass: 30% of tetraammonium palladium sulfate, 60% of solvent, 10% of additive; wherein, in percentage by mass, the solvent comprises 25% of ethanol, 20% of polyethylene glycol 600 and 15% of polyethylene glycol 800; the additives include dispersant (5% of oleic acid and 1% of octylphenol polyoxyethylene ether), corrosion inhibitor (1% of modified phytate), film forming agentformer (2% of polyacrylamide modified rosin) and regulator (1% of arginine).
The preparation method of the coating solution in this example is as follows: firstly, the additive is dissolved in the solvent to obtain the solution; then, nano palladium of 10 nm is added into the solution, and a uniform coating solution is formed by stirring for 6 hours and then ultrasonic for 12 hours; finally, a coating solution is obtained after the impurities are removed by filter pressing under a filter screen of 50 um.
The preparation method of the coating solution in the example is as follows: firstly, the additive is dissolved in the solvent to obtain the solution; then, tetraammonium palladium sulfate is added into the above solution, the solution is stirred for 6 hours and then ultrasonicated for 12 hours to form a uniform coating solution; finally, the coating solution is obtained after the impurities are removed by filter pressing under a filter screen of 50 pm.
The example of the present invention also provides a continuous coating method for micron-sized bonding wire rod. Wherein, in step S1 a bonding copper wire of 0.020 mm is used; in step S2, the injection rate of the micro sampling pump 5 is 2.0 ml/h, the coating speed is 90 m/min, and the hole size of the die hole in the coating die is 0.024 mm; in step S3, heat treatment is carried out at 420 degree Celsius for 1 second. The other steps and methods are the same as those in Example 1, which will not be repeated here. Finally, the bonding copper wire coated with tetraammonium palladium sulfate uniformly is obtained.
In summary, in the coating device of the present invention, the coating system realizes the transportation, coating and recovery of the coating solution; the motion control system realizes the accurate control of the tension and positioning of the bonding wire; the heating deposition system realizes the accurate control of temperature and temperature zone; and the three systems are coordinately controlled to ensure the continuous and stable coating process.

Claims (10)

  1. BL-5220 WHAT IS CLAIMED IS: LU102765 use 1. A green nano-coating device for continuous coating of micron-sized bonding wire rod, __ __ characterized in that, the green nano-coating device comprises a motion control system, a cleaning system, a coating system and a heating deposition system, wherein the cleaning system, the coating system and the heating deposition system are arranged in sequence; the motion control system is used for releasing and furling the bonding wire rod, the bonding wire rod released by the motion control system passes through the cleaning system, the coating system and the heating deposition system in turn to realize continuous coating of the bonding wire rod; the cleaning system is used to remove impurities on the surface of the bonding wire rod released by the motion control system; the coating system includes a liquid storage tank, a sampling pump and a coating die, wherein, the liquid storage tank is used to hold the coating solution, the sampling pump transports the coating solution to the coating die, the bonding wire rod cleaned by the cleaning system passes through the coating die for continuous coating; the heating deposition system comprises a heating pipe, the bonding wire rod passes through the inside of the heating pipe, a heating device is provided circumferentially on the outer side of the heating pipe and is used to heat the bonding wire rod passing through the heating pipe to deposit the coating solution.
  2. 2. The green nano-coating device for continuous coating of micron-sized bonding wire rod according to claim 1, characterized in that, the motion control system comprises a conveying unit, a tension unit and a winding unit, wherein, the conveying unit comprises a plurality of conveying wheels which are used to release and convey the bonding wire rod the tension unit is arranged between two of the conveying wheels, and the tension unit comprises a tension wheel, a tension rod and an angular displacement sensor; one end of the tension rod is connected with the tension wheel. the other end of the tension rod is connected with the angular displacement sensor, and the coating speed and tightness of the bonding wire rod are regulated and 1
    BL-5220 controlled by the position change of the tension wheel; LU102765 © 7 the winding unit includes a winding wheel which is used to für] the coated bonding Wire rod. 77
  3. 3.The green nano-coating device for continuous coating of micron-sized bonding wire rod according to claim 1, characterized in that, the cleaning system comprises a cleaning unit and a drying unit, and the bonding wire rod passes through the cleaning unit and the drying unit in sequence, the cleaning unit comprises a high-pressure water gun which is arranged annularly, and the high-pressure water gun is used to remove impurities on the surface of the bonding wire rod, the drying unit comprises a high-pressure air gun which sprays dry air to dry the cleaned bonding wire.
  4. 4. The green nano-coating device for continuous coating of micron-sized bonding wire rod according to claim 1, characterized in that, one end of the sampling pump is connected with a liquid storage tank through a first flow guide pipe, and the other end of the sampling pump is connected with the coating die through a second flow guide pipe; the coating die comprises a die body and a die core, both of the die body and the die core are provided with two, and two of the die bodies are arranged oppositely to form an inlet area and an outlet area, two of the die cores are arranged oppositely on the inner side of the die body to form a die hole, the bonding wire passes through the inlet area, the die hole and the outlet area in sequence.
  5. 5. The green nano-coating device for continuous coating of micron-sized bonding wire rod according to claim 4, characterized in that, the coating system further comprises a recovery mold, the upper end of the recovery mold is provided with a cavity.
    the cavity is positioned below the inlet area, and the cavity is used to recover the excess coating solution in the inlet area, a liquid discharge channel is arranged on the recovery mold located at the bottom of the cavity, 12
    BL-5220 a liquid discharge pipeline is arranged at the liquid discharge channel, and the other end of the °° “ 7 liquid discharge pipeline is connected with the liquid Stôrage tank, | m nm the recycling mold, coating die, liquid storage tank and sampling pump form a sealed system.
  6. 6. The green nano-coating device for continuous coating of micron-sized bonding wire rod according to claim 1, characterized in that, two ends of the heating pipe are provided with an gas inlet and an gas outlet, respectively, the gas inlet and gas outlet are used to pass protective gas into the heating pipe So as to avoid oxidation of the bonding wire and coating layer, the heating device comprises a multi-section resistance furnace, and the heating power of the multi-section resistance furnace can be controlled independently.
  7. 7. A continuous coating method for micron-sized bonding wire rod by using the green nano-coating device according to any one of claims 1-6, characterized in that, the continuous coating method comprises the following steps of.
    S1, removing impurities on the surface of the bonding wire and drying the bonding wire, S2, the sampling pump injecting the coating solution into the coating die at a certain speed, coating speed being adjusted through the motion control system, and the bonding wire rod passing through the coating die to obtain the bonding wire rod covered with the coating solution, S3. The bonding wire covered with the coating solution obtained in step S2 being transported to heating deposition system, under a protective gas atmosphere, heating temperature of heating device being adjusted to remove the solvent and volatile components in the coating solution, so that coating material is deposited on the bonding wire to obtain the bonding wire covered with the coating material.
  8. 8. A continuous coating method for micron-sized bonding wire rod according to claim 7, characterized in that, the coating solution comprises the following components in percentage by mass: 1~30 % of coating material, 55~99 % of solvent and 0~15 % of additives, the coating material is one or more of noble metal. noble metal salt and graphene, 13
    BL-5220 . . LU102765 the solvent is a mixture of one or more of water, ethanol, ethylene glycol, polyethylene glycol ~~ 600 and poiyethyiene glycol 800, PT TT OT 7 the additives comprise a dispersing agent, a corrosion inhibitor, a film forming agent and a regulator.
  9. 9. A continuous coating method for micron-sized bonding wire rod according to claim 8, characterized in that, the noble metal is nano-palladium and the noble metal salt is tetraammonium palladium sulfate.
  10. 10. A continuous coating method for micron-sized bonding wire rod according to claim 7, characterized in that, the sampling pump injects the coating solution into the coating die at a rate of 1.5~2 ml/h in step S2, coating speed in step S2 is 50 ~100 m/min, the protective gas in step S3 is a mixed gas of N2 and Ho. 14
LU102765A 2021-03-12 2021-04-02 Green nano-coating device for continuous coating of micron-sized bonding wire rod and method thereof LU102765B1 (en)

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CN116973539B (en) * 2023-09-21 2023-12-05 常州恒丰特导股份有限公司 Control device and control method for medical wire drawing process

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DE2930870C2 (en) * 1979-07-30 1981-04-02 Felten & Guilleaume Carlswerk AG, 5000 Köln Method and device for producing enamel-insulated winding wires, in particular thick wires
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