LT2636108T - Aukštos įtampos jungiklis su aušinimo įrenginiu - Google Patents

Aukštos įtampos jungiklis su aušinimo įrenginiu

Info

Publication number
LT2636108T
LT2636108T LTEP10797985.8T LT10797985T LT2636108T LT 2636108 T LT2636108 T LT 2636108T LT 10797985 T LT10797985 T LT 10797985T LT 2636108 T LT2636108 T LT 2636108T
Authority
LT
Lithuania
Prior art keywords
cooling device
voltage switch
voltage
switch
cooling
Prior art date
Application number
LTEP10797985.8T
Other languages
English (en)
Inventor
Thorald Horst Bergmann
Original Assignee
Bergmann Messgeräte Entwicklung Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bergmann Messgeräte Entwicklung Kg filed Critical Bergmann Messgeräte Entwicklung Kg
Publication of LT2636108T publication Critical patent/LT2636108T/lt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Thermal Sciences (AREA)
  • Electronic Switches (AREA)
  • Lasers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
LTEP10797985.8T 2010-11-03 2010-11-03 Aukštos įtampos jungiklis su aušinimo įrenginiu LT2636108T (lt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE2010/075118 WO2012059074A1 (de) 2010-11-03 2010-11-03 Hochspannungsschalter mit kühleinrichtung

Publications (1)

Publication Number Publication Date
LT2636108T true LT2636108T (lt) 2017-06-26

Family

ID=44357178

Family Applications (1)

Application Number Title Priority Date Filing Date
LTEP10797985.8T LT2636108T (lt) 2010-11-03 2010-11-03 Aukštos įtampos jungiklis su aušinimo įrenginiu

Country Status (6)

Country Link
US (1) US9070665B2 (lt)
EP (1) EP2636108B1 (lt)
CA (1) CA2816468C (lt)
LT (1) LT2636108T (lt)
SI (1) SI2636108T1 (lt)
WO (1) WO2012059074A1 (lt)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150096719A1 (en) * 2013-10-04 2015-04-09 Specialty Minerals (Michigan) Inc. Apparatus for Dissipating Heat
DE102014111774A1 (de) 2014-08-18 2016-02-18 AMOtronics UG Anordnung und Verfahren zum Modulieren von Laserpulsen
DE202016100481U1 (de) * 2016-02-01 2017-05-04 Gebr. Bode Gmbh & Co. Kg Elektronikmodul mit einer Leistungshalbleiteranordnung
US9998055B2 (en) 2016-04-14 2018-06-12 Caterpillar Inc. Low inductance power electronics configuration for electric drive systems
DE102023203029A1 (de) 2023-03-31 2024-10-02 Siemens Mobility GmbH Kühlplatte für Leistungshalbleiterbauelemente

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1218841B (it) * 1984-01-23 1990-04-24 Ates Componenti Elettron Dispositivo di protezione per uno stadio finale in push-pull, contro il cortocircuito tra il terminale di uscita ed il polo positivo dell'alimentazione
DE3630775A1 (de) 1986-09-10 1988-03-24 Frank Behlke Mosfet-hochspannungsschalter mit extrem kurzer schaltzeit
DE4017749C2 (de) * 1989-03-18 1993-12-16 Abb Patent Gmbh Verfahren zur Herstellung eines Flüssigkeitskühlkörpers aus elektrisch isolierendem Material
DE3908996C2 (de) * 1989-03-18 1993-09-30 Abb Patent Gmbh Verfahren zur Herstellung eines Flüssigkeitskühlkörpers
US5790574A (en) * 1994-08-24 1998-08-04 Imar Technology Company Low cost, high average power, high brightness solid state laser
JP3338974B2 (ja) * 1995-01-11 2002-10-28 ミヤチテクノス株式会社 レーザ装置
FR2756134B1 (fr) * 1996-11-21 1999-07-09 Gec Alsthom Transport Sa Dispositif de refroidissement pour composants igbt
JP3830243B2 (ja) * 1997-10-06 2006-10-04 トヨタ自動車株式会社 電池電源装置
US6972957B2 (en) * 2002-01-16 2005-12-06 Rockwell Automation Technologies, Inc. Modular power converter having fluid cooled support
US7760776B2 (en) * 2007-11-02 2010-07-20 Glen Ivan Redford Scalable, reconfigurable, laser combiner
JP2010212561A (ja) * 2009-03-12 2010-09-24 Panasonic Corp レーザ発振装置およびレーザ加工機

Also Published As

Publication number Publication date
EP2636108A1 (de) 2013-09-11
SI2636108T1 (sl) 2017-09-29
WO2012059074A1 (de) 2012-05-10
US9070665B2 (en) 2015-06-30
CA2816468A1 (en) 2012-05-10
CA2816468C (en) 2017-03-14
US20130313701A1 (en) 2013-11-28
EP2636108B1 (de) 2017-03-29

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