KR980012040A - Drain cup device - Google Patents

Abstract

In order to increase the height of the cup guide ring in order to prevent fine particles from being generated after a predetermined time after the coating liquid is spilled on the upper surface of the cup guide ring of the drain cup device, So that the solution is prevented from protruding from the upper surface of the cup guide ring, thereby increasing the yield of the wafer.

Description

Drain cup device

The present invention relates to a drain cup apparatus which is a coating apparatus, and more particularly, to a drain cup apparatus for preventing a coating solution from rising on the upper surface of the cup guide ring to contaminate the cup guide ring surface by raising the height of the guide ring. Cup device.

Typical drain cup equipment is spraying OCD coating liquid mixed IPA (Isopropyl Alcohol) and Si (Silicon) on the wafer surface, spinning the spindle chuck at a high speed and applying the wafer surface with OCD solution to flatten the wafer surface .

1 is a cross-sectional view schematically showing the configuration of a conventional drain cup device.

The conventional drain cup device has a circular spindle chuck 1 for rotating the wafer 5 to apply the OCD liquid to the surface of the wafer 5 and a spindle chuck 1 spaced apart from the spindle chuck 1 And a cup portion (10) surrounding the spindle chuck (1).

A suction plate 3 for fixing the wafer 5 is formed on the upper surface of the spindle chuck 1 and a wafer 5 to be coated with the OCD solution is placed on the upper surface of the suction plate 3.

The inside of the cup portion 10 formed in a circular shape is formed with a cup 7 through which the OCD solution and the IPA solution protruding outward due to the centrifugal force flows and is stored. A first discharge pipe 9 for discharging the solution flowing along the wall surface of the discharge port 7 and a second discharge pipe 11 for discharging particles existing in the fine particle state to the outside.

A cup guide ring 13 is formed on the outer side of the cup 7 to prevent the solution from protruding to the outside and the cup guide ring 13 is connected to the connection ring 15 And a cup side wall portion 17 for supporting the connecting ring 15 is formed in the lower portion of the connecting ring 15.

Here, an OCD spraying nozzle 19 for spraying the OCD solution and an IPA (21) spraying nozzle for etching the wafer edge OCD solution are formed above the drain cup.

The operation of the drain cup thus constructed will be described below.

First, when the robot arm (not shown) carries the wafer 5 after the preceding process to the drain cup device, the spindle chuck 1 is lifted and the transferred wafer 5 is placed on the upper surface of the spindle chuck 1, The vacuum pump is driven to prevent the wafer 5 from separating from the upper surface of the spindle chuck 1 so that the attracting plate 3 fixes the wafer 5. [

When the wafer 5 is fixed to the spindle chuck 1 by the chucking plate 3, the spindle chuck 1 is lowered and the OCD solution jetting nozzle 19 moves the OCD mixed solution to the center of the wafer 5 The OCD solution dispersed in the center of the wafer 5 is evenly applied to the surface of the wafer 5 by the centrifugal force of the rotating spindle chuck 1, A part of which protrudes out and flows down on the inner wall surface of the cup 7 or springs up to the upper surface of the cup guide ring 13. [

The solution flowing down through the inner wall surface of the cup 7 is discharged to the first discharge pipe 9 formed at the lower portion of the cup 7. When a predetermined time has elapsed, (Not shown) formed under the second discharge pipe 11 to discharge the fine dust to the outside in order to remove the fine dust because fine dust is generated.

However, the solution spouted on the upper surface of the cup guide ring solidifies when a certain period of time has elapsed to cause fine dust, thereby contaminating the surface of the wafer, thereby lowering the yield.

Accordingly, it is an object of the present invention to provide a drain cup device which prevents the solution from jumping up to the upper surface of the cup guide ring during the coating process, thereby preventing the solution from coagulating and causing fine dust, thereby improving wafer yield have.

FIG. 1 is a cross-sectional view schematically showing the structure of a conventional drain cup device. FIG.

FIG. 2 is a cross-sectional view schematically showing the structure of a drain cup device according to the present invention. FIG.

DESCRIPTION OF THE REFERENCE NUMERALS

1, 31: spindle chuck 5, 35: wafer

7, 37: cup 9, 39: first discharge pipe

11, 41: second discharge pipe 13, 43: cup guide ring

15, 45: connecting ring 17, 47: cup side wall portion

In order to achieve the above object, according to the present invention, in order to raise the height of the cup guide ring so that the coating solution does not jump, the length of the connection ring or the length of the cup side wall portion is raised upward, So that it does not protrude to the upper surface.

Hereinafter, an embodiment of the drain cup device according to the present invention will be described with reference to FIG.

2 is a cross-sectional view schematically showing the structure of a drain cup device according to the present invention.

The drain cup device according to the present invention includes a circular spindle chuck 31 for rotating the wafer 35 to coat the surface of the wafer 35 with the OCD liquid and a spindle chuck 31 outside the spindle chuck 31, And a cup part (3) surrounding the spindle chuck (31).

A suction plate 33 for fixing the wafer 35 is formed on the upper surface of the spindle chuck 31 and a wafer 35 to be coated with the OCD solution is placed on the upper surface of the suction plate 33.

The circular drain cup portion is provided with a cup 37 for collecting the OCD solution and IPA solution protruding outward due to the centrifugal force and flows along the wall surface of the cup 37 by a centrifugal force in a certain lower region of the cup 37 A first discharge pipe 39 for discharging the introduced solution and a second discharge pipe 41 for discharging particles existing in the form of fine dust to the outside are formed.

A cup guide ring 43 surrounding the outside of the wafer 35 is formed on the outside of the cup 37. A cup ring 43 surrounding the cup guide ring 43 is formed outside the circumference of the cup guide ring 43 And a cup side wall portion 47 for supporting the connecting ring 45 is formed at a lower portion of the connecting ring 45.

In order to raise the height of the cup guide ring 43, the length of the connection ring 45 or the length of the cup side wall portion 47 is raised by about 3 mm in the upward direction, So that it does not protrude from the upper surface of the guide ring 43.

An OCD spray nozzle 49 for spraying the OCD solution and an IPA spray nozzle 51 for etching the OCD solution at the edge of the wafer 35 are formed on the drain cup device.

The operation of the drain cup thus constructed will be described below.

First, when the wafer 35 having been subjected to the preceding process is transferred to the drain cup device by the robot arm, the spindle chuck 31 is raised so that the transferred wafer 35 is placed on the upper surface of the spindle chuck 31, The vacuum pump is driven so that the suction plate 33 fixes the wafer 35 in order to prevent the wafer 35 from being separated from the upper surface of the spindle chuck 31. [

When the wafer 35 is fixed to the spindle chuck 31 by the chucking plate 33, the spindle chuck 31 is lowered to move the OCD mixed solution to the center of the wafer 35 by using the OCD injection nozzle 49, The OCD solution sprayed to the center of the wafer 35 is uniformly applied to the surface of the wafer by the centrifugal force of the rotating spindle chuck 31 and a part of the solution is sprayed onto the wafer 35 (35) and flows down along the inner wall surface of the cup (37).

When the spindle chuck 31 rotates, the solution that has sprung to the upper surface of the cup guide ring 43 due to the centrifugal force is returned to the upper surface of the cup guide ring by the height of the connecting ring 45 or the cup side wall portion 47 It prevents the solution from splashing onto the upper surface of the cup guide ring by raising it so that it does not protrude.

The solution flowing down through the inner wall surface of the cup 37 is discharged to the first discharge pipe 39 formed at the lower portion of the cup 37. When a predetermined time has elapsed, In order to remove fine dust, since fine dust is generated, the motor formed below the second discharge pipe 41 is driven to discharge the fine dust to the outside.

As described above, since the length of the connecting ring or the side wall of the cup is raised in the upward direction, the solution to be coated on the surface of the cup guide ring is prevented from splashing, thereby preventing contamination of the wafer by fine dust.

Claims (4)

A cup portion which is spaced apart from the spindle chuck by a predetermined distance and encircles the outside of the spindle chuck; a cup formed inside the cup portion to store and discharge the chemical liquid; a cup sidewall portion formed outside the cup; A cup ring fixed to the cup side wall portion and a cup guide ring fixed by the connection ring, the height of the connection ring is raised so that the upper surface of the cup guide ring Thereby preventing contamination of the drain cup. The drain cup apparatus according to claim 1, wherein the height of the connecting ring is raised by about 3 mm. A cup portion which is spaced apart from the spindle chuck by a predetermined distance and encircles the outside of the spindle chuck; a cup formed inside the cup portion to store and discharge the chemical liquid; a cup sidewall portion formed outside the cup; A cup ring fixed to the cup side wall portion and a cup guide ring fixed by the connection ring, the height of the cup side wall portion is raised so that the upper surface of the cup guide ring Thereby preventing contamination of the drain cup. 4. The drain cup apparatus according to claim 3, wherein a height of the cup side wall portion is raised by about 3 mm. ※ Note: It is disclosed by the contents of the first application.