KR980009703U - Semiconductor Wafer Inspection Equipment - Google Patents
Semiconductor Wafer Inspection Equipment Download PDFInfo
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- KR980009703U KR980009703U KR2019960020987U KR19960020987U KR980009703U KR 980009703 U KR980009703 U KR 980009703U KR 2019960020987 U KR2019960020987 U KR 2019960020987U KR 19960020987 U KR19960020987 U KR 19960020987U KR 980009703 U KR980009703 U KR 980009703U
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- 238000007689 inspection Methods 0.000 title claims abstract description 40
- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 238000011179 visual inspection Methods 0.000 claims abstract description 17
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- 238000000386 microscopy Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 230000005856 abnormality Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8803—Visual inspection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
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- G02B21/0016—Technical microscopes, e.g. for inspection or measuring in industrial production processes
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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Abstract
본 고안은 반도체 웨이퍼 검사장치에 관한 것으로, 종래에는 웨이퍼를 검사하기 위하여 육안검사 후 뒤집는 동작을 필수적으로 수행하여야 하므로 검사시간을 절감하는데 한계가 있는 문제점이 있었다. 본 고안 반도체 웨이퍼 검사장치는 투광기의 주변에 하부육안검사수단을 설치하고, 상부대안/대물렌즈의 하부에 하부대안/대물렌즈를 설치하여, 웨이퍼의 뒤집는 동작을 하지 않고 상·하면의 육안검사 및 현미경검사를실시할 수 있도록 함으로서 시간의 절감에 따른 생산성이 향상되는 효과가 있다.The present invention relates to a semiconductor wafer inspection apparatus, and in the related art, it is necessary to perform an inverted operation after visual inspection in order to inspect a wafer, and thus there is a problem in that the inspection time is limited. In the semiconductor wafer inspection apparatus of the present invention, a lower visual inspection means is provided around a light emitter, and a lower alternative / object lens is installed below an upper alternative / object lens, and the upper and lower visual inspection of the upper and lower surfaces is not performed. By allowing microscopy to be performed, there is an effect of improving productivity according to time savings.
Description
제1도는 종래의 반도체 웨이퍼 검사장치의 구성 및 검사동작을 설명하기 위한 것으로, (가)는 육안검사동작, (나)는 현미경검사동작.1 is for explaining the configuration and inspection operation of a conventional semiconductor wafer inspection apparatus, (a) is a visual inspection operation, (b) a microscopic inspection operation.
제2도는 종래 반도체 웨이퍼 검사장치의 동작을 설명하기 위한 플로우차트.2 is a flowchart for explaining the operation of the conventional semiconductor wafer inspection apparatus.
제3도는 본 고안 반도체 웨이퍼 검사장치의 구성을 보인 계통도.Figure 3 is a schematic diagram showing the configuration of the semiconductor wafer inspection apparatus of the present invention.
제4도는 본 고안 반도체 웨이퍼 검사장치의 동작을 설명하기 위한 플로우차트.4 is a flowchart for explaining the operation of the inventive semiconductor wafer inspection apparatus.
제5도는 제3도의 다른 실시예를 보인 개략구성도.5 is a schematic diagram showing another embodiment of FIG.
*도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings
W : 웨치퍼 10 : 투광기 12, 17, 30 : 시시디 카메라W: Wedgeper 10: Floodlight 12, 17, 30: Sisidi camera
13 : 상부대안/대물렌즈 16 : 반사경 18 : 하부대안/대물렌즈13: upper alternative / objective lens 16: reflector 18: lower alternative / objective lens
31 : 케이블31: cable
본 고안은 반도체 웨이퍼 검사장치에 관한 것으로, 특히 웨이퍼를 뒤집지 않고 상·하면을 검사할 수 있도록 하여 시간의 절감에 따른 생산성을 향상시키도록 하는데 적합한 반도체 웨이퍼 검사장치에 관한 것이다.The present invention relates to a semiconductor wafer inspection apparatus, and more particularly to a semiconductor wafer inspection apparatus suitable for enabling to inspect the upper and lower surfaces without flipping the wafer upside down to improve productivity according to time savings.
제1도는 종래 반도체 웨이퍼 검사장치의 구성 및 검사동작을 설명하기 위한 것으로, (가)는 육안검사동작이고, (나)는 현미경검사동작이며, 제2도는 종래 반도체 웨이퍼 검사장치의 동작을 설명하기 위한 플로우차트이다.1 is for explaining the configuration and inspection operation of a conventional semiconductor wafer inspection apparatus, (a) is a visual inspection operation, (b) is a microscopic inspection operation, and FIG. 2 is a view for explaining the operation of the conventional semiconductor wafer inspection apparatus. This is a flowchart.
도시된 바와 같이, 종래 반도체 웨이퍼 검사장치는 웨이퍼(W)의 앞면을 비추기 위한 투광기(ILLUMINATOR)(1)와, 시시디 카메라(CCD CAMERA)(3)가 부착된 상부대안/대물렌즈(4)와, 그 상부대안 /대물렌즈(4)에 케이블(CABLE)(2)로 연결되는 모니터(MONITOR)(5)로 구성되어 있다.As shown in the drawing, the conventional semiconductor wafer inspection apparatus has an upper alternative / objective lens 4 having an illuminator 1 for illuminating the front surface of the wafer W and a CCD camera 3 attached thereto. And a monitor (5) connected to the upper alternative / objective lens (4) by a cable (CABLE) (2).
도면중 미설명 부호 6은 벨트(BELT)이고, 7은 인풋 캐리어 (INPUT CARRIER)이며, 8은 아웃풋 캐리어(OUTPUT CARRIER)이고, 9는 덕타일 암(DUCTILE ARM)이다.In the figure, reference numeral 6 is a belt, 7 is an input carrier, 8 is an output carrier, and 9 is a ductile arm.
상기와 같이 구성되어 있는 종래 반도체 웨이퍼 검사장치를 이용하여 웨이퍼를 검사하는 동작을 제1도의 (가)(나)와 제2도를 참조하여 설명하면 다음과 같다.An operation of inspecting a wafer using a conventional semiconductor wafer inspection apparatus configured as described above will be described with reference to FIGS. 1A and 2B as follows.
먼저, 웨이퍼(W)가 수납되어 있는 인풋 캐리어(7)를 장비의 상면에 올려놓고, 웨이퍼(W)가 검사장비의 안쪽으로 이동하도록 한다. 그런 다음, 장비가 웨이퍼(W)의 플렛 존(FLAT ZONE)을 찾는 동작을 하고, 검사를 위하여 상부대안/대물렌즈(4)의 하부에 위치하고 있는 척(CHUCK)에 웨이퍼(W)를 올려 놓는다. 그런 다음 투광기(1)를 이용하여 이물질 또는 이상 유,무를 육안검사한다. 그런 다음 모니터(5)를 통하여 현미경검사를 실시한다.First, the input carrier 7 containing the wafer W is placed on the upper surface of the equipment, and the wafer W is moved inside the inspection equipment. Then, the equipment operates to find the FLAT ZONE of the wafer W, and the wafer W is placed on the chuck CHUCK which is located under the upper alternative / objective lens 4 for inspection. . Then, visual inspection of the presence or absence of foreign matter or abnormality using the transmitter (1). Then, microscopic examination is carried out through the monitor (5).
상기와 같이 웨이퍼(W)의 앞면 검사를 마친 후에는 덕타일 암(9)를 이용하여 웨이퍼(W)를 뒤집어서 웨이퍼(W)의 뒷면 투광기 검사를 실시한다. 그런 다음, 검사가 끝난 웨이퍼(W)를 아웃풋 캐리어 (8)에 수납하여 검사를 완료한다.After the front surface inspection of the wafer W is completed as described above, the wafer W is turned upside down using the ductile arm 9 to perform the backside light inspection of the wafer W. Then, the inspected wafer W is stored in the output carrier 8 to complete the inspection.
그러나, 상기와 같은 종래 반도체 웨이퍼 검사장치는 웨이퍼 (W)의 뒷면을 검사하기 위하여 뒤집는 동작을 필수적으로 수행하여야 하고, 그로 인하여 시간의 절감에 따른 생산성을 향상시키는데 한계가 있는 문제점이 있었다.However, the conventional semiconductor wafer inspection apparatus as described above is required to perform the flip operation to inspect the back side of the wafer (W), thereby there is a problem that there is a limit to improve the productivity according to the saving of time.
상기와 같은 문제점을 감안하여 안출한 본 고안의 목적은 웨이퍼를 뒤집지 않고 앞면과 뒷면을 검사할 수 있도록 하는데 적합한 반도체 웨이퍼 검사장치를 제공함에 있다.Disclosure of Invention In view of the above problems, an object of the present invention is to provide a semiconductor wafer inspection apparatus suitable for inspecting the front and rear surfaces without inverting the wafer.
상기와 같은 본 고안의 목적을 달성하기 위하여, 투광기를 이용하여 웨이퍼의 육안검사를 하고, 시시디 카메라가 구비된 상부대안/대물렌즈를 이용하여 웨이퍼의 현미경검사를 실시할 수 있도록 구성되어 있는 반도체 웨이퍼 검사장치에 있어서, 상기 투광기의 주변에 설치하여 웨이퍼의 하면을 육안검사하기 위한 하부육안검사수단을 설치하고, 상기 상부대안/대물렌즈의 하부에 설치하여 웨이퍼의 하면을 현미경검사 하기 위한 시시디 카메라가 구비된 하부대안/대물렌즈를 설치하여서 구성된 것을 특징으로 하는 반도체 웨이퍼 검사장치가 제공된다.In order to achieve the object of the present invention as described above, the semiconductor is configured to perform a visual inspection of the wafer using a light-transmitter, and to perform a microscopic examination of the wafer using an upper alternative / objective lens equipped with a CD camera. In the wafer inspection apparatus, a bottom visual inspection means for visual inspection of the lower surface of the wafer is provided in the vicinity of the light emitter, and a CD for microscopic examination of the lower surface of the wafer is provided below the upper alternative / objective lens. There is provided a semiconductor wafer inspection apparatus, which is constructed by installing a lower alternative / objective lens equipped with a camera.
이하, 상기와 같이 구성되어 있는 본 고안 반도체 웨이퍼 검사장치를 첨부된 도면의 실시예를 참고하여 보다 상세히 설명하면 다음과 같다.Hereinafter, with reference to the embodiment of the accompanying drawings, the subject innovation semiconductor wafer inspection apparatus constructed as described above in detail as follows.
제3도는 본 고안 반도체 웨이퍼 검사장치의 구성을 보인 계통도이고, 제4도는 본 고안 반도체 웨이퍼 검사장치의 동작을 설명하기 위한 플로우차트이다.3 is a system diagram showing the structure of the semiconductor wafer inspection device of the present invention, and FIG. 4 is a flowchart for explaining the operation of the semiconductor wafer inspection device of the present invention.
도시된 바와 같이, 본 고안 반도체 웨이퍼 검사장치는 웨이퍼 (W)의 앞면을 비추기 위한 투광기(10)와 시시디 카메라(12)가 부착된 상부대안/대물렌즈(13)와, 그 상부대안/대물렌즈(13)에 케이블(14)로 연결되는 모니터(15)로 구성되어 있다.As shown, the inventive semiconductor wafer inspection apparatus includes an upper alternative / objective lens 13 to which a light projector 10 and a CD camera 12 are attached to illuminate the front surface of the wafer W, and an upper alternative / object thereof. It consists of the monitor 15 connected to the lens 13 by the cable 14.
그리고, 상기 투광기(10)의 근접한 거리에 웨이퍼(W)의 하면을 비추기 위한 반사경(16)이 설치되고, 상기 상부대안/대물렌즈(13)의 하부에는 웨이퍼(W)의 하면을 현미경 검사하기 위한 시시디 카메라 (17)가 구비된 하부대안/대물렌즈(18)가 설치된다.In addition, a reflecting mirror 16 for illuminating the lower surface of the wafer W is provided at a distance between the light emitter 10 and a lower surface of the upper alternative / objective lens 13 for microscopic examination of the lower surface of the wafer W. A lower alternative / objective lens 18 provided with a CD camera 17 is installed.
또한, 상기 시시디 카메라(17)는 상기 모니터(15)에 케이블 (19)이 연결되어, 상기 상부대안/대물렌즈(13)와 하부대안/대물렌즈 (18)를 모니터(15)로 동시에 검사할 수 있도록 구성된다.In addition, the CD camera 17 has a cable 19 connected to the monitor 15, and simultaneously inspects the upper alternative / object lens 13 and the lower alternative / object lens 18 with the monitor 15. Configured to do so.
도면중 미설명부호 20은 인풋 캐리어이고, 21은 아웃풋 캐리어이다.In the figure, reference numeral 20 denotes an input carrier, and 21 denotes an output carrier.
상기와 같이 구성되어 있는 본 고안 반도체 웨이퍼 검사장치를 이용하여 웨이퍼를 검사하는 동작을 제3도와 제4도를 참고하여 설명하면 다음과 같다.Referring to FIG. 3 and FIG. 4, an operation of inspecting a wafer using the inventive semiconductor wafer inspection apparatus configured as described above is as follows.
웨이퍼 인풋 인덱스(미도시)에 웨이퍼(W)가 수납된 인풋 캐리어 (20)를 올려놓고, 웨이퍼(W)가 장비의 안쪽으로 이동하도록 한다. 그런 다음 장비가 웨이퍼(W)의 플랫 존을 찾는 동작을 하여 정열하고, 웨이퍼(W) 검사를 위하여 상부대안/대물렌즈(13)의 하부에 위치한 척(미도시)위헤 웨이퍼(W)를 올려 놓는다.The input carrier 20 containing the wafer W is placed on the wafer input index (not shown), and the wafer W is moved inside the equipment. Then, the equipment moves to find the flat zone of the wafer W and arranges it. Then, the wafer W is placed on the chuck (not shown) located below the upper alternative / objective lens 13 for the wafer W inspection. Release.
그런 다음, 투광기(10)를 이용하여 전면을 육안검사하고, 반사경(16)을 이용하여 웨이퍼(W)의 화면을 육안검사한다.Then, the entire surface of the wafer W is visually inspected using the light projector 10 and the screen of the wafer W is visually inspected using the reflector 16.
이와 같이, 육안검사가 끝나면 상부대안/대물렌즈(13)와 하부대안/대물렌즈(18)에 연결된 모니터(15)를 통하여 웨이퍼(W) 상·하면의 현미경검사를 실시한다. 그런 다음, 검사가 완료된 웨이퍼(W)는 아웃풋 캐리어(21)로 이동하여 모든 검사동작을 완료하는 것이다.As described above, when the visual inspection is completed, the microscopic examination of the upper and lower surfaces of the wafer W is performed through the monitor 15 connected to the upper alternative / object lens 13 and the lower alternative / object lens 18. Then, the inspected wafer W moves to the output carrier 21 to complete all inspection operations.
제5도는 제3도의 다른 실시예를 보인 개략구성도로서, 상기 투광기(10)의 하부에 시시디 카메라(30)을 설치하고, 그 시시디 카메라 (30)와 상기 모니터(15)를 케이블(31)로 연결하여 웨이퍼(W)의 하면을 검사할 수도 있다.FIG. 5 is a schematic configuration diagram showing another embodiment of FIG. 3, in which a CD camera 30 is installed below the floodlight 10, and the CD camera 30 and the monitor 15 are connected to cables (FIG. 31), the lower surface of the wafer W may be inspected.
이상에서 상세히 설명한 바와 같이 본 고안 반도체 웨이퍼 검사장치는 투광기의 주변에 하부육안검사수단을 설치하고, 상부대안/대물렌즈의 하부에 하부대안/대물렌즈를 설치하여, 웨이퍼의 뒤집는 동작을 하지 않고 상·하면의 육안검사 및 현미경검사를 실시할 수 있도록 함으로서 시간의 절감에 따른 생산성이 향상되는 효과가 있다.As described in detail above, the inventive semiconductor wafer inspection apparatus includes a lower visual inspection means around a light emitter and a lower alternative / object lens below an upper alternative / object lens, so that the wafer is not flipped over. · By making it possible to perform visual inspection and microscopic examination of the lower surface, there is an effect of improving productivity with time savings.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960020987U KR200156139Y1 (en) | 1996-07-16 | 1996-07-16 | Semiconductor wafer inspecting apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960020987U KR200156139Y1 (en) | 1996-07-16 | 1996-07-16 | Semiconductor wafer inspecting apparatus |
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| Publication Number | Publication Date |
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| KR980009703U true KR980009703U (en) | 1998-04-30 |
| KR200156139Y1 KR200156139Y1 (en) | 1999-10-01 |
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| KR2019960020987U KR200156139Y1 (en) | 1996-07-16 | 1996-07-16 | Semiconductor wafer inspecting apparatus |
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| KR101222714B1 (en) | 2011-11-07 | 2013-01-15 | 삼성전기주식회사 | Inspection jig and inspection system using the same |
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