KR980009658U - Hemispherical filter for semiconductor clean room - Google Patents
Hemispherical filter for semiconductor clean room Download PDFInfo
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- KR980009658U KR980009658U KR2019960020767U KR19960020767U KR980009658U KR 980009658 U KR980009658 U KR 980009658U KR 2019960020767 U KR2019960020767 U KR 2019960020767U KR 19960020767 U KR19960020767 U KR 19960020767U KR 980009658 U KR980009658 U KR 980009658U
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- clean room
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 9
- 238000001914 filtration Methods 0.000 claims abstract description 7
- 239000011148 porous material Substances 0.000 claims description 2
- 239000000428 dust Substances 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
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- 238000009825 accumulation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000013100 final test Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
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- 230000035515 penetration Effects 0.000 description 1
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- 230000002265 prevention Effects 0.000 description 1
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- 239000000779 smoke Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
- F24F3/167—Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2279/00—Filters adapted for separating dispersed particles from gases or vapours specially modified for specific uses
- B01D2279/50—Filters adapted for separating dispersed particles from gases or vapours specially modified for specific uses for air conditioning
- B01D2279/51—Filters adapted for separating dispersed particles from gases or vapours specially modified for specific uses for air conditioning in clean rooms, e.g. production facilities for electronic devices, laboratories
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Abstract
본 고안은 난류방식(Conventional type)의 반도체 청정실(1)에서 사용하기에 적절한 반구형 필터(4)에 관한 것이다.The present invention relates to a hemispherical filter 4 suitable for use in a semiconductor clean room 1 of a turbulent type.
본 고안은 종래 평면형의 필터(4)에 있어서, 필터(4)를 반구형으로 형성시키고, 그 외면을 무정전지지층(5)으로 지지하여 구성되어지며, 이 때의 필터(4)는 특히 바람직하게 청정실(1)용의 헤파필터 (HEPA Filter) 또는 울파필터(ULPA Filter) 등을 포함한 공기여과용의 필터(4)가 사용되어질 수 있다.The present invention is constructed in the conventional planar filter 4, in which the filter 4 is formed in a hemispherical shape, and the outer surface thereof is supported by the amorphous battery layer 5, and the filter 4 at this time is particularly preferably in a clean room. An air filtration filter 4 including a HEPA filter or ULPA filter for (1) may be used.
따라서, 종래의 평면형 필터(4)에 비하면 입구면적이 동일한 경우에도 여과면적이 최대로 57% 정도로 넓어지기 때문에 보다 많은 풍량을 공급할 수 있도록 하며, 또한 필터(4) 자체의 궤환수가 증가되어 먼지제거효율을 증대시킬수 있도록 하며, 또한, 기류의 흐름을 보다 균등하게 분산시키며, 그에 따라 기계설비(3) 등에 따른 온도구배를 최소화하는 효과를 제공하는 효과가 있다.Therefore, even when the inlet area is the same as the conventional planar filter 4, the filtration area is widened to a maximum of about 57%, so that more air volume can be supplied, and the return water of the filter 4 itself increases to remove dust. It is possible to increase the efficiency, and also to distribute the flow of air more evenly, thereby providing an effect of minimizing the temperature gradient according to the mechanical equipment (3).
Description
제1도는 반도체 청정실용의 종래의 평면형 필터가 설치되어진 청정실의 배치상태에서의 기류의 흐름 및 온도구배를 도식적으로 나타낸 구성도이다.FIG. 1 is a schematic diagram showing the flow of air and a temperature gradient in an arrangement state of a clean room in which a conventional planar filter for a semiconductor clean room is installed.
제2도는 본 고안에 따른 반구형 필터를 상세하게 도시한 사시도이다.Figure 2 is a perspective view showing in detail the hemispherical filter according to the present invention.
제3도는 반도체 청정실용의 본 고안에 따른 반구형 필터가 설치되어진 청정실의 배치상태에서의 기류의 흐름 및 온도구배를 도식적으로 나타낸 구성도이다.Figure 3 is a schematic diagram showing the flow and temperature gradient of the air flow in the arrangement state of the clean room in which the hemispherical filter according to the present invention for the semiconductor clean room is installed.
*도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings
1 : 청정실 2 : 천장 3 : 기계설비1: clean room 2: ceiling 3: hardware
4 : 필터 5 : 무정전지지층4 filter 5 amorphous battery layer
본 고안은 반도체 청정실용의 필터에 관한 것으로서, 보다 상세하게는 난류방식(Conventional type)의 청정실에서 사용하기에 적절한 반구형 필터에 관한 것이다.The present invention relates to a filter for a semiconductor clean room, and more particularly, to a hemispherical filter suitable for use in a clean room of a conventional type.
청정실(Clean Room)이란 일정한 목적을 위하여 제진시키기 위한 공간으로서 그 공간의 공기 중에 부유하는 먼지(부유입자)를 원하는 숫자 이하로 제어하여 청정실내에서 행하여지는 작업대상체의 내, 외부에 먼지가 다다르지 못하도록 하며, 동시에 온도, 습도 및 실내의 기압 등의 공기조화와 밝기(조도) 및 특별한 목적에 따라 소음, 진동 등의 방지까지도 수행되어져서 작업대상체에 가해지는 공정의 최적화를 달성하도록 한다.A clean room is a space for dust removal for a certain purpose. It controls the dust (floating particles) floating in the air of the space below a desired number so that dust does not reach inside and outside of the work object performed in the clean room. At the same time, air conditioning such as temperature, humidity, and atmospheric pressure of the room, brightness (illuminance), and prevention of noise and vibration are also performed according to a specific purpose, so as to achieve an optimization of the process applied to the workpiece.
특히, 반도체의 생산라인의 경우에는 패턴의 형성이나 레티클의 제작등의 기본설계에서부터 웨이퍼의 제조공정, 검사공정, 어셈블리/팩케이지(Assembly/Package)공정, 최종시험공정, 품질검사공정 등을 거치게 되며, 이러한 공정들 중 특히 웨이퍼의 제조공정은 확산 - 노광, 현상 - 에칭 - 확산 등의 공정들을 반복하여 수행하여야 하기 때문에 매우 중요하며, 전반적으로 반도체의 수율의 증대 및 제품의 정밀도나 신뢰도의 향상 등의 면에서 오염되지 않아야 함은 당연한 것이다.Particularly, in the case of semiconductor production line, the process from basic design such as pattern formation or reticle production to wafer manufacturing process, inspection process, assembly / package process, final test process, quality inspection process, etc. Among these processes, in particular, the wafer manufacturing process is very important because the processes such as diffusion-exposure, development-etching-diffusion, etc. must be repeatedly performed. Overall, the yield of semiconductors and the accuracy or reliability of products are improved. Naturally, it should not be contaminated in terms of back.
대기에는 광화학적 연기와 함께 많은 양의 입자와 수분증기를 가지고 있으며, 이들을 여과하여 청정한 프레시에어(FA; Fresh Air)를 공급하여 청정실을 형성시킬 필요가 있는 것이다.The atmosphere has a large amount of particles and water vapor along with photochemical smoke, and it is necessary to filter them to supply clean fresh air (FA) to form a clean room.
청정실은 기류방식에 따라 수직층류방식(Down flow type), 수평층류방식(Cross flow type) 및 난류방식(Conventional type)으로 대별되어질 수 있다.The clean room can be roughly classified into a down flow type, a cross flow type, and a turbulent type according to the airflow method.
상기에서 수직층류방식은 프레시에어의 대부분이 천장으로부터 분출되어져 마루, 장지문 및 아래부분 등을 통하여 흡입되어질 수 있도록 구성되어져서 천장으로부터 바닥으로 수직하향하는 기류를 형성하게 되며, 효과가 완전하고, 작업인원이나 작업상태 등에 좌우되는 일이 적으며, 운전개시 후 바로 정상상태가 되며, 분진의 퇴적이나 재부유 등의 현상의 발생이 극히 적으며, 관리가 용이하다는 장점을 가지는 반면에, 천장부의 덕트페이스에서(Duct Face)의 조명 등에 주의하여야 하며, 필터의 교환이 어렵고, 설비비가 많이 들며, 청정실의 확장이 곤란하다는 단점을 가지고 있다.In the vertical laminar flow method, most of the fresh air is ejected from the ceiling to be sucked through the floor, the jangjimun and the lower part to form an air flow vertically downward from the ceiling to the floor, the effect is complete, work There is little dependence on the number of people and working conditions, and it is in a normal state immediately after the start of operation, the occurrence of dust accumulation and resuspension is extremely small, and it is easy to manage. Attention should be paid to the lighting of the face, it is difficult to replace the filter, the equipment cost is high, and the expansion of the clean room is difficult.
상기에서 수평층류방식은 프레시에어의 대부분이 측벽으로부터 분출되어 대항되는 타측벽과 천장 등으로 흡입되어질 수 있도록 구성되어져서 지면에 대하여 수평으로 기류가 형성되어지며, 운전개시후 곧바로 정상상태가 되며, 구조가 간편하다는 장점을 가지는 반면에, 상류의 영향이 하류에 미칠 수 있으며, 사람이나 기계설비의 배치에 주의를 기울어야 하고, 설비비도 상당히 고가이며, 방의 확장이 곤란하다는 단점을 가지고 있다.In the above, the horizontal laminar flow method is configured to be sucked by the other side wall and ceiling facing most of the fresh air is ejected from the side wall, so that the air flow is formed horizontally with respect to the ground, and the normal state immediately after the start of operation, While the structure has the advantage of simplicity, the upstream effect can be downstream, pay attention to the arrangement of people or machinery, equipment costs are quite expensive, and room expansion is difficult.
또한, 난류방식은 대류방식이라고도 불리우며, 프에이시어가 천장에 설치되는 필터를 통하여 분출되어져서 마루면에 가까운 곳에서 흡입되어지도록 하는 구성을 갖는 것이 바람직하며, 구조가 간편하고, 방의 확장이 비교적 용이하며, 별도의 클린벤치(Clean Bench)등을 이용하면 저렴한 비용으로 고청정도를 확보할 수 있다는 장점을 가지는 반면에, 기류가 흩어지기 때문에 먼지 등의 오염입자가 실내 전체를 순환할 우려가 있으며, 정상상태가 될 때까지 시간이 많이 걸리며, 사람이나 기계설비의 배치 등에 주의하여야 하는 단점이 있다.In addition, the turbulence method is also called a convection method, it is preferable to have a configuration such that the facier is ejected through a filter installed on the ceiling to be sucked in close to the floor surface, the structure is simple, and the expansion of the room is relatively It is easy to use, and the use of a separate clean bench has the advantage of ensuring high cleanliness at a low cost. On the other hand, since air flows are scattered, contaminants such as dust may circulate throughout the room. It takes a long time to reach a steady state, and there is a drawback to pay attention to the arrangement of people or machinery.
특히, 난류방식의 경우에서는 상기한 수직층류방식이나 수평층류방식에 비하여 필터를 통하여 공급되는 공기량이 적기 때문에 전반적인 공조에 어려움을 초래하며, 또한 기계설비 등의 배치에 있어서도, 제 1 도에 도식화되어 나타난 바와 같이, 종래의 청정실용의 평면형 필터(4)를 설치한 청정실(1)에서의 기류의 흐름 및 온도구배를 살펴보면, 기계설비(3)의 배치위치에 따라 상당한 온도구배가 발생되며, 그에 따라 습도의 편차도 심화되어지며, 더욱이 작업자의 위치 등으로 인한 온도상승 등으로 작업조건의 불균형 및 그에 따른 악영향을 초래하게 되는 문제점이 있었음을 알 수 있다.Particularly, in the turbulent flow method, the amount of air supplied through the filter is smaller than that of the vertical laminar flow method and the horizontal laminar flow method, resulting in difficulty in overall air conditioning, and also illustrated in FIG. As shown, when looking at the flow and temperature gradient of the air flow in the clean room (1) provided with a planar filter (4) for a conventional clean room, a significant temperature gradient occurs depending on the arrangement position of the mechanical equipment (3), Therefore, the variation in humidity is also intensified, and furthermore, it can be seen that there was a problem that caused an imbalance of working conditions and its adverse effect due to a temperature rise due to the location of the worker.
본 고안의 목적은, 동일한 필터설치 공간에 설치되어져도 보다 많은 양의 프레시에어를 공급할 수 있도록 하는 청정실용의 반구형 필터를 제공하는 데 있다.An object of the present invention is to provide a hemispherical filter for a clean room that can supply a larger amount of fresh air even if installed in the same filter installation space.
본 고안의 다른 목적은, 하향분사되어지는 프레시에어의 기류를 효과적으로 분산시켜 기계설비의 배열에 따른 온도구배를 최소화할 수 있도록 하는 청정실용의 반구형 필터를 제공하는 데 있다.Another object of the present invention is to provide a hemispherical filter for a clean room that can effectively disperse the airflow of the fresh air to be sprayed downward to minimize the temperature gradient according to the arrangement of the mechanical equipment.
상기 목적을 달성하기 위한 본 고안에 따른 청정실용의 반구형 필터는, 종래의 평면형의 필터를 반구형으로 성형시켜서 이루어진다.A hemispherical filter for a clean room according to the present invention for achieving the above object is formed by molding a conventional flat filter into a hemispherical shape.
상기 청정실용의 필터는 헤파필터(HEPA Filter)가 될 수 있다.The filter for the clean room may be a HEPA filter.
특히, 본 고안에 따른 청정실용의 반구형 필터의 외면에는 풍압으로 인한 처짐현상을 방지하기 위한 무정전지지층이 취부되어질 수 있다.In particular, the outer surface of the hemispherical filter for a clean room according to the present invention may be attached to the amorphous battery layer to prevent the deflection due to wind pressure.
이하, 본 고안의 구체적인 실시예를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, with reference to the accompanying drawings, a specific embodiment of the present invention will be described in detail.
제 2 도에 도시한 바와 같이, 본 고안에 따른 청정실용의 반구형 필터는 종래 평면형의 필터(4)에 있어서, 필터(4)를 반구형으로 형성시키고, 그 외면을 무정전지지층(5)으로 지지하여 이루어진다.As shown in FIG. 2, the hemispherical filter for a clean room according to the present invention is a filter 4 having a hemispherical shape in the conventional flat filter 4, and the outer surface thereof is supported by the amorphous battery base layer 5 Is done.
상기에서 필터(4)라 함은 반도체 제조공정에서의 방진을 위한 청정실(1)에 사용되어지는 통상의 에어필터로서, 특히 헤파필터 와(HEAP Filter; High Effciency Particulate Air filter) 울파필터 (ULPA Filter; Ultra Low Penetration Air filter) 등을 포함한 공기여과용의 필터가 포함되어질수 있다.The filter 4 is a conventional air filter used in the clean room 1 for dustproofing in a semiconductor manufacturing process. In particular, a HEPA filter and a high efficiency particulate air filter are ULPA filters. Filters for air filtration, including Ultra Low Penetration Air filters.
본 고안에 따라 반구형으로 성형되어지는 필터(4)에서 반구형이라는 구조상의 특징은 곧 프레시에어가 필터(4)의 이면으로 공급되어 필터(4)를 통하여 필터(4)의 정면으로 분산되어짐에 있어 분산되어지는 프레시에어의 기류를 반구형의 필터(4) 자체를 중심으로 하여 방사상으로 분산시키는 역할을 하게 되며, 따라서 일반적인 난류방식의 청정실(1)에서 기계설비(3)가 불균일하게 분포되어 배치되어지는 경우에도 필터(4)에서부터 분산되어 하방으로 흐르는 기류의 형성을 가능하게 함으로써 기계설비(3)의 배치에 따른 온도구배를 최소화할 수 있도록 한다는 점에 있는 것이다. 또한, 입구면적(프레시어가 공급되어지는 면적 또는 청정실(1)의 천장(2)에 형성되어지는 필터(4)부착면적)이 동일한 경우에도 평면형에 비하여 여과면적이 최대로 57% 정도로 넓어지게 된다.According to the present invention, the structural feature of the hemispherical shape in the filter 4 formed in the hemispherical shape is that the fresh air is supplied to the rear surface of the filter 4 and distributed to the front of the filter 4 through the filter 4. The airflow of the fresh air to be dispersed is distributed radially around the hemispherical filter 4 itself. Therefore, in the general turbulent type clean room 1, the mechanical equipment 3 is distributed unevenly. Even if it loses, it is possible to minimize the temperature gradient according to the arrangement of the machine 3 by enabling the formation of air flow dispersed downward from the filter 4. In addition, even when the inlet area (the area where the fresher is supplied or the filter 4 attached area formed on the ceiling 2 of the clean room 1) is the same, the filtration area becomes wider at a maximum of 57% compared to the flat type. .
또한, 무정전지지층(5)은 무정전실크 등과 같이 가요성을 가지며, 풍압과 같은 기계적 압력에 대하여 내성을 가지며, 금속박막처리나 금속산화막 처리 또는 액침처리 등의 통상의 방법에 의하여 마찰 등에 따른 대전에 의하여 정전기를 발생시키지 아니하는 것이 사용되어질 수 있다. 정전기의 발생은 대전된 표면에서의 먼지의 응집을 유발하여 응집된 먼지덩어리가 청정실(1)내를 재부유나 재비산 등을 통하여 순환되어질 수 있는 문제점을 일으키기 때문에, 무정전 재질의 사용이 바람직하다.In addition, the uninterruptible battery layer 5 has flexibility, such as an uninterruptible silk, and is resistant to mechanical pressure such as wind pressure, and is resistant to charging due to friction by conventional methods such as metal thin film treatment, metal oxide film treatment or liquid immersion treatment. By means of generating no static electricity can be used. The use of an uninterruptible material is preferable because the generation of static electricity causes agglomeration of dust on the charged surface and causes a problem that the agglomerated dust mass can circulate through the resuspension or re-scattering in the clean room 1. .
상기 무정전지지층(5)은 상기 반구형의 필터(4)의 표면에 취부되어 상기 필터(4)를 기계적으로 지지하여 주는 역할을 한다.The amorphous battery base layer 5 is mounted on the surface of the hemispherical filter 4 to serve to mechanically support the filter 4.
상기 무정전지지층(5)은 그에 지지되어지는 필터(4)가 공기의 흐름을 여과하면서 통과시키는 특성을 갖기 때문에 당연히 공기흐름에 대하여 투과성을 가질 수 있도록 다수의 미세한 기공을 가져야 한다.Since the amorphous battery base layer 5 has a characteristic of passing the filter 4 supported therethrough while filtering the air flow, it should naturally have a plurality of fine pores so as to have permeability to the air flow.
본 고안에 따른 청정실용의 반구형 필터는 종래의 평면형 필터(4)에 비하여 입구면적이 동일한 경우에도 평면형에 비하여 여과면적이 최대로 57% 정도로 넓어지기 때문에 보다 많은 풍량을 공급할 수 있도록 하며, 또한 필터(4) 자체의 궤환수가 증가되어 먼지제거효율을 증대시킬 수 있는 효과를 제공한다.The hemispherical filter for a clean room according to the present invention can supply more air volume because the filtration area is wider to a maximum of 57% compared to the flat type even when the inlet area is the same as that of the conventional flat filter (4). (4) It increases its return water, which provides the effect of increasing dust removal efficiency.
또한, 제3도에 도식화되어 나타난 바와 같이, 본 고안에 따른 청정실용의 반구형 필터(4)를 설치한 청정실(1)에서의 기류의 흐름 및 온도구배를 살펴보면, 기류의 흐름을 보다 균등하게 분산시키며, 그에 따라 기계설비(3)등에 따른 온도구배를 최소화하는 효과를 제공한다.In addition, as shown in FIG. 3, the flow and temperature gradient of the airflow in the clean room 1 in which the hemispherical filter 4 for the clean room is installed according to the present invention is more uniformly distributed. Therefore, it provides an effect of minimizing the temperature gradient according to the mechanical equipment (3).
이상에서 본 고안은 기재된 구체예에 대해서만 상세히 설명되었지만 본 고안의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 실용신안등록청구범위에 속함은 당연한 것이다.Although the present invention has been described in detail only with respect to the embodiments described, it will be apparent to those skilled in the art that various modifications and changes are possible within the technical spirit of the present invention, and such modifications and modifications belong to the appended utility model claims. will be.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960020767U KR200151457Y1 (en) | 1996-07-13 | 1996-07-13 | Semicircle-type filter for semiconductor clean room |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960020767U KR200151457Y1 (en) | 1996-07-13 | 1996-07-13 | Semicircle-type filter for semiconductor clean room |
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| Publication Number | Publication Date |
|---|---|
| KR980009658U true KR980009658U (en) | 1998-04-30 |
| KR200151457Y1 KR200151457Y1 (en) | 1999-07-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR2019960020767U KR200151457Y1 (en) | 1996-07-13 | 1996-07-13 | Semicircle-type filter for semiconductor clean room |
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| KR (1) | KR200151457Y1 (en) |
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1996
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| KR200151457Y1 (en) | 1999-07-15 |
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