KR980009510A - Method of forming hard film on various metal surfaces - Google Patents

Method of forming hard film on various metal surfaces

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Publication number
KR980009510A
KR980009510A KR1019960027774A KR19960027774A KR980009510A KR 980009510 A KR980009510 A KR 980009510A KR 1019960027774 A KR1019960027774 A KR 1019960027774A KR 19960027774 A KR19960027774 A KR 19960027774A KR 980009510 A KR980009510 A KR 980009510A
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chromium
film
coating
substrate
forming
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KR1019960027774A
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Korean (ko)
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KR100295611B1 (en
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정재인
문종호
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김종진
포항종합제철 주식회사
신창식
재단법인 산업과학기술연구소
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Priority to KR1019960027774A priority Critical patent/KR100295611B1/en
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/548Controlling the composition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641Nitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

본 발명은 공구나 기계류 그리고 금형제품과 같은 물질의 수명향상을 위하여 모재에 반응성 이온플레이팅 방법으로 질화크롬 피막을 형성시키되, 질화크롬 피막의 화학조성중 질소성분이 각각 다른 세 개의 층으로 이루어지도록 하여서 된 각종 금속류 표면의 경질피막 형성방법에 관한 것으로 내마모성 향상을 위해 단일 금속인 크롬만으로 이루어진 통상의 경질피막에 있어서, 밀착성 확보를 위해 금속표면에 크롬피막층을 형성하는 공정과, 상기 Cr2N 피막층 위에 최종적으로 CrN만으로 이루어진 질화크롬박막을 형성하는 공정으로 이루어진 것이다.In order to improve the lifetime of materials such as tools, machinery and mold products, a chromium nitride coating is formed on a base material by a reactive ion plating method, wherein nitrogen components in the chemical composition of the chromium nitride coating are made up of three different layers the in the usual hard film of comprising only chromium is a single metal for abrasion resistance improvement relates to forming the hard coating process of various metal surface, and the step of forming a chromium layer on the metal surface to secure adhesion, on the Cr 2 N coating layer And a step of finally forming a chromium nitride film of CrN only.

Description

각종 금속류 표면의 경질피막 형성방법Method of forming hard film on various metal surfaces

제1도는 발명을 설명하기 위한 경질피막 형성장치의 개략도.FIG. 1 is a schematic view of a hard film forming apparatus for explaining the invention; FIG.

* 도면의 주요부분에 대한 부호의 설명DESCRIPTION OF THE REFERENCE NUMERALS

1 : 진공실 2 : 증발원1: vacuum chamber 2: evaporation source

3 : 이온화 전극 4 : 필라멘트3: ionization electrode 4: filament

5 : 셔터 6 : 기판5: shutter 6: substrate

7 : 기판홀더 8 : 기판가열장치7: substrate holder 8: substrate heating device

9 : 가스도입구9: Gas inlet

본 발명은 공구나 기계류 그리고 금형제품과 같은 물질의 수명향상을 위하여 모재에 반응성 이온플레이팅 방법으로 질화크롬 피막을 형성시키되, 질화크롬 피막의 화학조성중 질소성분이 각각 다른 세 개의 층으로 이루어지도록 하여서 된 것이다.In order to improve the lifetime of materials such as tools, machinery and mold products, a chromium nitride coating is formed on a base material by a reactive ion plating method, wherein nitrogen components in the chemical composition of the chromium nitride coating are made up of three different layers .

일반적으로 질화크롬 피막은 내마모성이 우수하여 이를 티타늄합금이나 각종 공구류등의 수명향상 및 품질향상에 기여할 것으로 기대되어 많은 연구가 진행되어 왔다.In general, the chromium nitride coating has excellent abrasion resistance and is expected to contribute to the improvement of the service life and quality of the titanium alloy and various tools, and so much research has been conducted.

그 중에서도 특히 베어링에는 질화크롬피막을 코팅하여 실용화된 사례가 많이 있다. 질화크롬을 피막으로 형성할 경우 두 가지 상(CrN, CN2N)이 존재하는데 통상 질소분위기에서 제조를 하게 되면 이들 두 개의 혼합상이 존재하게 된다.In particular, there are many cases in which bearings are coated with a chromium nitride coating. When chromium nitride is formed as a coating, there are two phases (CrN and CN 2 N). When two or more phases are produced in a nitrogen atmosphere, these two phases are present.

내마모성 관점에서 보면 CrN만으로 이루어진 피막의 경우가 훨씬 우수한 것으로 알려져 있다. 그러나 CrN만으로 이루어진 피막을 형성하는데는 매우 까다로운 공정조건을 요구하게 되며 실제 피막을 분석해보면 두가지 상이 혼합되어 있는 경우가 대부분이다.From the viewpoint of abrasion resistance, it is known that the coating made of CrN alone is far superior. However, in order to form CrN-only film, it requires very complicated process conditions. When analyzing actual film, most of the two phases are mixed.

이는 동일조건에서 피막이 이루어지며 화학적으로 CrN이 안전하기 때문에 CrN은 만들기 위해 더 많은 가스를 주입한다 하더라도 CrN으로 되기전에 먼저 피막이 손상을 입어 사용할 수 없게 되는 경우가 많다.This is because the film is coated under the same conditions and because CrN is chemically safe, even if more gas is injected to make CrN, the film is damaged before it becomes CrN, and it is often not usable.

따라서 일정량 이상의 질소가스를 사용할 수 없는 한계에 도달하게 되고 따라서 필연적으로 Cr2N상이 존재하게 된다.Therefore, the limit of the use of a certain amount of nitrogen gas can not be reached, and therefore Cr 2 N phase is inevitably present.

본 발명자는 질화크롬 피막의 형성시 이온화율을 높이고 그 외에 다양한 증착조건을 변화시키면 CrN만으로 이루어진 질화크롬 피막을 형성할 수 있음을 확인하고 이를 티타늄 합금에 적용한 바 있다(대한민국 특허출원 제95-55020호). 그러나 그 경우에는 질화크롬을 받치고 있는 경도가 높은 층이 TiN, TiC와 같은 다른물질로 이루어지고 있기 때문에 필연적으로 공정이 보다 복잡해지게 되었다.The inventors of the present invention have confirmed that it is possible to form a chromium nitride film composed only of CrN by increasing the ionization rate and changing various deposition conditions in forming the chromium nitride film (Japanese Patent Application No. 95-55020 number). In this case, however, the hardness layer supporting the chromium nitride is made of other materials such as TiN and TiC, which inevitably complicates the process.

본 발명은 이와 같은 문제점을 해결하기 위해 발명한 것으로 Cr2N상만으로 이루어진 피막이 CrN보다 경도가 높음에 착안하여 단일 금속인 크롬만을 사용하되, 불활성가스와 질소가스를 사용하여 계면층에는 금속크롬을 증착하여 밀착성을 향상시키고, 중간층에는 경도가 높은 Cr2N층을, 그리고 마지막 표면층에는 CrN만으로 이루어진 피막을 형성시켜 각종 부품의 내마모성과 성능을 향상시킴에 그 목적이 있는 것이다.The invention In this connection that invention to address such issues film consisting of only the Cr 2 N hardness is paying attention to higher than CrN, but using only a single metal is chromium, the chromium metal, the interface layer using an inert gas as nitrogen gas The present invention is intended to improve the wear resistance and performance of various parts by depositing a Cr 2 N layer having a high hardness in the intermediate layer and a CrN film only in the final surface layer.

각종 기계나 공구류의 내마모성을 개선하기 위한 방법으로는 몰리브덴용사, 산화처리, 질화처리, 물리 또는 화학증착에 의한 경질피막의 코팅 등이 알려져 있다.As a method for improving the abrasion resistance of various machines and tools, it is known to spray molybdenum, oxidation treatment, nitriding treatment, hard coating by physical or chemical vapor deposition, and the like.

이들중에서 물리증착을 이용하는 경우 주로 반응성 이온플레이팅과 반응성 스퍼터링 방법이 주종을 이루고 있다.Among them, reactive ion plating and reactive sputtering are mainly used when physical vapor deposition is used.

반응성 이온플레이팅은 금속을 증발시키면서 동시에 이온화시켜 주입되는 가스와 반응시켜 기판에 피복시키는 방법이며, 반응성 스퍼터링은 볼활성가스를 이용하여 판상의 금속에서 물질을 떼어낸 후 가스와 반응시켜 기판에 피복시키는 방법이다.Reactive ion plating is a method of evaporating a metal while simultaneously ionizing it to react with a gas to be injected and coating the substrate. Reactive sputtering is a method in which a ball active material is used to remove a substance from a metal plate, .

피복물질에는 질화티타늄과 같은 티타늄 화합물이 주종을 이루며, 그 외에 천이금속 화합물이 많이 이용되고 있다. 지금까지 이와 같은 방법을 이용하여 단층의 경질피막을 제조하여 내마모성 향상을 기하여 왔다.Titanium compounds such as titanium nitride are mainly used as coating materials, and transition metal compounds are used in many cases. Up to now, a hard coating of a single layer has been produced using such a method to improve wear resistance.

그러나 금속의 기판상에 바로 경질피막을 제조할 경우에는 피막의 스트레스 등에 의해 밀착성이 떨어지고 따라서 전체적으로 특성이 저하되는 현상이 나타난다.However, when a hard film is directly formed on a substrate of a metal, the adhesion is deteriorated due to the stress of the coating or the like, and thus, the characteristics are deteriorated as a whole.

또한, 기판의 재질에 따라 내마모성이나 밀착성등의 제반 특성이 달라지므로 기판이 무르거나 내마모성이 피막재질과 현저히 달라질 경우 내마모성 피막의 특성이 열화되는 성질이 나타난다.In addition, various characteristics such as abrasion resistance and adhesiveness are changed depending on the material of the substrate, so that when the substrate is torn or the abrasion resistance is significantly different from the film material, the characteristics of the abrasion-resistant film deteriorate.

따라서, 본 발명은 상기와 같은 제반문제점을 감안하여 이를 해소하고자 발명한 것으로, 제1도는 본 발명을 설명하기 위한 장치의 개략도로써 통상의 것이다. 진공실(1)내에 이온플레이팅을 할 수 있는 이온화전극(3)고, 필라멘트(4)를 설치하였는데, 상기 진공실(1) 내부에는 이외에 증발원(2)과 기판(6)의 설치 및 가열을 위한 기판홀더(7), 기판가열장치(8) 셔터(5), 가스도입구(9)등이 설치되어 있다.SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to solve the above problems. The first aspect is a schematic view of an apparatus for explaining the present invention. An ionization electrode 3 capable of ion plating in the vacuum chamber 1 and a filament 4 are provided in the vacuum chamber 1. The inside of the vacuum chamber 1 is provided with an evaporation source 2, A substrate holder 7, a substrate heating device 8, a shutter 5, a gas inlet 9, and the like.

상기 증발원(2)은 전자총 증발원을 사용하였다. 우선, 증발원(2)에 피막물질에 사용되는 금속크롬을 장입하고, 기판(6)을 장착한 다음 진공펌프(도면에 표시하지 않음)를 이용하여 배기시킨다.The evaporation source 2 used an electron gun evaporation source. First, the evaporation source 2 is charged with metal chromium used as a coating material, and the substrate 6 is mounted and then exhausted by using a vacuum pump (not shown).

진공도가 10-5토르 이하가 되면 기판(5)의 청정을 위해 아르곤가스를 주입하고 기판(6)에 음의 전압을 인가하여 기판(6)을 청정시킨다.When the degree of vacuum is less than 10 -5 Torr, argon gas is injected to clean the substrate 5, and a negative voltage is applied to the substrate 6 to clean the substrate 6.

기판(6)의 청정은 매우 중요한 단계로 기판(6)에 존재하는 유기물과 같은 불순물 뿐만 아니라 자연적으로 존재하는 산화막을 제거하는 단계를 포함한다.The cleaning of the substrate 6 involves removing naturally existing oxide films as well as impurities such as organic substances present in the substrate 6 as a very important step.

이 산화막이 충분히 제거되지 않으면 밀착성에 영향을 주므로 청정을 해주어야 한다. 기판(6)의 청정은 보통 10-2토르 정도의 아르곤가스 분위기에서 기판(6)에 500∼1000V의 음의 전압을 인가하여 글로방전을 유도시켜 실시한다.If the oxide film is not sufficiently removed, it affects the adhesion and must be cleaned. Cleaning of the substrate 6 is usually 10 -2 by applying a negative voltage of 500~1000V the substrate 6 in an argon gas atmosphere of about Torr subjected to induce glow discharge.

이렇게 하면 방전영역에 존재하는 아르곤이온이 기판(6)에 충돌하여 기판(6)상에 존재하는 산화막을 제거하게 된다.In this way, the argon ions present in the discharge region collide with the substrate 6 to remove the oxide film existing on the substrate 6. [

기판(6)청정이 끝나면 진공도를 다시 10-5토르 이하로 유지시킨 후 우선 첫 번째의 밀착성 확보층인 금속피막인 크롬피막을 제조한다.After the substrate 6 is cleaned, the vacuum degree is maintained at 10 -5 Torr or lower, and then the chromium film, which is the first adhesion ensuring layer, is produced.

크롬피막의 제조는 통상의 진공증착 또는 이온플레이팅 방법을 이용하면 되나 이온플레이팅 방법을 사용하였다.The chromium film can be produced by a conventional vacuum deposition or ion plating method, but an ion plating method is used.

금속 크롬의 이온플레이팅은 다음과 같은 방법을 이용하였다.Ion plating of metal chromium was performed by the following method.

우선 크롬을 증발시키면서 이온화전극(3)과 필라멘트(4)를 이용화여 증발물을 이온화 시킨다.First, the evaporation water is ionized by using the ionization electrode 3 and the filament 4 while evaporating chromium.

그로나 크롬의 경우 증발물만으로는 이온화가 충분히 일어나지 않기 때문에 아르곤가스를 주입하게 되는데 이때 아르곤가스의 압력은 대략 2×10-4토르 정도에 맞추었다.In the case of gronachrome, argon gas is injected because the ionization does not occur sufficiently by evaporation alone, and the pressure of the argon gas is adjusted to about 2 × 10 -4 Torr.

방전이 안정화되면 기판(6)에 음의 전압을 인가하고 셔터(5)를 열어 크롬피막을 제조하면 된다.When the discharge is stabilized, a negative voltage may be applied to the substrate 6 and the shutter 5 may be opened to produce a chromium film.

다음 단계는 Cr2N층을 만드는 것으로 크롬이 증발되고 이온화가 지속되고 있는 상태에서 진공실(1) 내부의 질소가스 압력이 (0.5-1)×10-4토르가 되도록 질소가스를 주입한다. 이런 상태에서 증착을 시키면 기판(6)에 CrN층이 형성된다.The next step is to make a Cr 2 N layer so that the nitrogen gas is injected so that the pressure of the nitrogen gas inside the vacuum chamber 1 is (0.5-1) × 10 -4 Tor in the state where the chromium evaporates and ionization is continued. When the deposition is performed in this state, a CrN layer is formed on the substrate 6.

마지막 단계는 내마모성이 우수한 CrN피막을 제조하는 단계이다.The final step is to produce a CrN coating excellent in abrasion resistance.

이때는 다른 조건은 Cr2N과 유사하나 질소가스의 압력을 (2∼5)×10-4토르가 되도록 주입하고 이온화효율을 높여서 제조하면 된다.In this case, the other condition is similar to Cr 2 N, but it may be manufactured by injecting nitrogen gas at a pressure of (2 to 5) × 10 -4 torr and increasing the ionization efficiency.

이 모든 공정은 한번의 증발로 이루어진다.All these processes consist of a single evaporation.

즉, 크롬을 증발시키면서 동시에 이온화 시킨 후 질소가스의 유량조절만으로 모든 공정이 끝나는 것이다.That is, after the chromium evaporates and ionizes at the same time, the entire process is completed only by controlling the flow rate of the nitrogen gas.

본 발명의 제조시 주의할 것은 크롬의 증발이다. 크롬은 진공중에서 승화성 물질이므로 녹지 않고 증One thing to note in the production of the present invention is the evaporation of chromium. Since chromium is a sublimable substance in vacuum,

발되기 때문에 매우 주의를 요한다. 본 발명에서의 증발은 대한민국 특허등록 제88595호를 이용하였다.Be very careful because it is a foot. The evaporation in the present invention was made in Korean Patent No. 88595.

상기 크롬피막의 두께는 0.3∼1㎛이하가 되면 밀착성 확보의 역할을 제대로 못하며, 1㎛ 이상이 되면 경제성이 떨어지기 때문이다.When the thickness of the chromium film is 0.3 to 1 탆 or less, it does not play a role of securing the adhesion. If the thickness is 1 탆 or more, economical efficiency is deteriorated.

상기 Cr2N 두께는 1.5∼3㎛의 범위가 바람직한데 그 이유는 다음과 같다.The Cr 2 N thickness is preferably in the range of 1.5 to 3 탆 for the following reasons.

Cr2N 피막의 두께가 1.5㎛이하가 되면 내마모성의 특성이 충분히 나타나지 않으며 3㎛이상이 되면 경제성이 떨어지기 때문이다.When the thickness of the Cr 2 N coating is 1.5 탆 or less, abrasion resistance characteristics are not sufficiently exhibited, and when the thickness is 3 탆 or more, economical efficiency is deteriorated.

상기 최종표면층의 질소가스 압력은 (2∼5)×10-4토르가 바람직한데 그 이유는 다음과 같다. 가스의 압력이 2×10-4토르 이하가 되면 완전한 CrN이 되지 않고 피막내에 다른 화학조성의 질화크롬이 존재하여 내마모성이 저하되기 때문이며, 5×10-4토르 이상이 되면 이상방전 등으로 인해 피막이 손상을 입기 때문이다.The nitrogen gas pressure in the final surface layer is preferably (2 to 5) x 10 < -4 > Torr because of the following reasons. Due to the pressure of the gas when the 2 × 10 -4 Torr or less because it is not a complete and a chromium nitride CrN of different chemical compositions present in the wear-resistant coating film is decreased, the discharge is above at least 5 × 10 -4 Torr, such as the coating It is damaged.

상기 최종표면층 제조시 이온화전극(3)의 전압은 50∼80V의 범위가 바람직한데 그 이유는 다음과 같다. 이온화전극(3)의 전압이 50V이하가 되면 이온화가 충분히 일어나지 않아 완전한 CrN이 되지 않고, 피막내에 다른 화학조성의 질화크롬이 존재하여 내마모성이 저하되기 때문이며 이온화 전극(3)의 전압이 80V이상이 되면 이상방전 등으로 인해 피막이 손상을 입기 때문이다.In manufacturing the final surface layer, the voltage of the ionization electrode 3 is preferably in the range of 50 to 80 V for the following reasons. When the voltage of the ionization electrode 3 is 50 V or less, ionization does not sufficiently take place, so that complete CrN is not obtained, and chromium nitride having a different chemical composition exists in the film to lower abrasion resistance. The coating is damaged due to an abnormal discharge or the like.

이하 본 발명을 실시예와 표1을 통해 자세히 설명한다.Hereinafter, the present invention will be described in detail with reference to Examples and Table 1.

[발명예 1][Description 1]

통상의 진공실(1)에 이온플레이팅을 할 수 있는 이온화전극(3)과, 필라멘트(4)를 설치하고 3층으로 이루어진 내마모성 피막을 제조하였다. 진공실(1)을 열어 기판(6)을 설치한 다음, 유회전펌프와 부스터(Boster)펌프를 사용하여 10-2토르까지 초기 배기를 하였다. 그 다음 유확산펌프 10-5토르 이하로 배기하였다. 원하는 진공도를 얻은 후 기판(6)에 존재하는 불순물을 제거하고 기판(6)을 청정시키기 위하여 알곤가스 분위기에서 기판(6)에 약 800V의 전압을 걸어 20분간 글로우방전 청정을 실시하였다.An ionization electrode 3 capable of ion plating in a conventional vacuum chamber 1 and a filament 4 were provided to produce a wear-resistant coating consisting of three layers. The vacuum chamber 1 was opened to install the substrate 6, and then an initial discharge was performed to 10 -2 Torr using a rotary pump and a Boster pump. Then the oil diffusion pump was evacuated to less than 10 -5 Torr. After a desired degree of vacuum was obtained, a glow discharge cleaning was performed for 20 minutes by applying a voltage of about 800 V to the substrate 6 in an argon gas atmosphere in order to remove impurities present on the substrate 6 and clean the substrate 6.

본 발명에 사용된 기판(6)은 베어링강으로 만들어진 지름 10mm??의 베어링이었다. 기판청정이 끝나고 이온플레이팅 방법을 이용하여 크롬을 0.5㎛의 두께로 형성하였다.The substrate 6 used in the present invention was a bearing made of a bearing steel and having a diameter of 10 mm. After the substrate cleaning was finished, chromium was formed to a thickness of 0.5 탆 by using an ion plating method.

금속크롬의 이온플레이팅 조건은 다음과 같다.Ion plating conditions of metal chromium are as follows.

우선, 크롬의 증발을 위해 전바빔의 전력을 500W로하여 증발시켰다.First, for the evaporation of chromium, the power of the entire barbeam was set to 500 W and evaporated.

크롬의 증발을 안정화 된 후 진공실(1)의 아르곤가스 압력이 2×10-4토르가 되도록 조절한 다음 필라멘트(4)에 50A의 전류를 흘리면서 이온화 전극(3)에 60V의 전압을 인가하였다.After the evaporation of chromium was stabilized, the argon gas pressure in the vacuum chamber 1 was adjusted to 2 × 10 -4 Torr, and a voltage of 60 V was applied to the ionization electrode 3 while flowing a current of 50 A to the filament 4.

이때, 이온화전극(3)에 흐르는 전류는 8∼10A였다. 이렇게 하여 방전이 안정화가 되면 기판에 300V의 전압을 인가한 후 셔터(5)를 열어 5분간 증착시켰다.At this time, the current flowing through the ionization electrode 3 was 8 to 10A. When the discharge was stabilized, a voltage of 300 V was applied to the substrate, and then the shutter 5 was opened to deposit for 5 minutes.

다음으로 Cr1N 피막을 형성시키기 위해 질소가스 압력이 8×10-5토르가 되도록 조절하여 15분간 증착시켰다.Next, in order to form a Cr 1 N film, the nitrogen gas pressure was adjusted to 8 × 10 -5 Torr and the film was deposited for 15 minutes.

이때, 형성된 Cr2N 피막의 두께는 약 1㎛이었다. 최종적으로 CrN피막을 형성시키기 위해 질소가스압력을 2.5×10-5토르까지 증가시켜 15분간 증착시켰다. 이때, 형성된 CrN 피막의 두께는 약 1㎛이었다. 하기 표1에는 발명예와 비교예를 각각 표시하였으며, 계면층, 중간층, 그리고 최종표면층으로 구분하여 조건에 따른 마모성의 특성을 비교하였다.At this time, the thickness of the formed Cr 2 N coating was about 1 탆. Finally, the nitrogen gas pressure was increased to 2.5 x 10 < -5 > Torr to form a CrN film, and the film was deposited for 15 minutes. At this time, the thickness of the formed CrN coating was about 1 mu m. Table 1 below shows the inventive and comparative examples, respectively, and the characteristics of abrasion according to the conditions are divided into the interface layer, the intermediate layer and the final surface layer.

마모시험은 ring-on-disk 마모시험기를 이용하여 건식과 습식 두 조건으로 실시하였다.The wear test was carried out under both dry and wet conditions using a ring-on-disk abrasion tester.

마모조건은 부가 하중이 0.065MPa, 그리고 회전속도는 150mm/s가 되도록 조절하였다.The wear conditions were adjusted so that the additional load was 0.065 MPa and the rotation speed was 150 mm / s.

내마모성은 3단계로 구분하여 우수할 경우 ◎ 표시를, 보통일 경우 ○ 표시를 그리고 나쁠경우에는 × 표시를하였다.The abrasion resistance is divided into three steps, and when it is excellent, it is indicated by?, When it is normal it is marked with?, And when it is bad, it is marked by X.

[발명예 2][Advantage 2]

발명예 1과 동일하되 최종 표면층의 제조시 질소가스압을 5×10-5토르로 하고 이온화 조건을 50V, 11A로 하여 제조한 경우이다.This is the same as Example 1 except that the final surface layer was produced at a nitrogen gas pressure of 5 × 10 -5 torr and an ionization condition of 50 V and 11 A, respectively.

[발명예 3][Practical Example 3]

발명예 1과 동일하되 최종 표면층의 제조시 질소가스압을 5×10-5토르고 하고 이온화 조건을 80V, 15A로 하여 제조한 경우이다.This is the same as Example 1 except that the final surface layer was manufactured by setting the nitrogen gas pressure to 5 × 10 -5 torr and the ionization conditions to 80 V and 15 A, respectively.

[발명예 4][Description 4]

발명예 1과 동일하되 최종 표면층의 제조시 질소가스압을 3×10-5토르로 하고 이온화 조건을 70V, 14A 로 하여 제조한 경우이다.This is the same as Example 1 except that the final surface layer was produced at a nitrogen gas pressure of 3 × 10 -5 torr and an ionization condition of 70 V and 14 A, respectively.

[비교예 1][Comparative Example 1]

발명예 1과 중간층인 Cr2N 피막을 형성시키지 않고 제조한 경우이다.It is a case in which the film is formed without forming Cr 1 N coating film of Inventive Example 1 and the intermediate layer.

[비교예 2][Comparative Example 2]

발명예 1과 동일하되 계면층인 크롬피막을 제조하지 않은 경우이다.This is the same as Inventive Example 1, except that the chromium film as the interfacial layer is not produced.

[비교예 3][Comparative Example 3]

발명예 1과 동일하되 최종표면층인 CrN 피막을 제조하지 않은 경우이다.This is the same as that of Inventive Example 1, except that the CrN film as the final surface layer was not produced.

[비교예 4][Comparative Example 4]

발명예 1과 동일하되 최종표면층의 제조시 질소가스압을 1×10-4토르로하여 이온화 조건을 60V, 10A로 하여 제조한 경우이다.This is the same as Example 1 except that the final surface layer was produced by setting the nitrogen gas pressure to 1 × 10 -4 Torr and the ionization conditions to 60 V and 10 A, respectively.

[비교예 5][Comparative Example 5]

발명예 1과 동일하되 최종표면층의 제조시 질소가스압을 6×10-4토르로 제조한 경우이다.This is the same as that of Inventive Example 1, except that the nitrogen gas pressure at the time of manufacturing the final surface layer is 6 × 10 -4 Torr.

[비교예 6][Comparative Example 6]

발명예 1과 동일하되 이온화 조건을 40V, 8A로 하여 제조한 경우이다.This is the same as that of Inventive Example 1, except that the ionization conditions are 40V and 8A.

[비교예 7][Comparative Example 7]

발명예 1과 동일하되 이온화 조건을 100V, 18A로 하여 제조한 경우이다.This is the same as Inventive Example 1, except that the ionization conditions were 100 V and 18 A, respectively.

이상과 같은 방법으로 내마모성 피막을 형성하면 종래의 방법에 비해 티타늄합금과 같은 마모성이 열악한 모재의 내마모성 향상에 크게 기여함을 알 수 있다.It can be seen that forming an abrasion-resistant coating by the above-described method largely contributes to improvement of abrasion resistance of a base material having poor abrasion such as a titanium alloy as compared with a conventional method.

표 1Table 1

Claims (1)

내마모성 향상을 위해 단일 금속인 크롬만으로 이루어진 통상의 경질피막에 있어서, 밀착성 확보를 위해 금속표면에 크롬피막층을 형성하는 공정과, 상기 Cr2N 피막층 위에 최종적으로 CrN만으로 이루어진 질화크롬박막을 형성하는 공정으로 이루어지는 것을 특징으로 하는 각종 금속류 표면의 경질피막 형성방법.A step of forming a chromium coating layer on the metal surface in order to secure adhesion in a normal hard coating made of only chromium which is a single metal for improving abrasion resistance and a step of finally forming a chromium nitride thin film made only of CrN on the Cr 2 N coating layer And a hard coating layer formed on the surface of the hard coating layer. 제1항에 있어서, 상기 질화크롬의 화학성분비를 질소가스이 유량으로 조절하는 것을 특징으로 하는 각종 금속류 표면의 경질피막 형성방법.The method according to claim 1, wherein the chemical composition ratio of the chromium nitride is controlled by the nitrogen gas flow rate. 제1항에 있어서, 최종 표면층의 피막 형성시 질소가스의 압력이 (2∼5)×10⁴토르이며, 이온화전극의 전압이 80V인 것을 특징으로 하는 각종 금속류 표면의 경질피막 형성방법.The method according to claim 1, wherein the pressure of the nitrogen gas is (2 to 5) x 10 < 5 > Tor at the time of forming the film of the final surface layer, and the voltage of the ionizing electrode is 80V. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
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