KR980007890A - PCB soldering state inspection apparatus and method - Google Patents

PCB soldering state inspection apparatus and method Download PDF

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Publication number
KR980007890A
KR980007890A KR1019960021280A KR19960021280A KR980007890A KR 980007890 A KR980007890 A KR 980007890A KR 1019960021280 A KR1019960021280 A KR 1019960021280A KR 19960021280 A KR19960021280 A KR 19960021280A KR 980007890 A KR980007890 A KR 980007890A
Authority
KR
South Korea
Prior art keywords
pcb
soldering
inspection
inspection apparatus
soldering state
Prior art date
Application number
KR1019960021280A
Other languages
Korean (ko)
Inventor
윤한종
문영식
Original Assignee
구자홍
엘지전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 구자홍, 엘지전자 주식회사 filed Critical 구자홍
Priority to KR1019960021280A priority Critical patent/KR980007890A/en
Publication of KR980007890A publication Critical patent/KR980007890A/en

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발명은 PCB 납땜 상태 검사 장치 및 그 방법에 관한 것으로서, PCB의 납땜 표면을 촬영하여 납땜 상태의 양부를 판정하기 위해 카메라와 조명 수단을 사용하는 PCB 납땜 검사 장치에 있어서, 상기 조명 수단이 PCB의 표면에 조사하는 빛의 각도를 서로 달리하는 다수의 조명부로 구성된 PCB 납땜 상태 검사 장치와 그 운용 방법을 제공함으로써 검사 대상 부위의 다각적인 영상 정보로 검사의 정확성을 향상시킴과 아울러 조명수단의 고속 점멸 처리로 검사 속도의 신속성을 확보하여 작업성을 향상시킬 수 있는 효과가 있다.The present invention relates to a PCB soldering state inspection apparatus and a method thereof, wherein a PCB soldering inspection apparatus using a camera and a lighting means to photograph the soldering surface of the PCB to determine whether the soldering state. By providing a PCB soldering state inspection device composed of a plurality of lighting units having different angles of light irradiated to the surface and its operation method, the inspection accuracy is improved by multi-dimensional image information of the inspection target area and the flashing speed of the lighting means is improved. Treatment has the effect of improving the workability by ensuring the speed of inspection.

Description

PCB 납땜 상태 검사 장치 및 그 방법PCB soldering state inspection device and method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제4도는 본 발명에 따른 PCB 납땜 상태 검사 장치의 구성도.4 is a configuration diagram of a PCB soldering state inspection apparatus according to the present invention.

제5도는 본 발명에 따른 PCB 납땜 상태 검사 장치의 블록도.5 is a block diagram of a PCB soldering state inspection apparatus according to the present invention.

제6도는 제4도의 조명 수단을 도시한 도면.6 shows the lighting means of FIG. 4;

제7도는 본 발명에 따른 PCB 납땜 상태 검사 및 방법의 순서도.7 is a flow chart of a PCB solder condition inspection and method according to the present invention.

Claims (4)

PCB 납땜 표면을 촬영하여 납땜 상태의 양부를 판정하기 위해 카메라와 조명 수단을 사용하는 PCB 납땜 검사 장치에 있어서, 상기 조명 수단은 PCB의 표면에 조사하는 빛의 각도를 서로 달리하는 다수의 조명부로 구성된 것을 특징으로 하는 PCB 납땜 상태 검사 장치.In a PCB soldering inspection apparatus using a camera and a lighting means to photograph the PCB soldering surface to determine the soldering status, the lighting means is composed of a plurality of lighting units for varying angles of light irradiated on the surface of the PCB PCB soldering state inspection apparatus, characterized in that. 제1항에 있어서, 상기 조명 수단은 PCB 검사면 부품의 상면을 조사하도록 하는 제1조 명부와, PCB 검사면 부품의 측면을 조사하도록 하는 제2조명부로 구성된 것을 특징으로 하는 PCB 납땜 상태 검사 장치.The apparatus of claim 1, wherein the lighting means comprises a first article list for irradiating the upper surface of the PCB inspection surface component and a second lighting unit for irradiating the side surface of the PCB inspection surface component. . 제1항 또는 제2항에 있어서, 상기 조명부는 다수의 발광 다이오드가 조합된 광원과, 상기 광원이 고속 점멸하도록 제어하는 고속 점멸 처리 장치로 구성된 것을 특징으로 하는 PCB 납땜 상태 검사 장치.The apparatus of claim 1 or 2, wherein the lighting unit comprises a light source in which a plurality of light emitting diodes are combined, and a high speed flashing processing device which controls the light source to flash at a high speed. PCB의 납땜 표면을 촬영하여 납땜 상태의 양부를 판정하는 PCB 납땜 상태 검사 방법에 있어서, PCB 납땜 표면에 서로 다른 각도로 조사되는 빛에 의한 서로 다른 영상을 촬영하고, 상기 서로 다른 영상을 조합하여 3차원적으로 분석하도록 하는 것을 특징으로 하는 PCB 납땜 상태 검사 방법.In the PCB soldering state inspection method for determining the solder state of the soldering by photographing the soldering surface of the PCB, to take different images by the light irradiated at different angles on the PCB soldering surface, by combining the different images 3 PCB soldering state inspection method characterized in that the dimensional analysis.
KR1019960021280A 1996-06-13 1996-06-13 PCB soldering state inspection apparatus and method KR980007890A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960021280A KR980007890A (en) 1996-06-13 1996-06-13 PCB soldering state inspection apparatus and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960021280A KR980007890A (en) 1996-06-13 1996-06-13 PCB soldering state inspection apparatus and method

Publications (1)

Publication Number Publication Date
KR980007890A true KR980007890A (en) 1998-03-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960021280A KR980007890A (en) 1996-06-13 1996-06-13 PCB soldering state inspection apparatus and method

Country Status (1)

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KR (1) KR980007890A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100884051B1 (en) * 2007-01-05 2009-02-19 주식회사 휘닉스 디지탈테크 Apparatus and method for inspecting soldering by modifying grab sequency

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100884051B1 (en) * 2007-01-05 2009-02-19 주식회사 휘닉스 디지탈테크 Apparatus and method for inspecting soldering by modifying grab sequency

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