KR980005999A - Robot arm for wafer loading in semiconductor dry etching equipment - Google Patents

Robot arm for wafer loading in semiconductor dry etching equipment Download PDF

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Publication number
KR980005999A
KR980005999A KR1019960020675A KR19960020675A KR980005999A KR 980005999 A KR980005999 A KR 980005999A KR 1019960020675 A KR1019960020675 A KR 1019960020675A KR 19960020675 A KR19960020675 A KR 19960020675A KR 980005999 A KR980005999 A KR 980005999A
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KR
South Korea
Prior art keywords
wafer
support
plate
dry etching
robot arm
Prior art date
Application number
KR1019960020675A
Other languages
Korean (ko)
Other versions
KR100208704B1 (en
Inventor
이성호
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960020675A priority Critical patent/KR100208704B1/en
Publication of KR980005999A publication Critical patent/KR980005999A/en
Application granted granted Critical
Publication of KR100208704B1 publication Critical patent/KR100208704B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

로봇암 상부에 부착된 지지판의 구조를 개선하는 반도체 건식식각설비에 웨이퍼 로딩용 로봇암에 관한 것이다. 본 발명은, 웨이퍼를 지지하는 받침부와 로봇몸체에 연결되는 완드 플레이트로 이루어진 반도체 건식식각설비의 웨이퍼 로딩용 로봇암에 있어서, 상기 완드 플레이트 상부 표면의 일측에는 웨이퍼의 플랫존영역에 대응하는 형상의 지지면을 가진 제1 지지판이 부착되고 상기 완드 플레이트 상부 표면의 다른 일측에는 상기 웨이퍼의 원주면에 대응하는 형상의 지지면을 가진 제2 지지판이 부착되며, 상기 제1 및 제2 지지판은 상기 지지면에 상기 웨이퍼가 완전 밀착되어 지지될 수 있도록 배치됨을 특징으로 한다. 따라서, 식각공정이 진행되는 식각챔버 내부의 스테이지에 웨이퍼가 올바르게 얼라인됨으로 인해서 식각불량이 방지되는 효과가 있다.The present invention relates to a wafer arm for loading a wafer in a semiconductor dry etching apparatus for improving a structure of a support plate attached to an upper portion of the robot arm. The present invention is a wafer loading robot arm of a semiconductor dry etching equipment comprising a support portion for supporting a wafer and a wand plate connected to a robot body, wherein one side of the upper surface of the wand plate corresponds to a flat zone area of the wafer. A first support plate having a support surface of is attached, and a second support plate having a support surface having a shape corresponding to the circumferential surface of the wafer is attached to the other side of the upper surface of the wand plate, wherein the first and second support plates are the The wafer is characterized in that the wafer is disposed so as to be completely in contact with the support surface. Therefore, the etching defect is prevented because the wafer is correctly aligned on the stage inside the etching chamber in which the etching process is performed.

Description

반도체 건식식각설비의 웨이퍼 로딩용 로봇암Robot arm for wafer loading in semiconductor dry etching equipment

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 따른 반도체 건식식각설비의 웨이퍼 로딩용 로봇암이 웨이퍼를 얼라이너에서 얼라인하는 상태를 나타내는 도면이다.2 is a view showing a state in which the wafer loading robot arm of the semiconductor dry etching apparatus according to the present invention aligns the wafer with the aligner.

Claims (2)

웨이퍼를 지지하는 받침부와 로봇몸체에 연결되는 완드 플레이트로 이루어진 반도체 건식식각설비의 웨이퍼 로딩용 로봇암에 있어서, 상기 완드 플레이트 상부 표면의 일측에는 웨이퍼의 플랫존영역에 대응하는 형상의 지지면을 가지는 제1 지지판이 부착되고 상기 완드 플레이트 상부 표면의 다른 일측에는 상기 웨이퍼의 원주면에 대응하는 형상의 지지면을 가진 제2 지지판이 부착되며, 상기 제1 및 제2 지지판은 상기 지지면에 상기 웨이퍼가 완전말착되어 지지될 수 있도록 배치됨을 특징으로 하는 반도체 건식식각설비의 웨이퍼 로디용 로봇암.In the wafer loading robot arm of a semiconductor dry etching apparatus comprising a support portion supporting a wafer and a wand plate connected to the robot body, one side of the upper surface of the wand plate has a support surface having a shape corresponding to the flat zone of the wafer. A first support plate having a second support plate having a support surface having a shape corresponding to the circumferential surface of the wafer is attached to the other side of the upper surface of the wand plate, and the first and second support plates are connected to the support surface. A robot arm for a wafer roddy of a semiconductor dry etching apparatus, characterized in that the wafer is disposed so as to be fully adhered and supported. 제1항에 있어서, 상기 제1 지지판 및 제2 지지판은 테프론재질인 것을 특징으로 하는 상기 반도체 건식식각설비의 웨이퍼 로딩용 로봇암.The wafer arm of claim 1, wherein the first support plate and the second support plate are made of Teflon material. ※참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is to be disclosed based on the initial application.
KR1019960020675A 1996-06-10 1996-06-10 Robot arm for wafer loading KR100208704B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960020675A KR100208704B1 (en) 1996-06-10 1996-06-10 Robot arm for wafer loading

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960020675A KR100208704B1 (en) 1996-06-10 1996-06-10 Robot arm for wafer loading

Publications (2)

Publication Number Publication Date
KR980005999A true KR980005999A (en) 1998-03-30
KR100208704B1 KR100208704B1 (en) 1999-07-15

Family

ID=19461371

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960020675A KR100208704B1 (en) 1996-06-10 1996-06-10 Robot arm for wafer loading

Country Status (1)

Country Link
KR (1) KR100208704B1 (en)

Also Published As

Publication number Publication date
KR100208704B1 (en) 1999-07-15

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