KR980005413U - Bonding pressure measuring device - Google Patents
Bonding pressure measuring deviceInfo
- Publication number
- KR980005413U KR980005413U KR2019960017064U KR19960017064U KR980005413U KR 980005413 U KR980005413 U KR 980005413U KR 2019960017064 U KR2019960017064 U KR 2019960017064U KR 19960017064 U KR19960017064 U KR 19960017064U KR 980005413 U KR980005413 U KR 980005413U
- Authority
- KR
- South Korea
- Prior art keywords
- measuring device
- pressure measuring
- bonding pressure
- bonding
- pressure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960017064U KR200145799Y1 (en) | 1996-06-22 | 1996-06-22 | Bonding pressure measuring apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960017064U KR200145799Y1 (en) | 1996-06-22 | 1996-06-22 | Bonding pressure measuring apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR980005413U true KR980005413U (en) | 1998-03-30 |
| KR200145799Y1 KR200145799Y1 (en) | 1999-06-15 |
Family
ID=19459261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960017064U KR200145799Y1 (en) | 1996-06-22 | 1996-06-22 | Bonding pressure measuring apparatus |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200145799Y1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100604328B1 (en) * | 1999-04-13 | 2006-07-24 | 삼성테크윈 주식회사 | Bonding force calibration method of capillary for wire bonding |
-
1996
- 1996-06-22 KR KR2019960017064U patent/KR200145799Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR200145799Y1 (en) | 1999-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20100126 Year of fee payment: 12 |
|
| LAPS | Lapse due to unpaid annual fee |