KR980005413U - Bonding pressure measuring device - Google Patents

Bonding pressure measuring device

Info

Publication number
KR980005413U
KR980005413U KR2019960017064U KR19960017064U KR980005413U KR 980005413 U KR980005413 U KR 980005413U KR 2019960017064 U KR2019960017064 U KR 2019960017064U KR 19960017064 U KR19960017064 U KR 19960017064U KR 980005413 U KR980005413 U KR 980005413U
Authority
KR
South Korea
Prior art keywords
measuring device
pressure measuring
bonding pressure
bonding
pressure
Prior art date
Application number
KR2019960017064U
Other languages
Korean (ko)
Other versions
KR200145799Y1 (en
Inventor
김태환
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019960017064U priority Critical patent/KR200145799Y1/en
Publication of KR980005413U publication Critical patent/KR980005413U/en
Application granted granted Critical
Publication of KR200145799Y1 publication Critical patent/KR200145799Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR2019960017064U 1996-06-22 1996-06-22 Bonding pressure measuring apparatus KR200145799Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019960017064U KR200145799Y1 (en) 1996-06-22 1996-06-22 Bonding pressure measuring apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019960017064U KR200145799Y1 (en) 1996-06-22 1996-06-22 Bonding pressure measuring apparatus

Publications (2)

Publication Number Publication Date
KR980005413U true KR980005413U (en) 1998-03-30
KR200145799Y1 KR200145799Y1 (en) 1999-06-15

Family

ID=19459261

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019960017064U KR200145799Y1 (en) 1996-06-22 1996-06-22 Bonding pressure measuring apparatus

Country Status (1)

Country Link
KR (1) KR200145799Y1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100604328B1 (en) * 1999-04-13 2006-07-24 삼성테크윈 주식회사 Bonding force calibration method of capillary for wire bonding

Also Published As

Publication number Publication date
KR200145799Y1 (en) 1999-06-15

Similar Documents

Publication Publication Date Title
DE59608850D1 (en) PRESSURE MEASURING DEVICE
DE69508515D1 (en) Pressure device
ATE252145T1 (en) PRESSURE SENSITIVE ADHESIVES
DE69707386D1 (en) Pressure transducer
DK1029240T3 (en) Measuring device
DE69830082D1 (en) MEASURING DEVICE
DE69840881D1 (en) Pressure reducing device
DE69904902D1 (en) Blood pressure measurement device
DE69904900D1 (en) Blood pressure measurement device
DE69707798D1 (en) Pressure sensor
DE69516896D1 (en) MEASURING DEVICE
DE59712893D1 (en) MEASURING DEVICE
DE69829091D1 (en) measuring device
ATA210196A (en) PRESSURE COMPENSATING DEVICE
DE59506697D1 (en) PRESSURE SENSOR
IT1287123B1 (en) DEVICE FOR MEASURING A PRESSURE
DE69512781D1 (en) FORCE MEASURING DEVICE
DE69509177D1 (en) Pressure device
DE69817497D1 (en) Pressure measuring device
DK0658754T3 (en) Pressure Measuring Device
NO981026D0 (en) Measuring device
DE59505227D1 (en) PRESSURE SENSOR
DE69730501D1 (en) MEASURING DEVICE
DE59811913D1 (en) Displacement measuring device
KR980005413U (en) Bonding pressure measuring device

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20100126

Year of fee payment: 12

LAPS Lapse due to unpaid annual fee