KR980005395U - 플립 칩 본딩장치 - Google Patents
플립 칩 본딩장치Info
- Publication number
- KR980005395U KR980005395U KR2019960019297U KR19960019297U KR980005395U KR 980005395 U KR980005395 U KR 980005395U KR 2019960019297 U KR2019960019297 U KR 2019960019297U KR 19960019297 U KR19960019297 U KR 19960019297U KR 980005395 U KR980005395 U KR 980005395U
- Authority
- KR
- South Korea
- Prior art keywords
- flip chip
- chip bonding
- bonding device
- flip
- chip
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960019297U KR200150931Y1 (ko) | 1996-06-29 | 1996-06-29 | 플립 칩 본딩장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960019297U KR200150931Y1 (ko) | 1996-06-29 | 1996-06-29 | 플립 칩 본딩장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR980005395U true KR980005395U (ko) | 1998-03-30 |
| KR200150931Y1 KR200150931Y1 (ko) | 1999-07-15 |
Family
ID=19460484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960019297U KR200150931Y1 (ko) | 1996-06-29 | 1996-06-29 | 플립 칩 본딩장치 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200150931Y1 (ko) |
-
1996
- 1996-06-29 KR KR2019960019297U patent/KR200150931Y1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR200150931Y1 (ko) | 1999-07-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20100325 Year of fee payment: 12 |
|
| EXPY | Expiration of term |