KR970078812A - Parts inspection device of printed circuit board - Google Patents

Parts inspection device of printed circuit board Download PDF

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Publication number
KR970078812A
KR970078812A KR1019960017622A KR19960017622A KR970078812A KR 970078812 A KR970078812 A KR 970078812A KR 1019960017622 A KR1019960017622 A KR 1019960017622A KR 19960017622 A KR19960017622 A KR 19960017622A KR 970078812 A KR970078812 A KR 970078812A
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KR
South Korea
Prior art keywords
light
optical filter
circuit board
printed circuit
camera
Prior art date
Application number
KR1019960017622A
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Korean (ko)
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KR100200213B1 (en
Inventor
김창효
Original Assignee
김광호
삼성전자 주식회사
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Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960017622A priority Critical patent/KR100200213B1/en
Publication of KR970078812A publication Critical patent/KR970078812A/en
Application granted granted Critical
Publication of KR100200213B1 publication Critical patent/KR100200213B1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0269Marks, test patterns or identification means for visual or optical inspection

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

본 발명은 인쇄회로기판의 부품 검사장치에 관한 것으로서, 특히 각각 다른 색상의 광을 조사하는 제1 및 제2조명과, 상기 제1 및 제2조명에서 조사된 후 부품 및 납땝부에서 반사된 광을 투과하는 반반사 미러와, 상기 반반사 미러에서 투과된 강을 선택적으로 반사 및 투과하는 광학 필터와, 상기 광학필터에서 반사된 광을 다시 반사시키는 전반사 미러와, 상기 전반사 미러에서 반사된 광에 의해 영상을 촬영하는 제1카메라 및 상기 광학필터에서 투과된 광에 의해 영상을 촬영하는 제2카메라를 구비하는 것을 특징으로 한다.The present invention relates to a component inspecting apparatus for a printed circuit board. More particularly, the present invention relates to a component inspecting apparatus for inspecting a component of a printed circuit board, And an optical filter for selectively reflecting and transmitting the light transmitted through the semi-reflective mirror, a total reflection mirror for reflecting the light reflected by the optical filter again, and a light source for reflecting the light reflected from the total reflection mirror. And a second camera for capturing an image by the light transmitted through the optical filter.

따라서, 본 발명에서는 각각 복수의 카메라에서 각각 다른 색상의 조명이 조사됨에 따라 입력되는 영상을 저배율 및 고배율로 학대하여 촬영함으로써 일시에 부품의 장착 위치, 장착 상태 및 납땜부의 결함여부를 검사하는 것이 가능하며, 특히 부품 및 납댐부의 화상을 적절하게 확대하여 각각 검사하는 것이 가능하여 검사시간을 현저하게 단축시킴과 동시에 더욱 검사의 신뢰도를 향상시킬 수 있는 등의 여러 가지 효과가 있다.Accordingly, in the present invention, it is possible to inspect the mounting position, the mounting state, and the defective portion of the soldering portion at one time by photographing the inputted image abusively at a low magnification rate and a high magnification rate, respectively, In particular, it is possible to appropriately enlarge and inspect the image of the parts and the lead-free parts, thereby remarkably shortening the inspection time and further improving the reliability of inspection.

Description

인쇄회로기판의 부품 검사장치Parts inspection device of printed circuit board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제2도는 본 발명의 일실시예에 의한 인쇄회로기판의 부품 검사장치를 도시한 도면이다.FIG. 2 is a view showing an apparatus for inspecting parts of a printed circuit board according to an embodiment of the present invention.

Claims (6)

각각 다른 색상의 광을 조사하는 제1 및 제2조명; 상기 제1 및 제2조명에서 조사된 후 부품 및 납땜부에서 반사된 광을 투과하는 반반사 미러; 상기 반반사 미러에서 투과된 광을 선택적으로 반사 및 투과하는 광학 필터; 상기 광학필터에서 반사된 광을 다시 반사시키는 전반사 미러; 상기 전반사 미러에서 반사된 광에 의해 영상을 촬영하는 제1카메라; 및 상기 광학필터에서 투과된 광에 의해 영상을 촬영하는 제2카메라를 구비하는 것을 특징으로 하는 인쇄회로기판의 부품 검사장치.First and second illuminations for illuminating light of different colors; A semi-reflective mirror that transmits light reflected from the component and the soldering portion after being irradiated by the first and second lights; An optical filter for selectively reflecting and transmitting the light transmitted through the anti-reflection mirror; A total reflection mirror for reflecting the light reflected from the optical filter again; A first camera for capturing an image by light reflected from the total reflection mirror; And a second camera for capturing an image by the light transmitted through the optical filter. 제1항에 있어서, 상기 제1조명은 녹색광을 조사하는 고주파 형광등인 것을 특징으로 하는 인쇄회로기판의 부품 검사장치.The apparatus for inspecting parts of a printed circuit board according to claim 1, wherein the first illumination is a high-frequency fluorescent lamp that emits green light. 제1항에 있어서, 상기 제2조명은 적색광을 조사하는 발광소자인 것을 특징으로 하는 인쇄회로기판의 부품 검사장치.The apparatus for inspecting parts of a printed circuit board according to claim 1, wherein the second illumination is a light emitting element for emitting red light. 제1항에 있어서, 상기 광학필터는 녹색광은 투과시키고 적색광은 반사시키는 것을 특징으로 하는 인쇄회로기판의 부품 검사장치.The apparatus of claim 1, wherein the optical filter transmits green light and reflects red light. 제1항에 있어서, 상기 제1카메라의 전면측에는 저배울 렌즈가 배치되고, 사기 제2카메라에는 고배율 렌즈가 배치된 것을 특징으로 하는 인쇄회로기판의 부품 검사장치.The apparatus for inspecting parts of a printed circuit board according to claim 1, wherein a low-learning lens is disposed on the front side of the first camera, and a high-magnification lens is disposed on the second camera. 제1항에 있어서, 상기 반반사 미러와 광학필터의 사이에는 제1 및 제2조명으로부터 조사된 반사광을 선택적으로 반사 및 투과시키는 또 다른 반반사 미러가 구비된 것을 특징으로 하는 인쇄회로기판의 부품 검사장치.2. The backlight unit according to claim 1, further comprising another semi-reflective mirror disposed between the semi-reflective mirror and the optical filter for selectively reflecting and transmitting the reflected light irradiated from the first and second illuminators Inspection device. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960017622A 1996-05-23 1996-05-23 Test unit for component of pcb KR100200213B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960017622A KR100200213B1 (en) 1996-05-23 1996-05-23 Test unit for component of pcb

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960017622A KR100200213B1 (en) 1996-05-23 1996-05-23 Test unit for component of pcb

Publications (2)

Publication Number Publication Date
KR970078812A true KR970078812A (en) 1997-12-12
KR100200213B1 KR100200213B1 (en) 1999-06-15

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Application Number Title Priority Date Filing Date
KR1019960017622A KR100200213B1 (en) 1996-05-23 1996-05-23 Test unit for component of pcb

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101429723B1 (en) * 2008-12-08 2014-09-24 삼성전자주식회사 Testing appartus of semiconductor package for detecting package defect by illuminating package from various angles to obtain image and using color imformation

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100395426B1 (en) * 2001-06-25 2003-08-21 에이티아이 주식회사 Form defect inspection device of pcb for ic using 2 boat
KR101005591B1 (en) * 2008-10-28 2011-01-05 (주)워프비전 Integrated optical inspection apparatus
KR101118210B1 (en) * 2009-03-12 2012-03-16 아주하이텍(주) Visual inspection system of printed circuit board and method of the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101429723B1 (en) * 2008-12-08 2014-09-24 삼성전자주식회사 Testing appartus of semiconductor package for detecting package defect by illuminating package from various angles to obtain image and using color imformation

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Publication number Publication date
KR100200213B1 (en) 1999-06-15

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