KR970077278A - Semiconductor wafer sample polishing machine - Google Patents

Semiconductor wafer sample polishing machine Download PDF

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Publication number
KR970077278A
KR970077278A KR1019960017914A KR19960017914A KR970077278A KR 970077278 A KR970077278 A KR 970077278A KR 1019960017914 A KR1019960017914 A KR 1019960017914A KR 19960017914 A KR19960017914 A KR 19960017914A KR 970077278 A KR970077278 A KR 970077278A
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KR
South Korea
Prior art keywords
polishing machine
semiconductor wafer
sample
optical microscope
wafer sample
Prior art date
Application number
KR1019960017914A
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Korean (ko)
Inventor
김기호
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960017914A priority Critical patent/KR970077278A/en
Publication of KR970077278A publication Critical patent/KR970077278A/en

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Abstract

반도체 웨이퍼 시료연마기에 카메라(Camera)가 설치된 광학현미경을 부설하여, 모니터(Monitor)와 연결시켜 연마되는 웨이퍼의 상을 계속적으로 관찰할 수 있도록 하는 반도체 웨이퍼 시료연마기에 관한 것이다.The present invention relates to a semiconductor wafer sample polishing machine in which an optical microscope equipped with a camera is attached to a semiconductor wafer sample polishing machine and connected to a monitor to continuously observe an image of a wafer to be polished.

본 발명은, 시료를 그라인딩하는 연마기가 구비된 반도체 웨이퍼 시료연마기에 있어서, 상기 연마기에서 그라인딩되는 시료를 관찰하 수 있는 위치에 부설되는 광학현미경, 상기 광학현미경에서 상을 관찰하는 관찰용원도우에 설치되어 그라인딩과정을 촬영하는 촬영수단 및 상기 카메라에서 촬영되는 상을 디스플레이하는 디스플레이수단을 포함하여 이루어진다.The present invention relates to a semiconductor wafer sample polishing machine provided with a polishing machine for grinding a sample, comprising: an optical microscope installed at a position where a sample to be ground in the polishing machine can be observed; And a display means for displaying an image photographed by the camera.

따라서, 본 발명에 의하여 연마되는 시료를 계속적으로 관찰할 수 있어 디펙트 발생소스가 되는 공정을 정확하게 확인할 수 있는 효과가 있다.Therefore, according to the present invention, the sample to be polished can be continuously observed, and it is possible to accurately confirm the process of becoming a defect generating source.

Description

반도체 웨이퍼 시료연마기Semiconductor wafer sample polishing machine

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제1도는 본 발명에 따른 반도체 웨이퍼 시료연마기의 실시예를 나타내는 모식도이다.FIG. 1 is a schematic view showing an embodiment of a semiconductor wafer sample polishing machine according to the present invention.

Claims (2)

시료를 그라인딩하는 연마기가 구비된 반도체 웨이퍼 시료연마기에 있어서, 상기 연마기에서 그라인딩되는 시료를 관찰할수 있는 위치에 부설되는 광학현미경, 상기 광학현미경에서 상을 관찰하는 관찰용윈도우에 설치되어 그라인딩과정을 촬영하는 촬영수단; 및 상기 카메라에서 촬영되는 상을 디스플레이하는 디스플레이수단;을 포함하여 이루어짐을특징으로 하는 반도체웨이퍼 시료연마기.A semiconductor wafer polishing machine comprising a polishing machine for grinding a sample, comprising: an optical microscope attached to a position where a sample to be ground in the polishing machine can be observed; and an observing window for observing the image in the optical microscope, Photographing means; And display means for displaying an image photographed by the camera. ≪ Desc / Clms Page number 19 > 제1항에 있어서, 상기 광학현미경의 조절하는 조도조절수단이 더 구성됨을 특징으로 하는 상기 반도체 웨이퍼 시료연마기.The semiconductor wafer polishing machine according to claim 1, further comprising an illuminance adjusting means for adjusting the optical microscope. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960017914A 1996-05-25 1996-05-25 Semiconductor wafer sample polishing machine KR970077278A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960017914A KR970077278A (en) 1996-05-25 1996-05-25 Semiconductor wafer sample polishing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960017914A KR970077278A (en) 1996-05-25 1996-05-25 Semiconductor wafer sample polishing machine

Publications (1)

Publication Number Publication Date
KR970077278A true KR970077278A (en) 1997-12-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960017914A KR970077278A (en) 1996-05-25 1996-05-25 Semiconductor wafer sample polishing machine

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KR (1) KR970077278A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100436861B1 (en) * 2001-08-27 2004-06-30 나노메트릭스코리아 주식회사 Method and apparatus for inspecting defects on polishing pad to be used with chemical mechanical polishing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100436861B1 (en) * 2001-08-27 2004-06-30 나노메트릭스코리아 주식회사 Method and apparatus for inspecting defects on polishing pad to be used with chemical mechanical polishing apparatus

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