KR970072354A - Method and apparatus for securing a membrane to a leadframe - Google Patents

Method and apparatus for securing a membrane to a leadframe Download PDF

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Publication number
KR970072354A
KR970072354A KR1019960012250A KR19960012250A KR970072354A KR 970072354 A KR970072354 A KR 970072354A KR 1019960012250 A KR1019960012250 A KR 1019960012250A KR 19960012250 A KR19960012250 A KR 19960012250A KR 970072354 A KR970072354 A KR 970072354A
Authority
KR
South Korea
Prior art keywords
film
punched
buffer layer
lead frame
die
Prior art date
Application number
KR1019960012250A
Other languages
Korean (ko)
Other versions
KR100368816B1 (en
Inventor
토시 사사키
테루유키 와타히끼
타카하루 요네모토
Original Assignee
하라 세이지
히타치 덴센 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 하라 세이지, 히타치 덴센 가부시키가이샤 filed Critical 하라 세이지
Priority to KR1019960012250A priority Critical patent/KR100368816B1/en
Publication of KR970072354A publication Critical patent/KR970072354A/en
Application granted granted Critical
Publication of KR100368816B1 publication Critical patent/KR100368816B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor

Abstract

리드 프레임에 막을 고착하는 장치는 막을 펀칭하기 위한 상하 이동 펀치와, 펀칭되는 막이 놓이는 다이와, 리드 프레임을 가열하는 가열판을 포함한다. 사전결정된 형상을 가지는 펀칭된 막은 리드 프레임 상에 고착되고, 얼적으로 압축되고, 리드 프레임의 전면부에 점착된다. 다이는 펀칭 단계에서 막에 가해지는 압축 응력은 감소시키고 인장 응력은 증대시키기 위해 다이의 상부면 상에 완충층이 추가적으로 제공됨에 따라 펀칭된 막은 막의 절단부에 균열이 발생되는 것이 방지된다.The apparatus for sticking the film to the lead frame includes a vertically movable punch for punching the film, a die on which the film to be punched is placed, and a heating plate for heating the lead frame. The punched film having a predetermined shape is fixed on the lead frame, compressed in the space, and adhered to the front portion of the lead frame. The die is further provided with a buffer layer on the upper surface of the die to reduce the compressive stress applied to the film in the punching step and to increase the tensile stress, so that the punched film is prevented from cracking in the cut of the film.

Description

리드 프레임에 막을 고착하는 방법 및 장치Method and apparatus for securing a membrane to a leadframe

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제3도는 본 발명의 제1실시예에 따른 리드 프레임에 막을 고착하는 장치를 도시한 단면도.FIG. 3 is a sectional view showing a device for fixing a film to a lead frame according to a first embodiment of the present invention; FIG.

Claims (6)

펀칭된 막을 제공하도록 펀치로 막을 펀칭하는 단계와; 가열판 상에서 가열되는 리드 프레임에 펀칭된 막을 위치시키는 단계와; 펀칭된 막이 상기 리드 프레임에 고착되도록, 펀치로 가열판 상의 리드 프레임 상에 있는 펀칭된 막을 압축하는 단계를 포함하며; 펀칭 단계는 막에 더해지는 압축 응력은 감소시키고, 다이 상에 제공되는 완충층에 의해 인장 응력은 증대시키는 단계와 함께 수행되는 것을 특징으로 하는 리드 프레임에 막을 고착하는 방법.Punching the membrane with a punch to provide a punched membrane; Placing a punched film on a leadframe heated on a heating plate; Compressing the punched film on the lead frame on the heating plate with a punch so that the punched film adheres to the lead frame; Wherein the punching step is performed with the step of reducing the compressive stress applied to the film and increasing the tensile stress by the buffer layer provided on the die. 사전결정된 형상으로 막을 펀칭하여 펀칭된 막을 제공하기 위한 상하 이동 펀치와; 펀치와 협응하며, 펀칭될 막이 놓이는 다이와; 펀칭된 막이 리드 프레임에 고착되도록, 리드 프레임을 가열하는 가열판을 포함하며; 다이는 펀칭되는 막이 놓이는 완충층이 제공되며, 완충층은 펀치를 위한 구멍을 가지는 것을 특징으로 하는 리드 프레임에 막을 고착하는 장치.A vertically movable punch for providing a punched film by punching the film into a predetermined shape; A die cooperating with the punch and having a membrane to be punched; And a heating plate for heating the lead frame so that the punched film adheres to the lead frame; Wherein the die is provided with a buffer layer on which the film to be punched is placed, and the buffer layer has a hole for punching. 제2항에 있어서, 상기완충층은 구멍의 내주면 가장자리에 만곡부를 가지는 것을 특징으로 하는 리드 프레임에 막을 고착하는 장치.3. The apparatus of claim 2, wherein the buffer layer has a curved portion at an inner peripheral edge of the hole. 제2항에 있어서, 상기 완충층은 상기 펀칭되는 막의 두께의 오분의 일 내지 다섯 배의 두께를 가지는 것을 특징으로 하는 리드 프레임에 막을 고착하는 장치.3. The apparatus of claim 2, wherein the buffer layer has a thickness of one fifth to five times the thickness of the punched film. 제2항에 있어서, 상기 완충층은 하나 이상의 비철 금속으로 제조되는 것을 특징으로 하는 리드 프레임에 막을 고착하는 장치.3. The apparatus of claim 2, wherein the buffer layer is made of one or more non-ferrous metals. 제2항에 있어서, 상기 완충층은 하나 이상의 탄성 물질로 제조되는 것을 특징으로 하는 리드 프레임에 막을 고착하는 장치.3. The apparatus of claim 2, wherein the buffer layer is made of one or more elastic materials. ※ 참고사항: 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960012250A 1996-04-22 1996-04-22 Method and device for fixing the membrane to the leadframe KR100368816B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960012250A KR100368816B1 (en) 1996-04-22 1996-04-22 Method and device for fixing the membrane to the leadframe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960012250A KR100368816B1 (en) 1996-04-22 1996-04-22 Method and device for fixing the membrane to the leadframe

Publications (2)

Publication Number Publication Date
KR970072354A true KR970072354A (en) 1997-11-07
KR100368816B1 KR100368816B1 (en) 2003-06-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960012250A KR100368816B1 (en) 1996-04-22 1996-04-22 Method and device for fixing the membrane to the leadframe

Country Status (1)

Country Link
KR (1) KR100368816B1 (en)

Also Published As

Publication number Publication date
KR100368816B1 (en) 2003-06-19

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