KR970063658A - Substrate Processing Equipment - Google Patents

Substrate Processing Equipment Download PDF

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Publication number
KR970063658A
KR970063658A KR1019970002502A KR19970002502A KR970063658A KR 970063658 A KR970063658 A KR 970063658A KR 1019970002502 A KR1019970002502 A KR 1019970002502A KR 19970002502 A KR19970002502 A KR 19970002502A KR 970063658 A KR970063658 A KR 970063658A
Authority
KR
South Korea
Prior art keywords
substrate
unit
processing
processing apparatus
cassette
Prior art date
Application number
KR1019970002502A
Other languages
Korean (ko)
Other versions
KR100272652B1 (en
Inventor
츠구오 나카무라
츠토무 히로오카
Original Assignee
이시다 아키라
다이니폰 스크린세이조우 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이시다 아키라, 다이니폰 스크린세이조우 가부시키가이샤 filed Critical 이시다 아키라
Publication of KR970063658A publication Critical patent/KR970063658A/en
Application granted granted Critical
Publication of KR100272652B1 publication Critical patent/KR100272652B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 기판을 수납하는 카셋의 이동 거리를 작게 할 수 있으며, 카셋의 자동반송장치의 배치를 용이하게 할 수 있는 기판처리장치에 관한 것으로, 본 발명은 기판반송부(18)와 처리부(12)가 평행하게 배치되고, 기판 수입부(10)와 기판배출부(14)가 인접한 위치에 일체적으로 배치된다. 기판수입부(10)에 반입된 카셋으로부터 취출된 기판(20)은 기판수수 수단(22a)을 통해 기판반송부(18)에 받아들여져서 기판반송부(18)의 타단까지 반송되고, 기판반송부(18)의 타단에서 반송방향이 180도 변경된 후에 처리부(12)에 투입된다. 처리부(12)에서 반송되면서 소정의 처리가 이루어진 기판(20)은 기판수수 수단(22b)을 통해 기판배출부(14)에 배출되어 카셋에 수납되며, 기판배출부(14)로부터 다음 공정으로 반송된다.The present invention relates to a substrate processing apparatus capable of reducing the moving distance of a cassette for storing a substrate and facilitating the arrangement of the automatic transfer device of the cassette. The present invention relates to a substrate transfer unit 18 and a processing unit 12. ) Are arranged in parallel, and the substrate importing portion 10 and the substrate ejecting portion 14 are integrally disposed at adjacent positions. The substrate 20 taken out from the cassette carried into the substrate import section 10 is received by the substrate transport section 18 through the substrate transport means 22a and transported to the other end of the substrate transport section 18, and the substrate transport is carried out. After the conveyance direction is changed 180 degrees at the other end of the unit 18, it is fed into the processing unit 12. The substrate 20 which has been subjected to the predetermined processing while being conveyed by the processing unit 12 is discharged to the substrate discharge unit 14 through the substrate receiving unit 22b and stored in the cassette, and is transferred from the substrate discharge unit 14 to the next step. do.

Description

기판처리장치Substrate Processing Equipment

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명에 관한 기판처리장치의 일실시 형태의 구성도이다.1 is a configuration diagram of an embodiment of a substrate processing apparatus according to the present invention.

Claims (7)

미처리 기판을 받아들이는 기판수입부와, 상기 기판수입부가 받아들인 미처리 기판을 반송하면서 소정의 처리를 행하는 처리부와, 상기 처리부에 의해 처리된 기판을 배출하는 기판배출부와, 상기 처리부와 접속되고, 상기 기판수입부로부터 받아들인 기판을 기판배출부까지 반송하는 경로를 상기 처리부와 함께 형성하는 기판반송부를 포함하며, 상기 기판수입부와 상기 기판배출부가 일체적으로 배치된 것을 특징으로 하는 기판처리장치.A substrate import unit for receiving an unprocessed substrate, a processing unit for carrying out a predetermined process while conveying an unprocessed substrate accepted by the substrate import unit, a substrate discharge unit for discharging the substrate processed by the processing unit, and connected to the processing unit, And a substrate conveying portion for forming a path for conveying the substrate received from the substrate importing portion to the substrate ejecting portion together with the processing portion, wherein the substrate importing portion and the substrate ejecting portion are integrally disposed. . 제1항에 있어서, 상기 기판반송부는 기판을 수평상태인 채로 반송하는 것을 특징으로 하는 기판처리장치.The substrate processing apparatus of claim 1, wherein the substrate transfer unit transfers the substrate in a horizontal state. 제1항에 있어서, 상기 기판반송부는 기판을 수직으로 세운 상태에서 반송하는 것을 특징으로 하는 기판처리장치.The substrate processing apparatus of claim 1, wherein the substrate transfer unit carries the substrate in a vertical position. 제1항에 있어서, 상기 처리부와 상기 기판반송부가 상하 2단으로 배치된 것을 특징으로 하는 기판처리장치.The substrate processing apparatus of claim 1, wherein the processing unit and the substrate transfer unit are disposed in two upper and lower stages. 제1항 내지 제4항의 어느 한 항에 있어서, 상기 기판수입부 및 상기 기판배출부에는 상기 처리부 및 상기 기판반송부 사이에서 기판의 수수를 행하는 기판수수 수단이 접속되어 있는 것을 특징으로 하는 기판처리장치.5. The substrate processing according to any one of claims 1 to 4, wherein the substrate receiving portion and the substrate discharge portion are connected with substrate receiving means for receiving the substrate between the processing portion and the substrate conveying portion. Device. 제5항에 있어서, 상기 기판수수 수단은 상기 기판수입부 및 상기 기판배출부에 공통으로 1대 배설되어 있는 것을 특징으로 하는 기판처리장치.6. The substrate processing apparatus according to claim 5, wherein the substrate receiving means is disposed in common with the substrate importing portion and the substrate ejecting portion. 제1항 내지 제6항의 어느 한 항에 있어서, 상기 기판수입부 및 상기 기판배출부를 같은 쪽에 배치되도록 다수대 나란히 사용되는 것을 특징으로 하는 기판처리장치.The substrate processing apparatus according to any one of claims 1 to 6, wherein a plurality of the substrate importing portion and the substrate ejecting portion are used side by side so as to be disposed on the same side. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019970002502A 1996-02-01 1997-01-28 Apparatus for wafer treatment KR100272652B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP96-16882 1996-02-01
JP8016882A JPH09213763A (en) 1996-02-01 1996-02-01 Substrate processing device

Publications (2)

Publication Number Publication Date
KR970063658A true KR970063658A (en) 1997-09-12
KR100272652B1 KR100272652B1 (en) 2000-12-01

Family

ID=11928553

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970002502A KR100272652B1 (en) 1996-02-01 1997-01-28 Apparatus for wafer treatment

Country Status (2)

Country Link
JP (1) JPH09213763A (en)
KR (1) KR100272652B1 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120318A (en) * 1992-10-08 1994-04-28 Fuji Electric Co Ltd Wafer washer
JP3151582B2 (en) * 1993-04-28 2001-04-03 東京エレクトロン株式会社 Vacuum processing equipment

Also Published As

Publication number Publication date
JPH09213763A (en) 1997-08-15
KR100272652B1 (en) 2000-12-01

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