KR970060354A - Position adjusting method and device - Google Patents

Position adjusting method and device Download PDF

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Publication number
KR970060354A
KR970060354A KR1019960082557A KR19960082557A KR970060354A KR 970060354 A KR970060354 A KR 970060354A KR 1019960082557 A KR1019960082557 A KR 1019960082557A KR 19960082557 A KR19960082557 A KR 19960082557A KR 970060354 A KR970060354 A KR 970060354A
Authority
KR
South Korea
Prior art keywords
mark
substrate
mask
reference mark
alignment system
Prior art date
Application number
KR1019960082557A
Other languages
Korean (ko)
Inventor
마사히로 네이
Original Assignee
고노 시게오
니콘 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 고노 시게오, 니콘 코포레이션 filed Critical 고노 시게오
Publication of KR970060354A publication Critical patent/KR970060354A/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7065—Production of alignment light, e.g. light source, control of coherence, polarization, pulse length, wavelength
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

이동가능한 정렬 센서의 광학조정용 기준마크에 위치에 의한 제조오차가 있는 경우에도, 고도로 정밀하게 위치조정을 행한다. XY 평면내에서뿐 아니라, Z 방향으로도 이동가능한 정렬 센서를 노과용 데이타 파일에 설정된 웨이퍼 마크(WM)의 위치에 맞추어 이동시키고, 십자선 마크(RM)와 기준마크부재(16)상의 기준마크(KMX1)와의 위치편차량(△X1)을 측정한다. 최초로 오프셋을 추가한 위치에 정렬 센서(1)의 측정점이 위치결정되도록 기준마크(KMX1)를 이동시켰을 때의 이동량(X2)을 측정하고, 기준마크(KMX1)의 마크 피치(p)를 정수배(n)한 양(pn)과 이동량(X2)과의 차(△X2) 및 위치편차량(△X3)을 측정한다. 그 다음에는 기준마크의 제조오차(b)를 b=△X2-(△X3-△X1)에 의하여 계산한다. 이 평균오차에 의하여 보정된 베이스라인양에 근거하여, 예를 들면 다이-바이-다이 방식으로 노광을 행한다.Even if there is a manufacturing error due to position in the optical adjustment reference mark of the movable alignment sensor, the position adjustment is performed with high precision. The alignment sensor movable not only in the XY plane but also in the Z direction is moved in accordance with the position of the wafer mark WM set in the overwork data file, and the cross mark RM and the reference mark on the reference mark member 16 Measure the positional deviation (ΔX1) with KMX1). The movement amount X2 when the reference mark KMX1 is moved so that the measurement point of the alignment sensor 1 is positioned at the position where the offset is first added is measured, and the mark pitch p of the reference mark KMX1 is multiplied by an integer ( n) The difference (ΔX2) and the positional deviation amount (ΔX3) between the amount pN and the movement amount X2 are measured. Next, the manufacturing error b of the reference mark is calculated by b = ΔX2- (ΔX3-ΔX1). Exposure is performed by, for example, a die-by-die method based on the baseline amount corrected by this average error.

Description

위치조정방법 및 장치Position adjusting method and device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 의한 위치 조정방법의 실시형태의 일예를 도시한 흐름도.1 is a flowchart showing an example of an embodiment of a position adjusting method according to the present invention.

제2도는 실시형태에서 사용되는 투영노광장치의 일예를 도시한 개략구성도.2 is a schematic configuration diagram showing an example of a projection exposure apparatus used in the embodiment.

제3도는 제2도의 투영노광장치에 사용되는 기준마크부재상의 각종 기준마크를 도시한 확대평면도.3 is an enlarged plan view showing various reference marks on the reference mark member used in the projection exposure apparatus of FIG.

Claims (3)

소정의 정렬광을 이용하여 마스크상의 위치조정용 마크와 기판 스테이지상에 놓여있는 감광성 기판상의 위치조정용 마크와의 상대적 위치편차량을 검출하는 정렬계를 이용하여 상기 마스크와 기판의 위치조정을 행하는 위치조정방법으로서, 기판 스테이지를 구동시켜서 기준마크를 소정의 기준위치로 이동시키고, 정렬계를 기판상의 위치조정용 마크의 위치에 맞추어 이동시켜서, 정렬계에 의하여 마스크사의 위치조정용 마크와 기준마크와의 제1위치편차량을 계측하는 제1공정, 기판 스테이지를 구동시켜서 기준마크의 소정부분을 정렬계의 검출점으로 이동시키고, 정렬계에 의하여 마스크상의 위치조정마크와 기준마크와의 제2위치 편차량을 계측하는 제2공정, 제1 및 제2 위치편차량의 차분을 산출하고, 이 산출결과에 근거하여 마스크와 기판의 상대위치를 보정하는 제3공정이 포함되어 있는 것을 특징으로 하는 위치조정방법.Position adjustment for adjusting the position of the mask and the substrate by using an alignment system that detects the relative positional deviation between the position adjustment mark on the mask and the position adjustment mark on the photosensitive substrate using a predetermined alignment light. As a method, the substrate stage is driven to move the reference mark to a predetermined reference position, and the alignment system is moved in accordance with the position of the position adjusting mark on the substrate, whereby the alignment system is used to firstly position the mark for positioning the mask yarn and the reference mark. In the first step of measuring the positional deviation amount, the substrate stage is driven to move a predetermined portion of the reference mark to the detection point of the alignment system, and the second alignment deviation of the position adjustment mark on the mask and the reference mark is adjusted by the alignment system. The difference between the second step of measurement and the first and second positional deviation amounts is calculated, and the mask and the substrate are And a third step of correcting the relative position. 제1항에 있어서, 제3공정에서의 상대위치의 보정이 정렬계에 의하여 기판상의 검출중심과 노광중심과의 간격을 계측하기 위한 베이스라인 계측시에 행하여지는 것을 특징으로 하는 위치조정방법.The position adjustment method according to claim 1, wherein the correction of the relative position in the third step is performed at the time of baseline measurement for measuring the distance between the detection center and the exposure center on the substrate by means of an alignment system. 마스크와 기판의 위치조정을 행하는 위치조정장치로서, 기판상의 위치조정용 마스크의 형성위치에 따라 이동할 수 있게 제공되어 있고, 마스크의 위치조정마트와 기판상의 위치조정용 마크와의 상대적 위치편차량을 계측하는 정렬계, 기판 스테이지상에 배치되어 있고, 정렬계의 조정을 위한 기준마크가 형성되어 있는 기준마크부재, 기준마크를 소정의 거리만 이동시켰을 때, 정렬계에 의하여, 마스크상의 위치 조정용 마크와 기준마크와의 위치편차량의 차분을 산출하는 산출수단, 이러한 산출수단의 산출결과에 근거하여 마스크와 기판의 상대위치를 제어하는 제어수단 등이 포함되어 있는 것을 특징으로 하는 위치조정장치.A position adjusting device for adjusting the position of the mask and the substrate, the position adjusting device being provided so as to be movable in accordance with the position of formation of the position adjusting mask on the substrate, and measuring the relative positional deviation between the position adjusting mart of the mask and the position adjusting mark on the substrate. When the reference mark member disposed on the alignment system and the substrate stage and the reference mark for adjusting the alignment system is formed, and the reference mark is moved only a predetermined distance, the alignment mark and the reference mark on the mask are moved by the alignment system. Calculating means for calculating a difference between the positional deviation amount from the mark, and control means for controlling the relative position between the mask and the substrate based on the calculation result of the calculating means. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019960082557A 1996-01-30 1996-12-31 Position adjusting method and device KR970060354A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8013624A JPH09213601A (en) 1996-01-30 1996-01-30 Exposing method and aligner
JP13624/1996 1996-01-30

Publications (1)

Publication Number Publication Date
KR970060354A true KR970060354A (en) 1997-08-12

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Application Number Title Priority Date Filing Date
KR1019960082557A KR970060354A (en) 1996-01-30 1996-12-31 Position adjusting method and device

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JP (1) JPH09213601A (en)
KR (1) KR970060354A (en)

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JP2005010207A (en) 2003-06-16 2005-01-13 Olympus Corp Camera-shake correcting device

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JPH09213601A (en) 1997-08-15

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