KR970056049U - Wafer handling device of sputter system for semiconductor manufacturing process - Google Patents

Wafer handling device of sputter system for semiconductor manufacturing process

Info

Publication number
KR970056049U
KR970056049U KR2019960005786U KR19960005786U KR970056049U KR 970056049 U KR970056049 U KR 970056049U KR 2019960005786 U KR2019960005786 U KR 2019960005786U KR 19960005786 U KR19960005786 U KR 19960005786U KR 970056049 U KR970056049 U KR 970056049U
Authority
KR
South Korea
Prior art keywords
manufacturing process
semiconductor manufacturing
handling device
wafer handling
sputter system
Prior art date
Application number
KR2019960005786U
Other languages
Korean (ko)
Other versions
KR200143987Y1 (en
Inventor
유진석
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019960005786U priority Critical patent/KR200143987Y1/en
Publication of KR970056049U publication Critical patent/KR970056049U/en
Application granted granted Critical
Publication of KR200143987Y1 publication Critical patent/KR200143987Y1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
KR2019960005786U 1996-03-25 1996-03-25 Wafer handling apparatus of sputtering system for semiconductor fabrication process KR200143987Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019960005786U KR200143987Y1 (en) 1996-03-25 1996-03-25 Wafer handling apparatus of sputtering system for semiconductor fabrication process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019960005786U KR200143987Y1 (en) 1996-03-25 1996-03-25 Wafer handling apparatus of sputtering system for semiconductor fabrication process

Publications (2)

Publication Number Publication Date
KR970056049U true KR970056049U (en) 1997-10-13
KR200143987Y1 KR200143987Y1 (en) 1999-06-15

Family

ID=19452475

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019960005786U KR200143987Y1 (en) 1996-03-25 1996-03-25 Wafer handling apparatus of sputtering system for semiconductor fabrication process

Country Status (1)

Country Link
KR (1) KR200143987Y1 (en)

Also Published As

Publication number Publication date
KR200143987Y1 (en) 1999-06-15

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