KR970053682A - High heat dissipation package using thermoelectric element - Google Patents

High heat dissipation package using thermoelectric element Download PDF

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Publication number
KR970053682A
KR970053682A KR1019950068135A KR19950068135A KR970053682A KR 970053682 A KR970053682 A KR 970053682A KR 1019950068135 A KR1019950068135 A KR 1019950068135A KR 19950068135 A KR19950068135 A KR 19950068135A KR 970053682 A KR970053682 A KR 970053682A
Authority
KR
South Korea
Prior art keywords
heat dissipation
thermoelectric element
high heat
dissipation package
bonding pads
Prior art date
Application number
KR1019950068135A
Other languages
Korean (ko)
Inventor
최종근
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950068135A priority Critical patent/KR970053682A/en
Publication of KR970053682A publication Critical patent/KR970053682A/en

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Abstract

본 발명은 고발열형 패키지에 관한 것으로, 반도체 소자들의 냉각 원리를 이용하여 상기 인쇄회로기판의 일 측면 상에 열전 소자들을 설치하여 그 패키지에 실장된 칩들의 발열을 신속하게 대기 중으로 방열할 수 있도록 하여 패키지의 열적 신뢰성을 개선할 수 있는 특징을 갖는다.The present invention relates to a high heat generation package, by installing thermoelectric elements on one side of the printed circuit board by using the cooling principle of semiconductor devices to quickly dissipate heat generated by the chips mounted in the package to the atmosphere. Has a feature that can improve the thermal reliability of the package.

Description

열전 소자를 이용한 고방열형 패키지High heat dissipation package using thermoelectric element

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명에 의한 열전 소자를 이용한 고방열형 패키지를 개략적으로 나타내는 평면도.1 is a plan view schematically showing a high heat dissipation package using a thermoelectric element according to the present invention.

Claims (4)

복수개의 본딩 패드들을 갖는 여러 개의 칩들과; 그 본딩 패드들에 각기 대응되어 전기적 연결된 기판본딩 패드들과, 회로 배선들을 갖는 인쇄회로기판과; 상기 기판 본딩 패드들에 각기 대응되어 전기적 연결된 리드들과; 상기 인쇄회로기판의 일 측면에 설치된 복수개의 열전 소자들을 갖는 흡·방열판과; 상기 칩들, 인쇄회로기판의 다른 면 및 본딩 와이어를 포함하는 전기적 연결 부분을 내재·봉지한 밀봉재를 포함하는 것을 특징으로 하는 열전 소자를 이용한 고방열형 패키지.A plurality of chips having a plurality of bonding pads; A printed circuit board having substrate bonding pads electrically connected to the bonding pads and electrically connected to the bonding pads; Leads respectively corresponding to the substrate bonding pads; A heat absorption plate having a plurality of thermoelectric elements installed on one side of the printed circuit board; The heat dissipation package using a thermoelectric element characterized in that it comprises a sealing material in which the chip, the other side of the printed circuit board and the electrical connection portion including the bonding wire. 제1항에 있어서, 상기 열전 소자가 n형 반도체 소자를 중심으로 급속판이 양단에 각기 접촉 설치된 것을 특징으로 하는 열전 소자를 이용한 고방열형 패키지.2. The high heat dissipation package according to claim 1, wherein the thermoelectric element is disposed in contact with both ends of the rapid plate, centering on the n-type semiconductor element. 제1항에 있어서, 상기 봉지재가 밀봉재에 의해 밀봉된 것을 특징으로 하는 열전 소자를 이용한 고방열형 패키지.The high heat dissipation package using a thermoelectric element according to claim 1, wherein the encapsulation material is sealed by a sealing material. 제3항에 있어서, 상기 봉지재가 실 그래스인 것을 특징으로 하는 열전 소자를 이용한 고방열형 패키지.4. The high heat dissipation package using a thermoelectric element according to claim 3, wherein the encapsulant is seal grass. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950068135A 1995-12-30 1995-12-30 High heat dissipation package using thermoelectric element KR970053682A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950068135A KR970053682A (en) 1995-12-30 1995-12-30 High heat dissipation package using thermoelectric element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950068135A KR970053682A (en) 1995-12-30 1995-12-30 High heat dissipation package using thermoelectric element

Publications (1)

Publication Number Publication Date
KR970053682A true KR970053682A (en) 1997-07-31

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ID=66638489

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950068135A KR970053682A (en) 1995-12-30 1995-12-30 High heat dissipation package using thermoelectric element

Country Status (1)

Country Link
KR (1) KR970053682A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990025706A (en) * 1997-09-13 1999-04-06 윤종용 Microcard type package and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990025706A (en) * 1997-09-13 1999-04-06 윤종용 Microcard type package and its manufacturing method

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