KR970053682A - High heat dissipation package using thermoelectric element - Google Patents
High heat dissipation package using thermoelectric element Download PDFInfo
- Publication number
- KR970053682A KR970053682A KR1019950068135A KR19950068135A KR970053682A KR 970053682 A KR970053682 A KR 970053682A KR 1019950068135 A KR1019950068135 A KR 1019950068135A KR 19950068135 A KR19950068135 A KR 19950068135A KR 970053682 A KR970053682 A KR 970053682A
- Authority
- KR
- South Korea
- Prior art keywords
- heat dissipation
- thermoelectric element
- high heat
- dissipation package
- bonding pads
- Prior art date
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
본 발명은 고발열형 패키지에 관한 것으로, 반도체 소자들의 냉각 원리를 이용하여 상기 인쇄회로기판의 일 측면 상에 열전 소자들을 설치하여 그 패키지에 실장된 칩들의 발열을 신속하게 대기 중으로 방열할 수 있도록 하여 패키지의 열적 신뢰성을 개선할 수 있는 특징을 갖는다.The present invention relates to a high heat generation package, by installing thermoelectric elements on one side of the printed circuit board by using the cooling principle of semiconductor devices to quickly dissipate heat generated by the chips mounted in the package to the atmosphere. Has a feature that can improve the thermal reliability of the package.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제1도는 본 발명에 의한 열전 소자를 이용한 고방열형 패키지를 개략적으로 나타내는 평면도.1 is a plan view schematically showing a high heat dissipation package using a thermoelectric element according to the present invention.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950068135A KR970053682A (en) | 1995-12-30 | 1995-12-30 | High heat dissipation package using thermoelectric element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950068135A KR970053682A (en) | 1995-12-30 | 1995-12-30 | High heat dissipation package using thermoelectric element |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970053682A true KR970053682A (en) | 1997-07-31 |
Family
ID=66638489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950068135A KR970053682A (en) | 1995-12-30 | 1995-12-30 | High heat dissipation package using thermoelectric element |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970053682A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990025706A (en) * | 1997-09-13 | 1999-04-06 | 윤종용 | Microcard type package and its manufacturing method |
-
1995
- 1995-12-30 KR KR1019950068135A patent/KR970053682A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990025706A (en) * | 1997-09-13 | 1999-04-06 | 윤종용 | Microcard type package and its manufacturing method |
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Legal Events
Date | Code | Title | Description |
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WITN | Withdrawal due to no request for examination |