KR970053143A - Lead frame transfer device of automatic molding press for manufacturing semiconductor package - Google Patents
Lead frame transfer device of automatic molding press for manufacturing semiconductor package Download PDFInfo
- Publication number
- KR970053143A KR970053143A KR1019950065454A KR19950065454A KR970053143A KR 970053143 A KR970053143 A KR 970053143A KR 1019950065454 A KR1019950065454 A KR 1019950065454A KR 19950065454 A KR19950065454 A KR 19950065454A KR 970053143 A KR970053143 A KR 970053143A
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- guide rail
- semiconductor package
- molding press
- manufacturing
- Prior art date
Links
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
본 발명은 반도체 패키지 제조용 자동몰딩프레스의 리드프레임 이송장치에 관한 것으로, 와이어본딩된 리드프레임을 예열기유니트로 안전하고, 신속하게 이송시키기 위한 리드프레임 이송장치로서, 리드프레임이 이송되는 가이드레일과, 상기 가이드레일의 하부에 설치되어 모터의 구동에 의해 회전되는 구동롤러와, 상기 가이드레일의 상부에 설치되며 구동롤러와 일직선상에 위치되고, 실린더에 의해 상·하 작동되며, 내부에 압축스프링이 설치된 피드롤러와, 상기 가이드레일의 선단에 위치되어 구동롤러와 피드롤러에 의해 이송된 리드프레임을 완전히 예열기유니트 안으로 밀어주는 푸셔핑거로 구성된 것을 특징으로 하는 반도체패키지 제조용 리드프레임 이송장치이다.The present invention relates to a lead frame conveying apparatus for an automatic molding press for manufacturing a semiconductor package. The driving roller is installed in the lower part of the guide rail and rotated by the driving of the motor, and the upper part of the guide rail is installed in the same direction as the driving roller, and is operated up and down by a cylinder. It is a lead frame conveying apparatus for manufacturing a semiconductor package, characterized in that consisting of a feed roller installed and a pusher finger which is located at the tip of the guide rail and pushes the lead frame conveyed by the drive roller and the feed roller completely into the preheater unit.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제1도는 본 발명이 적용된 자동몰딩프레스의 전체구성을 도시한 정면도.1 is a front view showing the overall configuration of the automatic molding press to which the present invention is applied.
제2도는 본 발명의 구성을 나타낸 정면도.2 is a front view showing the configuration of the present invention.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950065454A KR970053143A (en) | 1995-12-29 | 1995-12-29 | Lead frame transfer device of automatic molding press for manufacturing semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950065454A KR970053143A (en) | 1995-12-29 | 1995-12-29 | Lead frame transfer device of automatic molding press for manufacturing semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970053143A true KR970053143A (en) | 1997-07-29 |
Family
ID=66622625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950065454A KR970053143A (en) | 1995-12-29 | 1995-12-29 | Lead frame transfer device of automatic molding press for manufacturing semiconductor package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970053143A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100749120B1 (en) * | 2007-05-17 | 2007-08-13 | 주식회사 상진미크론 | Feeder for fine blanking press |
-
1995
- 1995-12-29 KR KR1019950065454A patent/KR970053143A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100749120B1 (en) * | 2007-05-17 | 2007-08-13 | 주식회사 상진미크론 | Feeder for fine blanking press |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |