KR970053143A - Lead frame transfer device of automatic molding press for manufacturing semiconductor package - Google Patents

Lead frame transfer device of automatic molding press for manufacturing semiconductor package Download PDF

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Publication number
KR970053143A
KR970053143A KR1019950065454A KR19950065454A KR970053143A KR 970053143 A KR970053143 A KR 970053143A KR 1019950065454 A KR1019950065454 A KR 1019950065454A KR 19950065454 A KR19950065454 A KR 19950065454A KR 970053143 A KR970053143 A KR 970053143A
Authority
KR
South Korea
Prior art keywords
lead frame
guide rail
semiconductor package
molding press
manufacturing
Prior art date
Application number
KR1019950065454A
Other languages
Korean (ko)
Inventor
이종하
Original Assignee
황인길
아남산업 주식회사
정헌태
아남정공 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 황인길, 아남산업 주식회사, 정헌태, 아남정공 주식회사 filed Critical 황인길
Priority to KR1019950065454A priority Critical patent/KR970053143A/en
Publication of KR970053143A publication Critical patent/KR970053143A/en

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

본 발명은 반도체 패키지 제조용 자동몰딩프레스의 리드프레임 이송장치에 관한 것으로, 와이어본딩된 리드프레임을 예열기유니트로 안전하고, 신속하게 이송시키기 위한 리드프레임 이송장치로서, 리드프레임이 이송되는 가이드레일과, 상기 가이드레일의 하부에 설치되어 모터의 구동에 의해 회전되는 구동롤러와, 상기 가이드레일의 상부에 설치되며 구동롤러와 일직선상에 위치되고, 실린더에 의해 상·하 작동되며, 내부에 압축스프링이 설치된 피드롤러와, 상기 가이드레일의 선단에 위치되어 구동롤러와 피드롤러에 의해 이송된 리드프레임을 완전히 예열기유니트 안으로 밀어주는 푸셔핑거로 구성된 것을 특징으로 하는 반도체패키지 제조용 리드프레임 이송장치이다.The present invention relates to a lead frame conveying apparatus for an automatic molding press for manufacturing a semiconductor package. The driving roller is installed in the lower part of the guide rail and rotated by the driving of the motor, and the upper part of the guide rail is installed in the same direction as the driving roller, and is operated up and down by a cylinder. It is a lead frame conveying apparatus for manufacturing a semiconductor package, characterized in that consisting of a feed roller installed and a pusher finger which is located at the tip of the guide rail and pushes the lead frame conveyed by the drive roller and the feed roller completely into the preheater unit.

Description

반도체패키지 제조용 자동몰딩프레스의 리드프레임 이송장치Lead frame transfer device of automatic molding press for manufacturing semiconductor package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명이 적용된 자동몰딩프레스의 전체구성을 도시한 정면도.1 is a front view showing the overall configuration of the automatic molding press to which the present invention is applied.

제2도는 본 발명의 구성을 나타낸 정면도.2 is a front view showing the configuration of the present invention.

Claims (2)

리드프레임이 이송되는 가이드레일과, 상기 가이드레일의 하부에 설치되어 모터의 구동에 의해 회전되는 구동롤러와, 상기 가이드레일의 상부에 설치되며 구동롤러와 일직선상에 위치되고, 실린더에 의해 상·하 작동되며, 내부에 압축스프링이 설치된 피드롤러와, 상기 가이드레일의 선단에 위치되어 구동롤러와 피드롤러에 의해 이송된 리드프레임을 완전히 예열기유니트 안으로 밀어주는 푸셔핑거로 구성된 것을 특징으로 하는 반도체패키지 제조용 리드프레임 이송장치.A guide rail to which the lead frame is conveyed, a drive roller installed at a lower portion of the guide rail, and rotated by driving of a motor, and installed on an upper portion of the guide rail and located in a line with the drive roller. A semiconductor package comprising a feed roller having a compression spring installed therein and a pusher finger positioned at the tip of the guide rail to push the lead frame transferred by the drive roller and the feed roller into the preheater unit. Leadframe feeder for manufacturing. 제1항에 있어서, 상기 푸셔핑거는 가이드레일의 선단과 예열유니트 사이에서 직선운동하는 것을 특징으로 하는 반도체패키지 제조용 리드프레임 이송장치.The lead frame transfer apparatus for manufacturing a semiconductor package according to claim 1, wherein the pusher finger linearly moves between the tip of the guide rail and the preheating unit. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950065454A 1995-12-29 1995-12-29 Lead frame transfer device of automatic molding press for manufacturing semiconductor package KR970053143A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950065454A KR970053143A (en) 1995-12-29 1995-12-29 Lead frame transfer device of automatic molding press for manufacturing semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950065454A KR970053143A (en) 1995-12-29 1995-12-29 Lead frame transfer device of automatic molding press for manufacturing semiconductor package

Publications (1)

Publication Number Publication Date
KR970053143A true KR970053143A (en) 1997-07-29

Family

ID=66622625

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950065454A KR970053143A (en) 1995-12-29 1995-12-29 Lead frame transfer device of automatic molding press for manufacturing semiconductor package

Country Status (1)

Country Link
KR (1) KR970053143A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100749120B1 (en) * 2007-05-17 2007-08-13 주식회사 상진미크론 Feeder for fine blanking press

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100749120B1 (en) * 2007-05-17 2007-08-13 주식회사 상진미크론 Feeder for fine blanking press

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A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application