KR970052870U - Lead frame supply - Google Patents

Lead frame supply

Info

Publication number
KR970052870U
KR970052870U KR2019960003384U KR19960003384U KR970052870U KR 970052870 U KR970052870 U KR 970052870U KR 2019960003384 U KR2019960003384 U KR 2019960003384U KR 19960003384 U KR19960003384 U KR 19960003384U KR 970052870 U KR970052870 U KR 970052870U
Authority
KR
South Korea
Prior art keywords
lead frame
frame supply
supply
lead
frame
Prior art date
Application number
KR2019960003384U
Other languages
Korean (ko)
Other versions
KR200145265Y1 (en
Inventor
이덕표
Original Assignee
삼성항공산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업주식회사 filed Critical 삼성항공산업주식회사
Priority to KR2019960003384U priority Critical patent/KR200145265Y1/en
Publication of KR970052870U publication Critical patent/KR970052870U/en
Application granted granted Critical
Publication of KR200145265Y1 publication Critical patent/KR200145265Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Reciprocating Conveyors (AREA)
KR2019960003384U 1996-02-28 1996-02-28 Apparatus for supplying lead frame KR200145265Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019960003384U KR200145265Y1 (en) 1996-02-28 1996-02-28 Apparatus for supplying lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019960003384U KR200145265Y1 (en) 1996-02-28 1996-02-28 Apparatus for supplying lead frame

Publications (2)

Publication Number Publication Date
KR970052870U true KR970052870U (en) 1997-09-08
KR200145265Y1 KR200145265Y1 (en) 1999-06-15

Family

ID=19451133

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019960003384U KR200145265Y1 (en) 1996-02-28 1996-02-28 Apparatus for supplying lead frame

Country Status (1)

Country Link
KR (1) KR200145265Y1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101233220B1 (en) 2008-04-28 2013-02-15 세메스 주식회사 Lead frame transfer apparatus for die bonder
KR101422357B1 (en) * 2012-11-30 2014-07-22 세메스 주식회사 Apparatus for supplying a substrate

Also Published As

Publication number Publication date
KR200145265Y1 (en) 1999-06-15

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20080128

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee