KR960019171U - Lead frame - Google Patents

Lead frame

Info

Publication number
KR960019171U
KR960019171U KR2019940030757U KR19940030757U KR960019171U KR 960019171 U KR960019171 U KR 960019171U KR 2019940030757 U KR2019940030757 U KR 2019940030757U KR 19940030757 U KR19940030757 U KR 19940030757U KR 960019171 U KR960019171 U KR 960019171U
Authority
KR
South Korea
Prior art keywords
lead frame
lead
frame
Prior art date
Application number
KR2019940030757U
Other languages
Korean (ko)
Other versions
KR0123589Y1 (en
Inventor
표우열
Original Assignee
아남산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아남산업주식회사 filed Critical 아남산업주식회사
Priority to KR2019940030757U priority Critical patent/KR0123589Y1/en
Publication of KR960019171U publication Critical patent/KR960019171U/en
Application granted granted Critical
Publication of KR0123589Y1 publication Critical patent/KR0123589Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
KR2019940030757U 1994-11-21 1994-11-21 Leadframe KR0123589Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940030757U KR0123589Y1 (en) 1994-11-21 1994-11-21 Leadframe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940030757U KR0123589Y1 (en) 1994-11-21 1994-11-21 Leadframe

Publications (2)

Publication Number Publication Date
KR960019171U true KR960019171U (en) 1996-06-19
KR0123589Y1 KR0123589Y1 (en) 1998-10-01

Family

ID=19398629

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940030757U KR0123589Y1 (en) 1994-11-21 1994-11-21 Leadframe

Country Status (1)

Country Link
KR (1) KR0123589Y1 (en)

Also Published As

Publication number Publication date
KR0123589Y1 (en) 1998-10-01

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20040421

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee