KR960025503U - Lead frame structure - Google Patents

Lead frame structure

Info

Publication number
KR960025503U
KR960025503U KR2019940034334U KR19940034334U KR960025503U KR 960025503 U KR960025503 U KR 960025503U KR 2019940034334 U KR2019940034334 U KR 2019940034334U KR 19940034334 U KR19940034334 U KR 19940034334U KR 960025503 U KR960025503 U KR 960025503U
Authority
KR
South Korea
Prior art keywords
lead frame
frame structure
lead
frame
Prior art date
Application number
KR2019940034334U
Other languages
Korean (ko)
Other versions
KR200180000Y1 (en
Inventor
곽성범
신원선
Original Assignee
아남반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아남반도체주식회사 filed Critical 아남반도체주식회사
Priority to KR2019940034334U priority Critical patent/KR200180000Y1/en
Publication of KR960025503U publication Critical patent/KR960025503U/en
Application granted granted Critical
Publication of KR200180000Y1 publication Critical patent/KR200180000Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49544—Deformation absorbing parts in the lead frame plane, e.g. meanderline shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
KR2019940034334U 1994-12-16 1994-12-16 Lead frame structure KR200180000Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940034334U KR200180000Y1 (en) 1994-12-16 1994-12-16 Lead frame structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940034334U KR200180000Y1 (en) 1994-12-16 1994-12-16 Lead frame structure

Publications (2)

Publication Number Publication Date
KR960025503U true KR960025503U (en) 1996-07-22
KR200180000Y1 KR200180000Y1 (en) 2000-05-01

Family

ID=19401610

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940034334U KR200180000Y1 (en) 1994-12-16 1994-12-16 Lead frame structure

Country Status (1)

Country Link
KR (1) KR200180000Y1 (en)

Also Published As

Publication number Publication date
KR200180000Y1 (en) 2000-05-01

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Legal Events

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A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090213

Year of fee payment: 10

EXPY Expiration of term