KR970051978A - Dual Oxidizing Toxic Gas Scrubber - Google Patents

Dual Oxidizing Toxic Gas Scrubber Download PDF

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Publication number
KR970051978A
KR970051978A KR1019950048740A KR19950048740A KR970051978A KR 970051978 A KR970051978 A KR 970051978A KR 1019950048740 A KR1019950048740 A KR 1019950048740A KR 19950048740 A KR19950048740 A KR 19950048740A KR 970051978 A KR970051978 A KR 970051978A
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KR
South Korea
Prior art keywords
gas
flow rate
oxidation
toxic gas
toxic
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KR1019950048740A
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Korean (ko)
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KR0169834B1 (en
Inventor
오대곤
김정수
주흥로
김홍만
편광의
Original Assignee
양숭택
한국전자통신연구원
이준
한국전기통신공사
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Priority to KR1019950048740A priority Critical patent/KR0169834B1/en
Publication of KR970051978A publication Critical patent/KR970051978A/en
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Publication of KR0169834B1 publication Critical patent/KR0169834B1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F23COMBUSTION APPARATUS; COMBUSTION PROCESSES
    • F23GCREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
    • F23G7/00Incinerators or other apparatus for consuming industrial waste, e.g. chemicals
    • F23G7/06Incinerators or other apparatus for consuming industrial waste, e.g. chemicals of waste gases or noxious gases, e.g. exhaust gases
    • F23G7/061Incinerators or other apparatus for consuming industrial waste, e.g. chemicals of waste gases or noxious gases, e.g. exhaust gases with supplementary heating
    • F23G7/065Incinerators or other apparatus for consuming industrial waste, e.g. chemicals of waste gases or noxious gases, e.g. exhaust gases with supplementary heating using gaseous or liquid fuel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67248Temperature monitoring

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Treating Waste Gases (AREA)

Abstract

본 발명은 이중 산화방식의 유독가스 스크러버에 관한 것이다.The present invention relates to a double oxidation toxic gas scrubber.

본 발명의 유독가스 스크러버는 스크러버 캐비넷 내에, 공기, 질소 및 수소의 가스 압력을 조절하기 위한 복수개의 가스압력 조절기와 유량조절을 위한 복수개의 유량조절기 및 밸브로 이루어진 가스압력 및 유량 조절수단과, 반도체 제조공정에서 배출되어 공정가스 라인을 통해 유입된 유독성 공정가스를 흡착제거시키고, 상기한 가스 압력 및 유량조절수단에 의행 유량이 조절되어 유입된 공기 및 질소를 사용하여 탈착이 이루어지는 활성탄 저장용기로 구성되어 유독성 가스를 1차 산화시키기 위한 제1산화수단과, 일단은 상기한 제1산화수단과 직렬로 연결되고 타단은 열 배기관과 연결되며, 상기한 가스 압력 및 유량조절수단에 의해 유량이 조절되어 유입된 공기 및 수소를 사용하여 점화연소시키는 연소기로 구성되어 상기한 제1산화수단을 거쳐 배출된 유독성 가스를 2차 산화시키기 위한 제2산화수단이 포함되어 구성된다.Toxic gas scrubber of the present invention is a gas pressure and flow rate adjusting means consisting of a plurality of gas pressure regulator for regulating the gas pressure of air, nitrogen and hydrogen, and a plurality of flow regulators and valves for the flow rate control in the scrubber cabinet, semiconductor Adsorption and removal of toxic process gas discharged from the manufacturing process flowed through the process gas line, and the flow rate is controlled by the above gas pressure and flow rate control means consisting of activated carbon storage container desorption using the introduced air and nitrogen The first oxidation means for the primary oxidation of the toxic gas, one end is connected in series with the first oxidation means and the other end is connected to the heat exhaust pipe, the flow rate is controlled by the gas pressure and flow rate adjusting means Composed of a combustor for ignition and combustion using the introduced air and hydrogen through the first oxidation means And a second oxidation means for secondary oxidation of the emitted toxic gas.

Description

이중 산화방식의 유독가스 스크러버Dual Oxidizing Toxic Gas Scrubber

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 바람직한 실시예에 따른 유독가스 스크러버의 개략적인 구성도.1 is a schematic configuration diagram of a toxic gas scrubber according to a preferred embodiment of the present invention.

제2도는 제1도에 도시된 본 발명의 유독가스 스크러버 중 활성탄 저장용기의 상세 구성도.2 is a detailed configuration of the activated carbon storage container of the toxic gas scrubber of the present invention shown in FIG.

Claims (5)

스크러버 캐비넷 내에, 공기, 질소 및 수소의 가스 압력을 조절하기 위한 복수개의 가스압력 조절기와 유량조절을 위한 복수개의 유량조절기 및 밸브로 이루어진 가스압력 및 유량 조절수단과, 반도체 제조공정에서 배출되어 공정가스 라인을 통해 유입된 유독성 공정가스를 흡착제거시키고, 상기한 가스 압력 및 유량조절수단에 의해 유량이 조절되어 유입된 공기 및 질소를 사용하여 탈착이 이루어지는 활성탄 저장용기로 구성되어 유독성 가스를 1차 산화시키기는 위한 제1산화수단과, 일단은 상기한 제1산화수단과 직렬로 연결되고 타단은 열 배기관과 연결되며, 상기한 가스 압력 및 유량조절수단에 의해 유량이 조절되어 유입된 공기 및 수소를 사용하여 점화연소시키는 연소기로 구성되어 상기한 제1산화수단을 거쳐 배출된 유독성 가스를 2차 산화시키기 위한 제2산화수단이 포함되어 구성된 유독가스 스크러버.In the scrubber cabinet, a gas pressure and flow rate adjusting means consisting of a plurality of gas pressure regulators for adjusting the gas pressure of air, nitrogen and hydrogen, a plurality of flow regulators and valves for the flow rate control, and the process gas discharged from the semiconductor manufacturing process Adsorption and removal of toxic process gas introduced through the line, and the flow rate is controlled by the above-described gas pressure and flow rate control means consisting of activated carbon storage container desorbed using the introduced air and nitrogen to oxidize the toxic gas primary The first oxidation means for making, one end is connected in series with the first oxidation means and the other end is connected to the heat exhaust pipe, the flow rate is controlled by the gas pressure and flow rate adjusting means to flow the introduced air and hydrogen It is composed of a combustor to ignite and burn the secondary acid to the toxic gas discharged through the first oxidation means described above. The toxic gas scrubber configured includes a second means for oxidation. 제1항에 있어서, 상기한 활성탄 저장용기는 병렬로 복수개가 연결구성된 것을 특징으로 하는 유독가스 스크러버.The toxic gas scrubber according to claim 1, wherein the plurality of activated carbon storage containers are connected in parallel. 제1항에 있어서, 상기한 공정가스 라인에는 바이패스 밸브가 설치된 것을 특징으로 하는 유독가스 스크러버.The toxic gas scrubber according to claim 1, wherein a bypass valve is installed in the process gas line. 제1항에 있어서, 상기한 활성탄 저장용기는, 가스 입출구가 부설되고 공정가스를 흡착제거하기 위한 활성탄이 내부에 저장된 몸체와, 돔형으로 형성된 상부 뚜껑과, 상기한 몸체의 상단에 부설되며 몸체 내부의 압력을 측정하기 위한 압력계와, 몸체의 상하부에 부설되며 활성탄 분진의 휘산을 방지하기 위한 상부 및 하부필터와, 몸체 내부의 온도확인에 의해 활성탄의 재생시점, 재생 종료시점 및 최적의 산화조건을 확인할 수 있도록 몸체의 일측에 상하로 일정간격 이격되어 부설된 온도감지기로 구성된 것을 특징으로 하는 유독가스 스크러버.The method of claim 1, wherein the activated carbon storage container is a body in which a gas inlet and outlet is installed and activated carbon for adsorbing and removing process gas is stored therein, an upper lid formed in a dome shape, and is installed at an upper end of the body and is inside the body. Pressure gauge for measuring the pressure of the body, upper and lower filters installed at the upper and lower parts of the body to prevent volatilization of activated carbon dust, and the temperature at the inside of the body to check the regeneration time, end time and optimal oxidation conditions Toxic gas scrubber, characterized in that consisting of a temperature sensor placed at a predetermined interval spaced up and down on one side of the body so that you can check. 제1항에 있어서, 상기한 연소기는, 가스 입출구가 부설되고 유독가스의 잔류농도를 검출하기 위한 잔류농도 검출관이 상부 일측에 부설된 연소기 몸체와, 전기한 몸체의 하부에 부설된 석영관으로 이루어진 연소실과, 전기한 연소실의 내부 하측부에 부설되며 공기 및 수소를 사용하여 유독가스를 점화연소시키기 위한 점화연소 수단과, 전기한 몸체의 하단에 형성되고 전기한 석영관 연소실의 냉각 및 외부공기와의 차단을 위하여 전기한 가스 입구로부터 유입된 질소를 석영관의 외주연에 분사시키기 위한 질소 분사구와, 상기한 스크러버 캐비넷의 상단 외부에 위치하도록 전기한 몸체의 상단에 부설되어 배기량 조절 및 외부 열 배기관과의 연결부위 역할을 수행하는 유속조절용 댐퍼와, 상기한 몸체의 하단 일측에 형성되어 외부공기를 유입시키기 위한 외부 공기 유입문으로 구성된 것을 특징으로 하는 유독가스 스크러버.The combustor according to claim 1, wherein the combustor includes a combustor body in which a gas inlet and outlet is installed and a residual concentration detection tube for detecting residual concentration of toxic gas is installed on one side of the upper part, and a quartz tube installed on the lower part of the electric body. The combustion chamber which is made up, the ignition combustion means for igniting and igniting the toxic gas using air and hydrogen, and the cooling and external air of the quartz tube combustion chamber formed at the lower end of the electric body. Nitrogen injection port for injecting nitrogen introduced from the gas inlet to the outer periphery of the quartz tube for the purpose of interception with the gas pipe, and installed at the upper end of the electric body to be located outside the upper end of the scrubber cabinet to control the displacement and external heat. A flow rate control damper that serves as a connection portion with the exhaust pipe, and formed on one side of the lower end of the body to inflow external air Toxic gas scrubber, characterized in that consisting of an external air inlet door. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950048740A 1995-12-12 1995-12-12 Toxic gas scrubber using dual oxidation method KR0169834B1 (en)

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KR1019950048740A KR0169834B1 (en) 1995-12-12 1995-12-12 Toxic gas scrubber using dual oxidation method

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Application Number Priority Date Filing Date Title
KR1019950048740A KR0169834B1 (en) 1995-12-12 1995-12-12 Toxic gas scrubber using dual oxidation method

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KR970051978A true KR970051978A (en) 1997-07-29
KR0169834B1 KR0169834B1 (en) 1999-02-18

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020034406A (en) * 2000-11-01 2002-05-09 이후근 The methods of residual lifetime identification of a gas scrubber and operation of dual type gas scrubber

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100539454B1 (en) * 1998-09-22 2006-03-14 삼성전자주식회사 Scrubber for semiconductor device manufacturing equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020034406A (en) * 2000-11-01 2002-05-09 이후근 The methods of residual lifetime identification of a gas scrubber and operation of dual type gas scrubber

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Publication number Publication date
KR0169834B1 (en) 1999-02-18

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