KR970051801A - - Google Patents

Info

Publication number
KR970051801A
KR970051801A KR19950066116A KR19950066116A KR970051801A KR 970051801 A KR970051801 A KR 970051801A KR 19950066116 A KR19950066116 A KR 19950066116A KR 19950066116 A KR19950066116 A KR 19950066116A KR 970051801 A KR970051801 A KR 970051801A
Authority
KR
South Korea
Application number
KR19950066116A
Other languages
Korean (ko)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR19950066116A priority Critical patent/KR970051801A/ko
Publication of KR970051801A publication Critical patent/KR970051801A/ko

Links

KR19950066116A 1995-12-29 1995-12-29 KR970051801A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR19950066116A KR970051801A (en) 1995-12-29 1995-12-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR19950066116A KR970051801A (en) 1995-12-29 1995-12-29

Publications (1)

Publication Number Publication Date
KR970051801A true KR970051801A (en) 1997-07-29

Family

ID=85705049

Family Applications (1)

Application Number Title Priority Date Filing Date
KR19950066116A KR970051801A (en) 1995-12-29 1995-12-29

Country Status (1)

Country Link
KR (1) KR970051801A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100466199B1 (en) * 1997-12-31 2005-05-17 주식회사 하이닉스반도체 Device Separating Method of Semiconductor Device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04267336A (en) * 1991-02-22 1992-09-22 Nec Corp Manufacture of semiconductor device
JPH0513381A (en) * 1991-07-02 1993-01-22 Sony Corp Dry etching method
JPH05259269A (en) * 1992-03-11 1993-10-08 Sharp Corp Method for forming element separating region
US5298451A (en) * 1991-04-30 1994-03-29 Texas Instruments Incorporated Recessed and sidewall-sealed poly-buffered LOCOS isolation methods
JPH07235590A (en) * 1994-02-22 1995-09-05 Nec Corp Manufacture of semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04267336A (en) * 1991-02-22 1992-09-22 Nec Corp Manufacture of semiconductor device
US5298451A (en) * 1991-04-30 1994-03-29 Texas Instruments Incorporated Recessed and sidewall-sealed poly-buffered LOCOS isolation methods
JPH0513381A (en) * 1991-07-02 1993-01-22 Sony Corp Dry etching method
JPH05259269A (en) * 1992-03-11 1993-10-08 Sharp Corp Method for forming element separating region
JPH07235590A (en) * 1994-02-22 1995-09-05 Nec Corp Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100466199B1 (en) * 1997-12-31 2005-05-17 주식회사 하이닉스반도체 Device Separating Method of Semiconductor Device

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application