KR970051801A - - Google Patents
Info
- Publication number
- KR970051801A KR970051801A KR19950066116A KR19950066116A KR970051801A KR 970051801 A KR970051801 A KR 970051801A KR 19950066116 A KR19950066116 A KR 19950066116A KR 19950066116 A KR19950066116 A KR 19950066116A KR 970051801 A KR970051801 A KR 970051801A
- Authority
- KR
- South Korea
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR19950066116A KR970051801A (en) | 1995-12-29 | 1995-12-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR19950066116A KR970051801A (en) | 1995-12-29 | 1995-12-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970051801A true KR970051801A (en) | 1997-07-29 |
Family
ID=85705049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR19950066116A KR970051801A (en) | 1995-12-29 | 1995-12-29 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970051801A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100466199B1 (en) * | 1997-12-31 | 2005-05-17 | 주식회사 하이닉스반도체 | Device Separating Method of Semiconductor Device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04267336A (en) * | 1991-02-22 | 1992-09-22 | Nec Corp | Manufacture of semiconductor device |
JPH0513381A (en) * | 1991-07-02 | 1993-01-22 | Sony Corp | Dry etching method |
JPH05259269A (en) * | 1992-03-11 | 1993-10-08 | Sharp Corp | Method for forming element separating region |
US5298451A (en) * | 1991-04-30 | 1994-03-29 | Texas Instruments Incorporated | Recessed and sidewall-sealed poly-buffered LOCOS isolation methods |
JPH07235590A (en) * | 1994-02-22 | 1995-09-05 | Nec Corp | Manufacture of semiconductor device |
-
1995
- 1995-12-29 KR KR19950066116A patent/KR970051801A/ko not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04267336A (en) * | 1991-02-22 | 1992-09-22 | Nec Corp | Manufacture of semiconductor device |
US5298451A (en) * | 1991-04-30 | 1994-03-29 | Texas Instruments Incorporated | Recessed and sidewall-sealed poly-buffered LOCOS isolation methods |
JPH0513381A (en) * | 1991-07-02 | 1993-01-22 | Sony Corp | Dry etching method |
JPH05259269A (en) * | 1992-03-11 | 1993-10-08 | Sharp Corp | Method for forming element separating region |
JPH07235590A (en) * | 1994-02-22 | 1995-09-05 | Nec Corp | Manufacture of semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100466199B1 (en) * | 1997-12-31 | 2005-05-17 | 주식회사 하이닉스반도체 | Device Separating Method of Semiconductor Device |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |