KR970050351U - Mount head - Google Patents

Mount head

Info

Publication number
KR970050351U
KR970050351U KR2019960000155U KR19960000155U KR970050351U KR 970050351 U KR970050351 U KR 970050351U KR 2019960000155 U KR2019960000155 U KR 2019960000155U KR 19960000155 U KR19960000155 U KR 19960000155U KR 970050351 U KR970050351 U KR 970050351U
Authority
KR
South Korea
Prior art keywords
mount head
mount
head
Prior art date
Application number
KR2019960000155U
Other languages
Korean (ko)
Other versions
KR0136161Y1 (en
Inventor
박영환
Original Assignee
박영환
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 박영환 filed Critical 박영환
Priority to KR2019960000155U priority Critical patent/KR0136161Y1/en
Publication of KR970050351U publication Critical patent/KR970050351U/en
Application granted granted Critical
Publication of KR0136161Y1 publication Critical patent/KR0136161Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
KR2019960000155U 1996-01-09 1996-01-09 Mounting head KR0136161Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019960000155U KR0136161Y1 (en) 1996-01-09 1996-01-09 Mounting head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019960000155U KR0136161Y1 (en) 1996-01-09 1996-01-09 Mounting head

Publications (2)

Publication Number Publication Date
KR970050351U true KR970050351U (en) 1997-08-12
KR0136161Y1 KR0136161Y1 (en) 1999-02-18

Family

ID=19449076

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019960000155U KR0136161Y1 (en) 1996-01-09 1996-01-09 Mounting head

Country Status (1)

Country Link
KR (1) KR0136161Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100398776B1 (en) * 2001-06-08 2003-09-19 민응식 Method for manufacturing cutting edge of cutting tool to manufacture boll-seat in piston of car compressor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100398776B1 (en) * 2001-06-08 2003-09-19 민응식 Method for manufacturing cutting edge of cutting tool to manufacture boll-seat in piston of car compressor

Also Published As

Publication number Publication date
KR0136161Y1 (en) 1999-02-18

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20011106

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee