KR970046988U - 필름리드프레임 - Google Patents
필름리드프레임Info
- Publication number
- KR970046988U KR970046988U KR2019950042886U KR19950042886U KR970046988U KR 970046988 U KR970046988 U KR 970046988U KR 2019950042886 U KR2019950042886 U KR 2019950042886U KR 19950042886 U KR19950042886 U KR 19950042886U KR 970046988 U KR970046988 U KR 970046988U
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- film lead
- film
- frame
- lead
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950042886U KR200164517Y1 (ko) | 1995-12-18 | 1995-12-18 | 필름리드프레임 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950042886U KR200164517Y1 (ko) | 1995-12-18 | 1995-12-18 | 필름리드프레임 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970046988U true KR970046988U (ko) | 1997-07-31 |
| KR200164517Y1 KR200164517Y1 (ko) | 2000-01-15 |
Family
ID=19435178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950042886U KR200164517Y1 (ko) | 1995-12-18 | 1995-12-18 | 필름리드프레임 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200164517Y1 (ko) |
-
1995
- 1995-12-18 KR KR2019950042886U patent/KR200164517Y1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR200164517Y1 (ko) | 2000-01-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20090922 Year of fee payment: 11 |
|
| LAPS | Lapse due to unpaid annual fee |