KR970019767U - 리드 프레임 공급장치 - Google Patents

리드 프레임 공급장치

Info

Publication number
KR970019767U
KR970019767U KR2019950030273U KR19950030273U KR970019767U KR 970019767 U KR970019767 U KR 970019767U KR 2019950030273 U KR2019950030273 U KR 2019950030273U KR 19950030273 U KR19950030273 U KR 19950030273U KR 970019767 U KR970019767 U KR 970019767U
Authority
KR
South Korea
Prior art keywords
lead frame
frame supply
supply
lead
frame
Prior art date
Application number
KR2019950030273U
Other languages
English (en)
Other versions
KR200160427Y1 (ko
Inventor
최오동
김종욱
Original Assignee
삼성항공산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업주식회사 filed Critical 삼성항공산업주식회사
Priority to KR2019950030273U priority Critical patent/KR200160427Y1/ko
Publication of KR970019767U publication Critical patent/KR970019767U/ko
Application granted granted Critical
Publication of KR200160427Y1 publication Critical patent/KR200160427Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Specific Conveyance Elements (AREA)
KR2019950030273U 1995-10-25 1995-10-25 리드 프레임 공급장치 KR200160427Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950030273U KR200160427Y1 (ko) 1995-10-25 1995-10-25 리드 프레임 공급장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950030273U KR200160427Y1 (ko) 1995-10-25 1995-10-25 리드 프레임 공급장치

Publications (2)

Publication Number Publication Date
KR970019767U true KR970019767U (ko) 1997-05-26
KR200160427Y1 KR200160427Y1 (ko) 1999-11-01

Family

ID=19426976

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950030273U KR200160427Y1 (ko) 1995-10-25 1995-10-25 리드 프레임 공급장치

Country Status (1)

Country Link
KR (1) KR200160427Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100473596B1 (ko) * 1997-09-18 2005-07-07 삼성전자주식회사 리드프레임이송장치및그리드프레임의클램핑방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101365937B1 (ko) * 2012-09-18 2014-02-21 (주)피엔티 반도체칩 패키지 제조 장치 및 반도체칩 패키지 제조 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100473596B1 (ko) * 1997-09-18 2005-07-07 삼성전자주식회사 리드프레임이송장치및그리드프레임의클램핑방법

Also Published As

Publication number Publication date
KR200160427Y1 (ko) 1999-11-01

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Payment date: 20080728

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