KR970046949U - Compound feeder - Google Patents

Compound feeder

Info

Publication number
KR970046949U
KR970046949U KR2019950053265U KR19950053265U KR970046949U KR 970046949 U KR970046949 U KR 970046949U KR 2019950053265 U KR2019950053265 U KR 2019950053265U KR 19950053265 U KR19950053265 U KR 19950053265U KR 970046949 U KR970046949 U KR 970046949U
Authority
KR
South Korea
Prior art keywords
compound feeder
feeder
compound
Prior art date
Application number
KR2019950053265U
Other languages
Korean (ko)
Other versions
KR200164514Y1 (en
Inventor
남택환
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019950053265U priority Critical patent/KR200164514Y1/en
Publication of KR970046949U publication Critical patent/KR970046949U/en
Application granted granted Critical
Publication of KR200164514Y1 publication Critical patent/KR200164514Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
KR2019950053265U 1995-12-29 1995-12-29 Compound supply apparatus KR200164514Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950053265U KR200164514Y1 (en) 1995-12-29 1995-12-29 Compound supply apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950053265U KR200164514Y1 (en) 1995-12-29 1995-12-29 Compound supply apparatus

Publications (2)

Publication Number Publication Date
KR970046949U true KR970046949U (en) 1997-07-31
KR200164514Y1 KR200164514Y1 (en) 2000-01-15

Family

ID=19442249

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950053265U KR200164514Y1 (en) 1995-12-29 1995-12-29 Compound supply apparatus

Country Status (1)

Country Link
KR (1) KR200164514Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100852463B1 (en) * 2007-08-24 2008-08-14 세크론 주식회사 Method and apparatus of providing epoxy molding compound powder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100852463B1 (en) * 2007-08-24 2008-08-14 세크론 주식회사 Method and apparatus of providing epoxy molding compound powder

Also Published As

Publication number Publication date
KR200164514Y1 (en) 2000-01-15

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20050922

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee