KR100852463B1 - Method and apparatus of providing epoxy molding compound powder - Google Patents

Abstract

A method and an apparatus for supplying an epoxy molding compound are provided to perform efficiently a molding process using the epoxy molding compound by supplying uniformly the epoxy molding compound in a mold. The stored amount of epoxy molding compound of a powder type is measured(S100). The predetermined amount of epoxy molding compound is supplies to a lower direction at a constant speed(S200). The residual amount of epoxy molding compound is measured after the predetermined amount of epoxy molding compound is supplies to the lower direction(S300). The stored amount of epoxy molding compound is compared with the residual amount of epoxy molding compound to detect a difference between the stored amount of epoxy molding compound and the residual amount of epoxy molding compound(S400). The epoxy molding compound is stored uniformly in a tray by changing a moving speed and a position of the tray(S500).

Description

Epoxy molding compound supply method and apparatus {METHOD AND APPARATUS OF PROVIDING EPOXY MOLDING COMPOUND POWDER}

The present invention relates to a method and apparatus for supplying an epoxy molding compound, and more particularly, to an epoxy molding compound supply method and apparatus for supplying an epoxy molding compound in powder form to a tray.

In general, the semiconductor package process includes a sawing process of cutting a wafer and individualizing the die into a die, which is a semiconductor chip, a die bonding process of attaching the individualized dies to a substrate, a wire bonding process of electrically connecting the die and the connection pads of the substrate, And a molding step of molding the die and a peripheral portion of the die, and forming an external connection terminal on a ball pad of the substrate.

The molding process is performed by supplying an epoxy molding compound (hereinafter referred to as "EMC") in powder form on a mold and pressing the die and the EMS in a state in which the die is placed in the EMS. The EMS is supplied to the mold by a tray.

At this time, when the EMS is unevenly loaded in the tray carrying the EMS, the loaded EMS is supplied to a mold, and the molding process proceeds to decrease the efficiency of the overall process.

Accordingly, in order to uniformly load the EMS in the tray, the EMS supply unit drops the EMS to the tray at a constant speed by a set amount. However, there is a problem that the supply of the EMS in accordance with the characteristics and state of the powder form of the EMS is not supplied uniformly, such as instantaneous collapse or partial agglomeration.

One object of the present invention is to provide an EMS supply method for uniformly supplying the EMS in the form of a powder.

Another object of the present invention is to provide an EMS supply device that can easily perform the aforementioned MC supply method.

In the EMS supply method according to the embodiments of the present invention to achieve the above object of the present invention, first measuring the retention amount of the EMS in the form of powder contained therein, the received EMS is fixed by a predetermined amount set in advance Drop downward at speed. Then, after dropping the EMS, the residual flow rate of the residual EMS is measured, and the actual discharge amount corresponding to the difference between the retention amount and the residual amount is derived by comparing the retention amount and the measured residual amount. Accordingly, the epoxy molding compound is uniformly loaded in the tray by changing the moving speed and the position of the tray in which the epoxy molding compound is loaded in correspondence with the derived actual amount of delivery.

In the embodiments of the present invention, in the step of changing the moving speed and position of the tray, the distance between the point where the dropped EMS starts to drop and the point where the falling EMS is loaded into the tray in advance Receiving and changing the moving speed and the position of the tray in consideration of the time that the MC falls by the distance.

In embodiments of the present invention, in the step of changing the moving speed and position of the tray, receiving the derived actual discharge amount as a feedback control signal, the moving speed and position of the tray in response to the feedback control signal Can be controlled.

In embodiments of the present invention, the above steps are repeatedly performed until the entirety of the MC contained therein is dropped into the tray. In addition, when the entire epoxy molding compound contained therein is dropped, a certain amount of epoxy molding compound may be supplied from the outside.

According to embodiments of the present invention to achieve another object of the present invention to be described above, the EMS supply apparatus includes a supply unit, a tray and a control unit. The supply unit drops the epoxy molding compound in the form of powder contained therein downward at a constant speed by a predetermined predetermined amount, and derives the actual amount of discharge by comparing the remaining amount before dropping and the amount of residual oil after dropping. The tray is disposed at a point where the EMS is dropped, and loads the dropped EMS while moving in an area including the point. The control unit is disposed between the supply unit and the tray, and the dropped EMS is uniformly loaded in the tray by changing the moving speed and position of the tray in response to the derived actual discharge amount.

In embodiments of the present invention, the supply unit may further include a guide unit, a vibration providing unit and a chute. The guide unit guides the path of the MC received from the outside. The vibration providing unit provides vibration to the guide unit, and adjusts the frequency of the provided vibration to supply the EMS through the guide unit at a constant speed by a certain amount. The chute is disposed between the guide portion and the tray, and prevents the dropped EMS from scattering around.

In embodiments of the present invention, the supply unit may further include a sensor unit. The sensor unit may measure the amount of the EMS received therein, determine the actual amount of discharge on the basis of the measured amount of the EMS and transfer the actual amount of discharge to the controller.

In the embodiments of the present invention, the control unit receives the distance between the point where the dropping EMS starting to drop and the dropping EMS is loaded in the tray in advance, the EMS is dropped by the distance In consideration of time, the moving speed and the position of the tray can be controlled.

In embodiments of the present invention, the MC supply device may further include a first table and a second table disposed under the tray and moving the tray under the control of the controller.

According to the present invention, in the auto-molding system, the moving speed and the position of the tray for loading the dropped EMS are controlled in response to the actual amount of the dropped in the form of powder. Therefore, the actual dropped EMS and the tray for loading it are synchronized with each other, so that the MC can be loaded uniformly inside the tray.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar components. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, steps, actions, components, parts or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a schematic diagram illustrating an MC supply apparatus according to embodiments of the present invention. FIG. 2 is a plan view viewed from the top of the EMS supply apparatus of FIG. 1, and FIG. 3 is a cross-sectional view of the MC supply apparatus of FIG. 1 taken along line II ′ of FIG. 2.

1 to 3, the epoxy molding compound supply apparatus 100 according to the embodiments of the present invention includes an EMS supply unit 200 (hereinafter, referred to as a “supply unit”), a tray 300, and a controller 400. do.

The supply unit 200 supplies an EMS of the powder form to the tray 300. The supply unit 200 includes an MC feeder 210, a guide unit 220, a vibration providing unit 230, a chute 240, and a sensor unit 250.

The EMS feeder 210 stores the EMS and discharges the stored MC. For example, the MC feeder 210 has a plate shape, and has a discharge port 212 on one side of the lower surface. The EMS feeder 210 stores the EMS in powder form supplied from the outside, and discharges the EMS down through the discharge port 212. For example, the EMS feeder 210 may discharge about 15 g of EMS at a time.

The guide unit 220 guides the supply path of the EMS received from the MC feeder 210. For example, one end of the guide portion 220 disposed in the lower portion of the discharge port 212 has a wide spread shape in order to stably receive the EMS, the other end of the opposite guide portion 220 to guide the path of the EMS In order to have a narrow shape. That is, the guide portion 220 may have a funnel shape. The MC is dropped downward from the other end of the guide unit 220. For example, the guide unit 220 may guide the path such that about 1 g of MC is supplied.

The vibration providing unit 230 provides vibration to the guide unit 220. EMC is moved in one direction from the upper surface of the guide portion 220 by the vibration. That is, when the vibration providing unit 230 provides the vibration to the guide unit 220, the EMS is moved from one end to the other end on the upper surface of the guide unit 220.

For example, the vibration providing unit 230 adjusts the vibration frequency provided to supply a predetermined amount of EMS. In addition, the vibration providing unit 230 adjusts the vibration frequency to adjust the supply speed of the EMS. Therefore, by the vibration provided from the vibration providing unit 230, the supply unit 200 may supply at a constant speed by a predetermined amount. Meanwhile, although the vibration providing unit 230 is illustrated as being disposed under the guide unit 220, the vibration providing unit 230 may be formed at various positions as long as it can provide vibration to the guide unit 220. have.

The chute 240 is disposed between the guide part 220 and the tray 300. The chute 240 provides a fall path of the EMS falling from the other end of the guide portion 220. For example, the chute 240 may have a long cylindrical shape. Accordingly, the chute 240 provides the falling path of the EMS to prevent the falling EMS from being scattered around.

The sensor unit 250 measures the weight of the EMS received therein. For example, the sensor unit 250 may determine the weight of the EMS remaining on the upper surface of the guide unit 220. The sensor unit 250 may include an electronic scale, a load cell, and the like.

The sensor unit 250 measures the initial holding amount provided from the MC feeder 210. In addition, after the supply unit 200 supplies the predetermined amount of the MC, the sensor unit 250 measures the remaining amount of residual oil. Therefore, the sensor unit 250 may derive the actual discharge amount corresponding to the difference between the initial holding amount and the residual amount. Accordingly, the sensor unit 250 provides information about the actual discharge amount to the control unit 400 to be described later.

The tray 300 receives the MC from the supply unit 200. The tray 300 is disposed at the point where the EMS is dropped. In addition, the tray 300 is supplied with the EMS while moving in the area including the point. Therefore, the MC is not loaded to the specific portion of the tray 300. Then, the tray 300 loads the EMS in the form of a powder and supplies the loaded EMS to the mold (not shown). Therefore, the tray 300 moves to a position adjacent to the mold in order to supply the MC to the mold. That is, the tray 300 serves to load and transfer the MC.

In addition, the tray 300 includes a first table 310 and a second table 320 disposed below. The first table 310 and the second table 320 move in the first direction D1 or in the second direction D2 perpendicular to the first direction to drive the tray 300 disposed thereon in the front, rear, left, and right directions. Let's do it.

In addition, the first table 310 and the second table 320 may move under the control of the controller 400 to be described later. For example, the first table 310 and the second table 320 may be driven by a servo motor suitable for driving the feedback control system. The servo motor may further include a sensor (not shown) for detecting a position and a speed as an automatic control mechanism by feedback control. Examples of servo motors include direct current (DC) motors and alternating current (AC) motors.

At this time, even if the supply unit 200 is set to drop the MC at a constant speed by a certain amount, the MC supplied in accordance with the characteristics and state of the powder form of the MC is not supplied constantly because of the instantaneous collapse or partial agglomeration. You may not be able to.

The control unit 400 is disposed between the supply unit 200 and the tray 300. For example, the controller 400 may be connected to the sensor unit 250 of the supply unit 200 and may be connected to the first table 310 and the second table 320 driving the tray 300, respectively.

The controller 400 receives an input signal from the sensor unit 250 and controls the first table 310 and the second table 320 according to the input signal, thereby changing the moving speed and the position of the tray 300. Let's do it. In this case, the input signal may be an actual discharge amount derived by the sensor unit 250. As mentioned, the actual discharge amount may be an amount corresponding to the difference between the existing retention amount and the residual amount.

In detail, the controller 400 changes the moving speed and the position of the tray 300 in response to the actual discharge amount input from the sensor unit 250. That is, the controller 400 receives the actual discharge amount as a feedback control signal and controls the tray 300 according to the feedback control signal. For example, when the preset supply amount is about 1 g and the actual discharge amount is about 0.8 g, the controller 400 reduces the moving speed of the tray 300. Therefore, since the tray 300 moves relatively slowly, about 0.8 g of the EMS may be uniformly loaded in the tray 300. On the contrary, when the designated supply amount is about 1 g and the actual discharge amount is about 1.2 g, the controller 400 increases the moving speed of the tray 300. Therefore, since the tray 300 moves relatively fast, about 1.2 g of the EMS may be loaded at the set place of the tray 300. As such, when the actual discharge amount changes, such as when the instantaneously collapsed due to the characteristics of the powder form of the EMS, the controller 400 may change the moving speed of the tray 300 to correspond to the instantaneous changes in the instantaneous change. Therefore, the controller 400 may control the dropped MC to be uniformly loaded in the tray 300.

In addition, the controller 400 may control the moving speed of the tray 300 in consideration of the drop time of the dropped MC. For example, the controller 400 may receive an input of a distance between the point where the MC starts to fall and the tray 300 in advance, and control the tray 300 in consideration of the time when the MC falls by the distance. Here, the distance corresponds to the distance between the bottom of the short 240 and the point where the MC is loaded on the tray 300. Therefore, the controller 400 controls the tray 300 in consideration of the distance, thereby allowing the MC to be more uniformly loaded on the tray 300.

In this way, the control unit 400 receives the actual discharge amount as a feedback data value from the sensor unit 250 of the supply unit 300, and controls the moving speed of the tray 300 and the like in response to the actual discharge amount. Therefore, the MC may be uniformly loaded in the tray 300. The EMS is uniformly supplied to the mold, and the efficiency of the molding process using the supplied EMS can be greatly improved. Therefore, the overall product reliability can be secured and the yield and productivity of the product can be improved.

Figure 4 is a flow chart for explaining the MC supply method according to embodiments of the present invention.

Referring to Figure 4, in the MC supply method according to the embodiments of the present invention, first measuring the amount of holding the EMS (S100), and dropping the MC down to a predetermined speed by a predetermined amount (S200). Then, after dropping, the residual flow rate of the remaining MC is measured (S300), and the actual discharge amount is derived by comparing the holding amount and the residual amount (S400). Then, the moving speed and the position of the tray on which the MC is loaded are changed in response to the actual amount of discharge of the MC (S500).

Specifically, first, the EMS is supplied with a certain amount of the EMS powder form from the outside. Then, the amount of retained MC stored therein is measured. For example, the holding amount may be the amount of the first supplied EMS, may be the sum of the supplied MC and the conventionally accepted EMS, may be the amount of remaining EMS after dropping the MC more than once. have.

Then, the received EMS is dropped downward. The amount of the dropped MC is set in advance. In addition, the dropping and / or feeding rate of the EMS is also set in advance. As such, the received MC is dropped downwards at a constant speed by a predetermined amount.

After dropping the MC, the amount of the remaining MC is measured. That is, the residual flow rate of the EMS is measured.

Then, the holding amount and the measured residual oil amount are compared. Thus, the actual discharge amount corresponding to the difference between the holding amount and the residual amount is derived. The actual amount of discharge is measured because the state and / or characteristics of the powder form of MC may not be supplied in the form of instantaneous collapse, or may not be supplied as a partial agglomeration, and thus the actual amount of discharge may be different from a predetermined designated amount. . In addition, in order to use the derived actual discharge amount as a control signal for controlling the moving speed of the tray, the actual discharge amount is provided to the controller described above.

The moving speed and the position of the tray are changed in correspondence with the actual discharge amount. Here, the tray is disposed in the lower portion of the dropped EMS to load the dropped EMS to a certain thickness and transported to the outside. For example, the control unit changes the moving speed and the position of the tray according to the actual discharge amount. Substantially, the controller controls the first table and the second table for driving the tray to change the front, rear, left and right moving directions and the moving speed of the tray. For example, when the actual delivery amount is less than the designated amount, the moving speed of the tray is reduced, and when the actual delivery amount is larger than the designated amount, the moving speed of the tray is increased. Therefore, even if the actual discharge amount is changed, the moving speed of the tray can be controlled so that the MC can be loaded with a uniform thickness inside the tray.

In addition, it is possible to measure the falling time of the EMS in order to accurately synchronize the falling time of the dropped EMS and the moving speed of the tray. For example, the distance between the point where the EMS starts to fall and the point where the falling EMS is loaded into the tray is measured. Then, the time at which the MC free falls by the distance is calculated. The controller controls the moving speed and the position of the tray in consideration of the fall time. Therefore, the MC can be more uniformly loaded inside the tray.

On the other hand, the above-mentioned steps and / or methods of supplying the MC to the tray may be repeatedly performed until the entire EMS stored therein is consumed. That is, the step of dropping the EMS, comparing the retention amount and the residual amount to derive the actual amount of discharge, the step of controlling the tray movement speed in response to the actual amount of discharge can be continuously performed. In this case, when the entire first supplied MC is consumed, the predetermined amount of EMS may be supplied again from the outside.

In this way, the EMS can be loaded with a uniform thickness inside the tray by changing the moving speed and the position of the tray according to the actual amount of discharge of the EMS. Therefore, after the tray moves to a state in which the EMS is uniformly loaded, the efficiency of the molding process performed in the mold may be greatly improved by supplying the EMS to the mold.

In the epoxy molding compound supply method and apparatus according to the present invention, the control unit receives the actual amount of discharge from the sensor unit as feedback data value, and changes the moving speed and position of the tray according to the actual amount of discharge of the MC. Therefore, the MC is uniformly loaded in the tray, and the tray is supplied uniformly to the MC in the mold, so that the molding process using the EMS can be efficiently performed. Therefore, the overall product reliability can be secured and the yield and productivity of the product can be improved.

As described above, although described with reference to preferred embodiments of the present invention, those skilled in the art will be variously modified without departing from the spirit and scope of the invention described in the claims below. And can be changed.

1 is a schematic diagram illustrating an MC supply apparatus according to embodiments of the present invention.

2 is a plan view of the MC supply apparatus of FIG.

FIG. 3 is a cross-sectional view taken along the line II ′ of FIG. 2.

Figure 4 is a flow chart for explaining the MC supply method according to embodiments of the present invention.

<Description of the symbols for the main parts of the drawings>

100: MC supply device 200: supply unit

210: MC feeder 212: discharge port

220: guide portion 230: vibration providing unit

240: chute 250: sensor

300: tray 310: first table

320: second table 400: control unit

Claims (9)

Measuring a retention amount of the epoxy molding compound in the form of powder contained therein; Dropping the received epoxy molding compound downward at a constant rate by a predetermined amount set in advance; Measuring the residual amount of the epoxy molding compound remaining after the epoxy molding compound is dropped; Comparing the retention amount with the measured residual amount to derive an actual discharge amount corresponding to the difference between the retention amount and the residual amount; And And uniformly loading the epoxy molding compound in the tray by changing a moving speed and a position of the tray in which the epoxy molding compound is loaded in response to the derived actual amount of delivery. The method of claim 1, wherein the changing of the moving speed and the position of the tray comprises: The tray is received in advance with a distance between a point at which the dropped epoxy molding compound begins to fall and a point at which the falling epoxy molding compound is loaded into the tray, and the tray is considered in consideration of the time when the epoxy molding compound falls by the distance. Epoxy molding compound supply method, characterized in that for changing the speed and position of the movement. The method of claim 1, wherein the changing of the moving speed and the position of the tray comprises: And receiving the derived actual discharge amount as a feedback control signal, and controlling a moving speed and a position of the tray in response to the feedback control signal. The method of claim 1, wherein the steps are repeatedly performed until all of the epoxy molding compound contained therein is dropped into the tray. Epoxy molding compound supply method further comprises the step of receiving a certain amount of epoxy molding compound supplied from the outside when the entire epoxy molding compound accommodated therein. A supply unit for dropping the epoxy molding compound in powder form contained therein downwardly at a predetermined speed at a predetermined speed, and comparing the retention amount before dropping and the remaining amount after dropping to derive an actual dropping amount; A tray disposed at a point at which the epoxy molding compound is dropped, for loading the dropped epoxy molding compound while moving in a region including the point; And An epoxy molding compound disposed between the supply unit and the tray, the control unit configured to uniformly load the dropped epoxy molding compound on the tray by changing a moving speed and a position of the tray in response to the derived actual amount of discharge. Feeding device. The method of claim 5, wherein the supply unit A guide unit for guiding a path of the epoxy molding compound received from the outside; Vibration providing unit for providing a vibration to the guide portion, and supplying the epoxy molding compound at a constant speed by a predetermined amount by adjusting the frequency of the provided vibration; And Epoxy molding compound supply device disposed between the guide portion and the tray, characterized in that it further comprises a chute (chute) to prevent the dropped epoxy molding compound to scatter around. The method of claim 5, wherein the supply unit Epoxy characterized in that it further comprises a sensor unit for measuring the amount of the epoxy molding compound accommodated therein, determining the actual amount of the discharge based on the measured amount of the epoxy molding compound to deliver the actual amount of delivery to the controller. Molding compound feeder. The method of claim 5, wherein the control unit The tray is received in advance with a distance between a point at which the dropped epoxy molding compound begins to fall and a point at which the falling epoxy molding compound is loaded into the tray, and the tray is considered in consideration of the time when the epoxy molding compound falls by the distance. Epoxy molding compound supply apparatus, characterized in that for controlling the speed and position of the movement. The method of claim 5, And a first table and a second table which are disposed under the tray and move the tray under the control of the controller.

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