KR970030738A - Packing structure with lead frame with zigzag dam bar - Google Patents

Packing structure with lead frame with zigzag dam bar Download PDF

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Publication number
KR970030738A
KR970030738A KR1019950039648A KR19950039648A KR970030738A KR 970030738 A KR970030738 A KR 970030738A KR 1019950039648 A KR1019950039648 A KR 1019950039648A KR 19950039648 A KR19950039648 A KR 19950039648A KR 970030738 A KR970030738 A KR 970030738A
Authority
KR
South Korea
Prior art keywords
zigzag
dam bar
lead frame
leads
packing structure
Prior art date
Application number
KR1019950039648A
Other languages
Korean (ko)
Inventor
김강수
송영희
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950039648A priority Critical patent/KR970030738A/en
Publication of KR970030738A publication Critical patent/KR970030738A/en

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Abstract

본 발명은 반도체 칩 패키지의 패킹 구조에 관한 것으로, 리드프레임의 댐바를 지그재그로 형성하여 리드프레임과 댐바 장치의 공차에 이상이 발생되더라도 각 리드들 간의 전기적 단락이나 고장이 발생되지 않도록 할 수 있는 특징을 갖는다.The present invention relates to a packing structure of a semiconductor chip package, and the dam bar of the lead frame is formed in a zigzag to prevent electrical short circuits or failures between the leads even when an error occurs in the tolerance between the lead frame and the dam bar device. Has

Description

지그재그 형상의 댐바를 갖는 리드프레임을 적용한 패킹 구조Packing structure with lead frame with zigzag dam bar

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제 3도는 본 발명에 의한 지그재그 형상의 댐바를 갖는 리드프레임을 나타내는 평면도.3 is a plan view showing a lead frame having a zigzag-shaped dam bar according to the present invention.

제 4도는 본 발명에 의한 지그재그 형상의 댐바를 갖는 패킹 구조를 나타내는 평면도.4 is a plan view showing a packing structure having a zigzag-shaped dam bar according to the present invention.

Claims (2)

복수개의 본딩 패드들을 갖는 칩과, 그 칩의 일측면과 접착된 리드프레임의 다이패드와, 상기 본딩 패드들에 각기 대응되어 전기적 연결된 내부리드들과, 그 내부리드들과 일체형으로 형성된 외부리드들과, 상기 다이패드를 지지하는 타이 바와, 상기 내부리드들과 외부리드들의 사이에 형성된 댐바를 포함하는 패킹 구조에 있어서, 상기 댐바의 형상이 지그재그로 형성되어 댐바 절단 공정에 의해 발생되는 각 내부리드들의 전기적 단락을 방지하는 것을 특징으로 하는 지그재그 형상의 댐바를 갖는 리드프레임을 적용한 패킹 구조.A chip having a plurality of bonding pads, a die pad of a lead frame bonded to one side of the chip, internal leads electrically connected to the bonding pads, and external leads integrally formed with the internal leads. And a tie bar for supporting the die pad, and a dam bar formed between the inner leads and the outer leads, wherein the shape of the dam bar is formed in a zigzag shape, and each inner lead is generated by a dam bar cutting process. Packing structure applying a lead frame having a zigzag-shaped dam bar, characterized in that to prevent the electrical short of the. 제 1항에 있어서, 상기 지그재그로 형성된 댐바에 의해 각 리드들이 피치가 파인(fine) 피치가 된 것을 특징으로 하는 지그재그 형상의 댐바를 갖는 리드프레임을 적용한 패킹 구조.The packing structure according to claim 1, wherein each of the leads has a fine pitch due to the zigzag dam bars. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950039648A 1995-11-03 1995-11-03 Packing structure with lead frame with zigzag dam bar KR970030738A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950039648A KR970030738A (en) 1995-11-03 1995-11-03 Packing structure with lead frame with zigzag dam bar

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950039648A KR970030738A (en) 1995-11-03 1995-11-03 Packing structure with lead frame with zigzag dam bar

Publications (1)

Publication Number Publication Date
KR970030738A true KR970030738A (en) 1997-06-26

Family

ID=66587341

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950039648A KR970030738A (en) 1995-11-03 1995-11-03 Packing structure with lead frame with zigzag dam bar

Country Status (1)

Country Link
KR (1) KR970030738A (en)

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