KR970030568A - Package Inspection Device - Google Patents

Package Inspection Device Download PDF

Info

Publication number
KR970030568A
KR970030568A KR1019950042811A KR19950042811A KR970030568A KR 970030568 A KR970030568 A KR 970030568A KR 1019950042811 A KR1019950042811 A KR 1019950042811A KR 19950042811 A KR19950042811 A KR 19950042811A KR 970030568 A KR970030568 A KR 970030568A
Authority
KR
South Korea
Prior art keywords
package
package inspection
inspection apparatus
board
inspecting
Prior art date
Application number
KR1019950042811A
Other languages
Korean (ko)
Other versions
KR100202638B1 (en
Inventor
임영규
이세용
Original Assignee
문정환
엘지반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 엘지반도체 주식회사 filed Critical 문정환
Priority to KR1019950042811A priority Critical patent/KR100202638B1/en
Publication of KR970030568A publication Critical patent/KR970030568A/en
Application granted granted Critical
Publication of KR100202638B1 publication Critical patent/KR100202638B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

본 발명은 패키지 검사장치에 관한 것으로, 종래에는 패키지 검사시 소켓의 컨택트 핀 및 보드에서 연결되는 코액스 케이블등으로 인하여 고주파에서는 전파지연이나 신호왜곡이 발생하는 문제점이 있었던 바, 본 발명은 종래의 소켓을 배제하고 보드부(1)와 푸쉬부(2)를 이용하여 장비와 직접 접촉한 상태로 검사함으로써 고주파의 고속 패키지의 검사시에도 전파지연시간이나 신호왜곡이 줄어드는 효과가 있고, 그로인한 노이즈(NOISE)도 줄어드는 효과가 있다.The present invention relates to a device for inspecting a package, and in the related art, due to a contact pin of a socket and a coax cable connected to a board during package inspection, a radio wave delay or signal distortion occurs at a high frequency. By eliminating the socket and inspecting the board 1 and the pusher 2 in direct contact with the equipment, there is an effect of reducing the propagation delay time and signal distortion even during the inspection of the high-speed high-speed package. (NOISE) also reduces the effect.

Description

패키지 검사장치Package Inspection Device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명 패키지 보드부 구성을 보인 개략구성도.1 is a schematic diagram showing the configuration of the package board of the present invention.

제2도는 본 발명 패키지 검사장치 푸쉬부의 구성을 보인 개략구성도.Figure 2 is a schematic configuration showing the configuration of the package inspection device push unit of the present invention.

Claims (4)

보드의 상부에는 진공홀을 구비한 하부 가이드가 설치되고, 그 하부 가이드의 양측에는 다수개의 연결단자가 설치되며, 상기 하부 가이드의 상부에는 진공홀을 구비한 상부 가이드가 설치되고, 그 상부 가이드의 상면에는 진공홀을 구비한 지지대가 설치되며, 그 지지대의 외부에는 수개의 완충부재가 구비된 푸셔가 설치된 것을 특징으로 하는 패키지 검사장치.A lower guide having a vacuum hole is installed at an upper part of the board, a plurality of connecting terminals are installed at both sides of the lower guide, and an upper guide having a vacuum hole is installed at an upper part of the lower guide. The support surface having a vacuum hole is installed on the upper surface, the package inspection apparatus, characterized in that the pusher is provided with a plurality of buffer members on the outside of the support. 제1항에 있어서, 상기 연결단자는 포고핀인 것을 특징으로 하는 패키지 검사장치.The package inspection apparatus according to claim 1, wherein the connection terminal is a pogo pin. 제1항에 있어서, 상기 연결단자는 패턴금속인 것을 특징으로 하는 패키지 검사장치.The package inspection apparatus according to claim 1, wherein the connection terminal is a pattern metal. 제1항에 있어서, 상기 연결단자는 절연체에 소정간격으로 초전도체를 설치하여서 된것을 특징으로 하는 패키지 검사장치.The package inspection apparatus according to claim 1, wherein the connection terminal is provided with a superconductor at predetermined intervals in the insulator. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950042811A 1995-11-22 1995-11-22 Package test apparatus KR100202638B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950042811A KR100202638B1 (en) 1995-11-22 1995-11-22 Package test apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950042811A KR100202638B1 (en) 1995-11-22 1995-11-22 Package test apparatus

Publications (2)

Publication Number Publication Date
KR970030568A true KR970030568A (en) 1997-06-26
KR100202638B1 KR100202638B1 (en) 1999-06-15

Family

ID=19435132

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950042811A KR100202638B1 (en) 1995-11-22 1995-11-22 Package test apparatus

Country Status (1)

Country Link
KR (1) KR100202638B1 (en)

Also Published As

Publication number Publication date
KR100202638B1 (en) 1999-06-15

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