KR970030423A

KR970030423A - Foreign material removal device on the back of wafer

Info

Publication number: KR970030423A
Application number: KR1019950042814A
Authority: KR
Inventors: 양천수
Original assignee: 문정환; 엘지반도체 주식회사
Priority date: 1995-11-22
Filing date: 1995-11-22
Publication date: 1997-06-26

Abstract

본 발명은 웨이퍼 이물질 제거장치에 관한 것으로, 종래 웨이퍼 현상장치를 이용하여 웨이퍼 현상시에는 웨이퍼를 고정시키기 위하여 웨이퍼 척으로 웨이퍼의 하면을 진공흡착한 상태에서 세정을 실시하기 때문에 웨이퍼 척으로 흡착한 웨이퍼의 뒷면은 오염되어 이물질이 발생하는 문제점이 있었던 바, 본 발명은 웨이퍼(W)를 고정하는 고정수단(30)과, 그 고정수단(30)을 이동시키기 위한 이동수단(40)과, 웨이퍼(W)의 뒷면에 부착된 이물질을 제거하기 위한 청소수단(50)과, 그 청소수단(50)에 의해 이물질 제거시 에어를 분사하기 위한 에어 컴프레서(60) 및 이물질을 배기하기 위한 배기덕트(70)로 구성되어 상기 청소수단(50)의 청소롤러(52)를 이용하여 웨이퍼(W)의 뒷면에 부착되어 있는 이물질을 제거함으로써 웨이퍼의 오염을 방지하는 효과가 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a wafer foreign material removal apparatus. In the case of developing a wafer using a conventional wafer developing apparatus, the wafer is sucked by the wafer chuck because the bottom surface of the wafer is cleaned by vacuum chucking to fix the wafer. The back of the contamination has been a problem that the foreign matter is generated, the present invention, the fixing means 30 for fixing the wafer (W), the moving means 40 for moving the fixing means 30, the wafer ( Cleaning means 50 for removing the foreign matter attached to the back of the W), the air compressor 60 for injecting air when removing the foreign matter by the cleaning means 50 and the exhaust duct 70 for exhausting the foreign matter It is configured to remove the foreign matter attached to the back of the wafer (W) using the cleaning roller 52 of the cleaning means 50 has the effect of preventing contamination of the wafer.

Description

Foreign material removal device on the back of wafer

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제3도는 본 발명 웨이퍼 뒷면 이물질 제거장치가 구비된 현상장치의 구성을 보인 개략구성도.Figure 3 is a schematic diagram showing the configuration of a developing apparatus equipped with a foreign matter removing device on the back of the present invention.

제4도는 본 발명 웨이퍼 뒷면 이물질 제거장치가 설치된 평면도.Figure 4 is a plan view in which the foreign matter removal apparatus back side of the present invention is installed.

Claims

Fixing means for fixing the wafer, moving means for moving the fixing means, cleaning means for cleaning the foreign matter of the wafer fixed by the fixing means, and for blowing out the foreign matter removed by the cleaning means. An apparatus for removing foreign matters on the back side of a wafer, comprising a compressor and an exhaust duct for discharging foreign matters blown out by the compressor.

2. The fixing means according to claim 1, wherein the fixing means comprises: a lower plate supporting the wafer, an upper plate supported by bolts at predetermined intervals on an upper portion of the lower plate, an air cylinder provided on the upper plate, The foreign matter removing apparatus on the back side of the wafer, characterized in that the wafer holding ring is installed so as to be lifted up and down by an air cylinder.

According to claim 1, wherein the moving means is composed of a screw box provided on a bracket protruding on one side of the lower plate, a lead screw moving along the screw of the screw box, and a motor for rotating the lead screw Debris removal device on the back of the wafer, characterized in that.

According to claim 1, wherein the cleaning means has a cleaning roller provided with a first pulley on one side, a motor provided with a second pulley installed below the cleaning roller, connecting the first pulley and the second pulley Debris removal device on the back of the wafer, characterized in that consisting of a belt.