KR970025851U - 웨이퍼 절단용 톱날 - Google Patents
웨이퍼 절단용 톱날Info
- Publication number
- KR970025851U KR970025851U KR2019950037701U KR19950037701U KR970025851U KR 970025851 U KR970025851 U KR 970025851U KR 2019950037701 U KR2019950037701 U KR 2019950037701U KR 19950037701 U KR19950037701 U KR 19950037701U KR 970025851 U KR970025851 U KR 970025851U
- Authority
- KR
- South Korea
- Prior art keywords
- saw blade
- cutting saw
- wafer cutting
- wafer
- blade
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950037701U KR0127356Y1 (ko) | 1995-11-30 | 1995-11-30 | 웨이퍼 절단용 톱날 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950037701U KR0127356Y1 (ko) | 1995-11-30 | 1995-11-30 | 웨이퍼 절단용 톱날 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970025851U true KR970025851U (ko) | 1997-06-20 |
| KR0127356Y1 KR0127356Y1 (ko) | 1998-12-01 |
Family
ID=19431656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950037701U KR0127356Y1 (ko) | 1995-11-30 | 1995-11-30 | 웨이퍼 절단용 톱날 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0127356Y1 (ko) |
-
1995
- 1995-11-30 KR KR2019950037701U patent/KR0127356Y1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR0127356Y1 (ko) | 1998-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20090624 Year of fee payment: 12 |
|
| LAPS | Lapse due to unpaid annual fee |