KR970025314A - Solder paste printed shape inspection device for printed circuit boards - Google Patents

Solder paste printed shape inspection device for printed circuit boards Download PDF

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Publication number
KR970025314A
KR970025314A KR1019950034870A KR19950034870A KR970025314A KR 970025314 A KR970025314 A KR 970025314A KR 1019950034870 A KR1019950034870 A KR 1019950034870A KR 19950034870 A KR19950034870 A KR 19950034870A KR 970025314 A KR970025314 A KR 970025314A
Authority
KR
South Korea
Prior art keywords
light
camera
laser
pcb
solder paste
Prior art date
Application number
KR1019950034870A
Other languages
Korean (ko)
Other versions
KR100275565B1 (en
Inventor
허병회
Original Assignee
이희종
엘지산전 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 이희종, 엘지산전 주식회사 filed Critical 이희종
Priority to KR1019950034870A priority Critical patent/KR100275565B1/en
Publication of KR970025314A publication Critical patent/KR970025314A/en
Application granted granted Critical
Publication of KR100275565B1 publication Critical patent/KR100275565B1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발명은 인쇄회로기판의 솔더 페이스트 인쇄형상 검사장치에 관한 것으로, 종래 기술의 문제점인 3차원 측정의 반사광 방식에서 발생되는 DOV에 의한 영상의 흐림을 해결하고, 분해능이 높은 위치정보 학습방법을 한 대의 카메라만을 사용하고도 구현할 수 있도록 한 것으로, 멀티슬릿광 산란 방식의 레이저 소스(11)와, 상기 레이저 소스(11)에서 발생되는 광의 각도를 변환시키는 레이저 미리(12)와, 상기 레이저 미러(12)에서 반사된 광을 PCB(16)로 반사시키는 갈바노 미러(13)를 X, Y축으로 각각 한 쌍씩 구비하고, 상기 PCB(16)에서 반사되는 광의 영상을 취득하는 카메라(14)와, 상기 카메라(14)의 전방에 설치되는 LED조명(15)으로 구성되어 광의 경로를 여러 번 바꾸어서 조사해주어 산란광의 구조로 하고, 카메라의 시각에서 볼 때 DOV는 FOV 전체에 걸쳐서 존재하도록 함으로써 촛점이 뚜렷한 영상을 얻을 수 있게 되었으며, 종래에 2대의 카메라를 사용하던 방식에서 카메라를 1대만 사용하더라도 충분한 측정 및 검사를 실시할 수 있도록 한 것이다.The present invention relates to a solder paste printing shape inspection apparatus of a printed circuit board, and solves the blur of an image caused by DOV generated by the reflected light method of three-dimensional measurement, which is a problem of the prior art, and has a high resolution information learning method. The laser source 11 of the multi-slit light scattering method, the laser advance 12 for converting the angle of the light generated by the laser source 11, and the laser mirror ( 12 is provided with a pair of galvano mirrors 13 reflecting the light reflected from the 12 to the PCB 16 on the X and Y axes, respectively, and a camera 14 for acquiring an image of the light reflected from the PCB 16; It consists of an LED light 15 installed in front of the camera 14 to change the path of the light several times to irradiate the structure of the scattered light, the DOV is present throughout the FOV when viewed from the camera's perspective By the focus was able to obtain a clear image to be, even in the system that used two cameras with the prior use of the camera 1 will Taiwan one to be able to perform a sufficient measurement and inspection.

Description

인쇄회로기판의 솔더 페이스트 인쇄형상 검사장치Solder paste printed shape inspection device for printed circuit boards

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제3도는 본 발명에 의한 인쇄회로기판의 솔더 페이스트 인쇄형상 검사장치의 구성도,3 is a configuration diagram of a solder paste printing shape inspection apparatus for a printed circuit board according to the present invention;

제4도는 본 발명 기술배경을 설명하기 위한 LED조명에 의한 2차원 영상 프로파일과 솔더 페이스트의 높이 변이 관계도,4 is a relationship between the height variation of the two-dimensional image profile and the solder paste by the LED light for explaining the technical background of the present invention,

제5도는 본 발명 장치의 검사 흐름도,5 is an inspection flowchart of the apparatus of the present invention,

제6도는 제5도의 D영역에 해당되는 솔더 페이스의 높이 측정 흐름도.FIG. 6 is a flow chart of height measurement of a solder face corresponding to area D of FIG. 5.

Claims (2)

멀티 스릿광 산란 방식의 레이저 소스와, 상기 레이저 소스에서 발생되는 광의 각도를 변환시키는 레이저 미러와, 상기 레이저 미러에서 반사된 광을 PCB로 반사시키는 갈바노 미러를 X, Y축으로 각각 한 쌍씩 구비하고, 상기 PCB에서 반사되는 광의 영상을 취득하는 카메라와, 상기 카메라의 전방에 설치되는 LED조명으로 구성함을 특징으로 하는 인쇄회로기판의 솔더 페이스트 인쇄형상 검사장치.A pair of multi-slit light scattering laser sources, a laser mirror for converting angles of light generated by the laser source, and a galvano mirror for reflecting light reflected from the laser mirror onto the PCB, each paired on the X and Y axes. And a camera for acquiring an image of the light reflected from the PCB, and an LED light installed in front of the camera. 제1항에 있어서, 상기 레이저 소스는 슬릿광이 레이저 미러에 45°로 입사되는 위치에 설치되고, 상기 레이저 미러는 갈바노 미러의 하측에 설치되며, 상기 카메라는 일정한 FOV를 유지하면서 PCB에 수직하게 설치되고, 상기 LED조명은 카메라의 전방에서 PCB 에 수평하게 설치된 것을 특징으로 하는 인쇄회로기판의 솔더 페이스트 인쇄형상 검사장치.The laser source of claim 1, wherein the laser source is installed at a position where slit light is incident at 45 ° to the laser mirror, the laser mirror is installed below the galvano mirror, and the camera is perpendicular to the PCB while maintaining a constant FOV. And the LED lighting is installed horizontally on the PCB from the front of the camera.
KR1019950034870A 1995-10-11 1995-10-11 Apparatus for inspecting printed shape of solder paste on printed circuit board KR100275565B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950034870A KR100275565B1 (en) 1995-10-11 1995-10-11 Apparatus for inspecting printed shape of solder paste on printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950034870A KR100275565B1 (en) 1995-10-11 1995-10-11 Apparatus for inspecting printed shape of solder paste on printed circuit board

Publications (2)

Publication Number Publication Date
KR970025314A true KR970025314A (en) 1997-05-30
KR100275565B1 KR100275565B1 (en) 2001-01-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950034870A KR100275565B1 (en) 1995-10-11 1995-10-11 Apparatus for inspecting printed shape of solder paste on printed circuit board

Country Status (1)

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KR (1) KR100275565B1 (en)

Also Published As

Publication number Publication date
KR100275565B1 (en) 2001-01-15

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