KR970024093A - Leadframe supply bar with sensing blocks and sensing method using them - Google Patents

Leadframe supply bar with sensing blocks and sensing method using them Download PDF

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Publication number
KR970024093A
KR970024093A KR1019950037831A KR19950037831A KR970024093A KR 970024093 A KR970024093 A KR 970024093A KR 1019950037831 A KR1019950037831 A KR 1019950037831A KR 19950037831 A KR19950037831 A KR 19950037831A KR 970024093 A KR970024093 A KR 970024093A
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KR
South Korea
Prior art keywords
lead frame
sensing
sensing block
supply bar
lead
Prior art date
Application number
KR1019950037831A
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Korean (ko)
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KR0152556B1 (en
Inventor
박재용
Original Assignee
김광호
삼성전자 주식회사
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Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950037831A priority Critical patent/KR0152556B1/en
Publication of KR970024093A publication Critical patent/KR970024093A/en
Application granted granted Critical
Publication of KR0152556B1 publication Critical patent/KR0152556B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

본 발명은 패키지 절단장치에 도입부에 설치된 리드 감지 수단에 관한 것으로, 성형 공정이 완료된 리드프레임 스트립으로부터 개별의 패키지로 분리되는 사용되는 절단 금형(trimming die)의 도입부에 그 패키지의 외부 리드들의 수를 감지할 수 있는 감지 블록을 설치하여 기계적인 방법에 의해 원하지 않는 리드프레임이 절단 금형으로 공급되는 것을 방지할 수 있는 특징을 갖는다.The present invention relates to a lead sensing means installed in an introduction part in a package cutting device, wherein the number of external leads of the package is introduced into the introduction of a used trimming die which is separated into a separate package from the leadframe strip in which the molding process is completed. The sensing block can be installed to prevent unwanted leadframe from being fed to the cutting mold by mechanical means.

Description

감지 블록을 갖는 리드프레임 공급바 및 그를 이용한 감지 방법Leadframe supply bar with sensing blocks and sensing method using them

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제3도는 본 발명의 실시예에 의한 리드 감지 블록이 설치된 리드프레임 공급바에 의해 패키지의 리드가 감지되는 상태를 나타내는 사시도.3 is a perspective view illustrating a state in which a lead of a package is detected by a lead frame supply bar provided with a lead sensing block according to an embodiment of the present invention.

제4도 A및 제4B도는 본 발명에 의한 리드감지블록이 설치된 리드프레임공급바에 의해 패키지의 리드가 감지되는 상태를 나타낸 정면도.4A and 4B are front views showing a state in which a lead of a package is detected by a lead frame supply bar provided with a lead detecting block according to the present invention.

Claims (7)

성형 공정이 완료된 리드프레임 스트립으로부터 개별의 패키지로 분리되는 사용되는 절단 금형(trimming die)의 도입부에 설치되어 있으며, 그 패키지들의 외부리드들의 수를 감지하는데 사용되는 감지 장치에 관한 것으로, 각형(角形)의 감지 블록과; 그 감지 블록과 일측면에 체결되어 있으며, 그 다른 일측면에 구동 수단에 의해 기계적 연결된 모체부를 갖으며; 상기 감지 블록이 감지될 패키지의 상기 외부리드들이 형성된 수평선 상의 아래로 더 하강할 수 있도록 형성되어 있으며, 그 감지된 패키지를 상기 절단 금형으로 공급하는 것을 특징으로 하는 감지 블록을 갖는 리드프레임 공급바.The sensing device is installed in the inlet of the trimming die used to separate the individual lead from the lead frame strip is completed, the sensor is used to detect the number of external leads of the package, A sense block; Fastened to one side of the sensing block and having a mother part mechanically connected to the other side by drive means; And the sensing block is further formed to descend downward on a horizontal line on which the outer leads of the package to be sensed are formed, and supply the sensed package to the cutting die. 제1항에 있어서, 상기 리드프레임 공급바에 의해 공급되는 패키지가 감지 블록이 하강되는 부분에 적어도 하나 이상의 외부리드가 제거된 것을 특징으로 하는 감지 블록을 갖는 리드프레임 공급바.The lead frame supply bar of claim 1, wherein at least one external lead is removed at a portion of the package supplied by the lead frame supply bar from which the sensing block is lowered. 제2항에 있어서, 상기 제거된 외부리드의 총 피치에 대응되어 감지 블록의 폭이 적어도 크지 않게 형성된 것을 특징으로 하는 감지 블록을 갖는 리드프레임 공급바.3. The leadframe supply bar of claim 2, wherein the width of the sensing block is not at least large corresponding to the total pitch of the removed external leads. 제1항에 있어서, 상기 외부리드들이 형성된 수평선 상 아래로 하강되는 상기 감지 블록의 부분이 상기 외부리드들이 뻗어 나온 방향과 동일한 방향의 마주 보는 면인 것을 특징으로 하는 감지 블록을 갖는 리드프레임 공급바.The lead frame supply bar of claim 1, wherein a portion of the sensing block descending on and below a horizontal line on which the outer leads are formed is an opposite surface in the same direction as the direction in which the outer leads extend. (a)성형 공정이 완료된 리드프레임 스트립을 준비하는 단계와, (b)그 준비된 리드프레임 스트립이 감지되는 단계와, (c)그 감지된 리드프레임 스트립이 리드 절단장치로 공급되는 단계를 포함하는 것을 특징으로 하는 감지 블록을 갖는 리드프레임 공급바를 이용한 감지방법.(a) preparing a leadframe strip in which the molding process is completed, (b) detecting the prepared leadframe strip, and (c) feeding the detected leadframe strip to a lead cutting device. Detection method using a lead frame supply bar having a sensing block, characterized in that. 제5항에 있어서, 상기 (b)단계의 리드프레임 스트립이 감지 블록에 의해 감지되는 것을 특징으로 하는 감지 블록을 갖는 리드프레임 공급바를 이용한 감지방법.The sensing method of claim 5, wherein the lead frame strip of step (b) is sensed by a sensing block. 제5항에 있어서, 상기 (c)단계에 리드 절단 장치에 리드프레임 스트립을 공급하는 수단이 감지 블록을 갖는 리드프레임 공급바인 것을 특징으로 하는 감지 블록을 갖는 리드프레임 공급바를 이용한 감지방법.The method according to claim 5, wherein the means for supplying the lead frame strip to the lead cutting device in step (c) is a lead frame supply bar having a sensing block. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950037831A 1995-10-28 1995-10-28 Lead frame support bar having sensor block and sensing method KR0152556B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950037831A KR0152556B1 (en) 1995-10-28 1995-10-28 Lead frame support bar having sensor block and sensing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950037831A KR0152556B1 (en) 1995-10-28 1995-10-28 Lead frame support bar having sensor block and sensing method

Publications (2)

Publication Number Publication Date
KR970024093A true KR970024093A (en) 1997-05-30
KR0152556B1 KR0152556B1 (en) 1998-10-01

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Family Applications (1)

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KR1019950037831A KR0152556B1 (en) 1995-10-28 1995-10-28 Lead frame support bar having sensor block and sensing method

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KR (1) KR0152556B1 (en)

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KR0152556B1 (en) 1998-10-01

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