KR970019156U - 오존 애셔장치 - Google Patents
오존 애셔장치Info
- Publication number
- KR970019156U KR970019156U KR2019950028278U KR19950028278U KR970019156U KR 970019156 U KR970019156 U KR 970019156U KR 2019950028278 U KR2019950028278 U KR 2019950028278U KR 19950028278 U KR19950028278 U KR 19950028278U KR 970019156 U KR970019156 U KR 970019156U
- Authority
- KR
- South Korea
- Prior art keywords
- ozone asher
- asher
- ozone
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/427—Stripping or agents therefor using plasma means only
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950028278U KR970019156U (ko) | 1995-10-10 | 1995-10-10 | 오존 애셔장치 |
GB9620608A GB2306248B (en) | 1995-10-10 | 1996-10-03 | An ozone asher |
US08/728,639 US5993595A (en) | 1995-10-10 | 1996-10-10 | Ozone asher |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950028278U KR970019156U (ko) | 1995-10-10 | 1995-10-10 | 오존 애셔장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970019156U true KR970019156U (ko) | 1997-05-26 |
Family
ID=19425638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019950028278U KR970019156U (ko) | 1995-10-10 | 1995-10-10 | 오존 애셔장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5993595A (ko) |
KR (1) | KR970019156U (ko) |
GB (1) | GB2306248B (ko) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4812201A (en) * | 1986-07-25 | 1989-03-14 | Tokyo Electron Limited | Method of ashing layers, and apparatus for ashing layers |
JPS6332927A (ja) * | 1986-07-25 | 1988-02-12 | Tokyo Electron Ltd | アツシング装置 |
JPH0834205B2 (ja) * | 1986-11-21 | 1996-03-29 | 株式会社東芝 | ドライエツチング装置 |
JPH04230018A (ja) * | 1990-12-27 | 1992-08-19 | Orc Mfg Co Ltd | ホトレジストの光灰化装置 |
US5558717A (en) * | 1994-11-30 | 1996-09-24 | Applied Materials | CVD Processing chamber |
-
1995
- 1995-10-10 KR KR2019950028278U patent/KR970019156U/ko not_active Application Discontinuation
-
1996
- 1996-10-03 GB GB9620608A patent/GB2306248B/en not_active Expired - Fee Related
- 1996-10-10 US US08/728,639 patent/US5993595A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2306248A (en) | 1997-04-30 |
GB2306248B (en) | 2000-01-12 |
GB9620608D0 (en) | 1996-11-20 |
US5993595A (en) | 1999-11-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |