KR970017910A - BAKE device of semiconductor manufacturing equipment - Google Patents

BAKE device of semiconductor manufacturing equipment Download PDF

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Publication number
KR970017910A
KR970017910A KR1019950030187A KR19950030187A KR970017910A KR 970017910 A KR970017910 A KR 970017910A KR 1019950030187 A KR1019950030187 A KR 1019950030187A KR 19950030187 A KR19950030187 A KR 19950030187A KR 970017910 A KR970017910 A KR 970017910A
Authority
KR
South Korea
Prior art keywords
hot plate
semiconductor manufacturing
baking
area
bake
Prior art date
Application number
KR1019950030187A
Other languages
Korean (ko)
Other versions
KR0184058B1 (en
Inventor
김이주
Original Assignee
문정환
Lg 반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, Lg 반도체 주식회사 filed Critical 문정환
Priority to KR1019950030187A priority Critical patent/KR0184058B1/en
Publication of KR970017910A publication Critical patent/KR970017910A/en
Application granted granted Critical
Publication of KR0184058B1 publication Critical patent/KR0184058B1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

본 발명은 반도체 제조장치의 베이크(Bake) 장치에 관한 것으로, 각기 온도 제어가 되는 다수개의 영역의 조합으로 이루어지고 베이크(Bake) 대상물이 얹혀지는 핫 플레이트(Hot Plate)와, 핫 플레이트에 얹혀진 베이크 대상물을 덮고 통풍구가 형성된 덮개부와, 덮개부 내면에 상기 핫 플레이트의 영역가 대응되게 형성되어 핫 플레이트 각 영역 상의 베이크 대상물의 부분의 온도를 각기 감지하는 다수개의 센서와, 센서들의 신호에 따라 상기 핫 플레이트의 각 영역을 개별제어하는 제어부를 포함하여 이루어진다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a baking apparatus of a semiconductor manufacturing apparatus, and includes a hot plate formed of a combination of a plurality of regions, each of which is controlled by temperature, on which a baking object is placed, and a bake mounted on the hot plate. A cover part covering an object and having a vent hole, an area of the hot plate corresponding to an inner surface of the cover part, and a plurality of sensors respectively detecting a temperature of a portion of the baking object on each area of the hot plate, and the hot signal according to a signal of the sensors It includes a control unit for controlling each area of the plate individually.

Description

반도체 제조장치의 베이크(Bake) 장치Bake Device of Semiconductor Manufacturing Equipment

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명의 반도체 제조장치의 베이크(Bake) 장치를 도시한 도면.2 is a view showing a bake device of a semiconductor manufacturing apparatus of the present invention.

Claims (3)

반도체 제조장치의 베이크(Bake) 장치에 있어서, 각기 온도제어가 되는 다수개의 영역의 조합으로 이루어지고 베이크(Bake) 대상물이 얹혀지는 핫 플레이트(Hot Plate)와, 상기 핫 플레이트에 얹혀진 베이크 대상물을 덮고 통풍구가 형성된 덮개부와, 상기 덮개부 내면에 상기 핫 플레이트의 영역과 대응되게 형성되어 핫 프레이트 각 영역 상의 베이크 대상물의 부분의 온도를 각기 감지하는 다수개의 센서와, 상기 센서들의 신호에 따라 상기 핫 플레이트의 각 영역을 개별 제어하는 제어부를 포함하여 이루어진 반도체 제조장치의 베이크(Bake) 장치.In the baking apparatus of the semiconductor manufacturing apparatus, a hot plate made of a combination of a plurality of regions each having temperature control and on which a baking object is placed, and covering the baking object placed on the hot plate, A cover part having a vent hole, a plurality of sensors formed on an inner surface of the cover part to correspond to an area of the hot plate, and detecting a temperature of a portion of a baking object on each area of a hot plate, and the hot signal according to a signal of the sensors Bake apparatus of a semiconductor manufacturing apparatus comprising a control unit for individually controlling each region of the plate. 제1항에 있어서, 상기 제어부의 제어 동작은 비례-적분-미분동작(Promotional integral and derivative action) 제어인 것이 특징인 반도체 제조장치의 베이크(Bake) 장치.The bake apparatus of claim 1, wherein the control operation of the controller is a proportional integral and derivative action control. 제1항에 있어서, 상기 핫 플레이트는 3개 이상의 영역으로 조합된 것이 특징인 반도체 제조장치의 베이크(Bake) 장치.The bake device of claim 1, wherein the hot plate is combined into three or more regions. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950030187A 1995-09-15 1995-09-15 Baking apparatus for semiconductor fabricating equipment KR0184058B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950030187A KR0184058B1 (en) 1995-09-15 1995-09-15 Baking apparatus for semiconductor fabricating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950030187A KR0184058B1 (en) 1995-09-15 1995-09-15 Baking apparatus for semiconductor fabricating equipment

Publications (2)

Publication Number Publication Date
KR970017910A true KR970017910A (en) 1997-04-30
KR0184058B1 KR0184058B1 (en) 1999-04-15

Family

ID=19426916

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950030187A KR0184058B1 (en) 1995-09-15 1995-09-15 Baking apparatus for semiconductor fabricating equipment

Country Status (1)

Country Link
KR (1) KR0184058B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100840720B1 (en) * 2002-08-30 2008-06-23 삼성전자주식회사 Bake apparatus

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100336043B1 (en) * 1999-10-28 2002-05-08 김광교 Method of multi processing to bake plates in a spinner machine
KR20030010824A (en) * 2001-07-27 2003-02-06 삼성전자주식회사 Bake equipment having a temperature compensation system
KR100436548B1 (en) * 2001-10-24 2004-06-16 한국디엔에스 주식회사 Semiconductor fabrication method using bake apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100840720B1 (en) * 2002-08-30 2008-06-23 삼성전자주식회사 Bake apparatus

Also Published As

Publication number Publication date
KR0184058B1 (en) 1999-04-15

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