KR970011220U - 몰딩 다이 크리닝 장치 - Google Patents

몰딩 다이 크리닝 장치

Info

Publication number
KR970011220U
KR970011220U KR2019950021656U KR19950021656U KR970011220U KR 970011220 U KR970011220 U KR 970011220U KR 2019950021656 U KR2019950021656 U KR 2019950021656U KR 19950021656 U KR19950021656 U KR 19950021656U KR 970011220 U KR970011220 U KR 970011220U
Authority
KR
South Korea
Prior art keywords
cleaning device
molding die
die cleaning
molding
die
Prior art date
Application number
KR2019950021656U
Other languages
English (en)
Other versions
KR200141830Y1 (ko
Inventor
이재승
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019950021656U priority Critical patent/KR200141830Y1/ko
Publication of KR970011220U publication Critical patent/KR970011220U/ko
Application granted granted Critical
Publication of KR200141830Y1 publication Critical patent/KR200141830Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
KR2019950021656U 1995-08-22 1995-08-22 몰딩 다이 크리닝 장치 KR200141830Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950021656U KR200141830Y1 (ko) 1995-08-22 1995-08-22 몰딩 다이 크리닝 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950021656U KR200141830Y1 (ko) 1995-08-22 1995-08-22 몰딩 다이 크리닝 장치

Publications (2)

Publication Number Publication Date
KR970011220U true KR970011220U (ko) 1997-03-29
KR200141830Y1 KR200141830Y1 (ko) 1999-06-01

Family

ID=19421267

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950021656U KR200141830Y1 (ko) 1995-08-22 1995-08-22 몰딩 다이 크리닝 장치

Country Status (1)

Country Link
KR (1) KR200141830Y1 (ko)

Also Published As

Publication number Publication date
KR200141830Y1 (ko) 1999-06-01

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