KR970007684U - 피시비 지지구조 - Google Patents

피시비 지지구조

Info

Publication number
KR970007684U
KR970007684U KR2019950019068U KR19950019068U KR970007684U KR 970007684 U KR970007684 U KR 970007684U KR 2019950019068 U KR2019950019068 U KR 2019950019068U KR 19950019068 U KR19950019068 U KR 19950019068U KR 970007684 U KR970007684 U KR 970007684U
Authority
KR
South Korea
Prior art keywords
support structure
pcb support
pcb
support
Prior art date
Application number
KR2019950019068U
Other languages
English (en)
Other versions
KR0123933Y1 (ko
Inventor
이상천
Original Assignee
대우전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 대우전자주식회사 filed Critical 대우전자주식회사
Priority to KR2019950019068U priority Critical patent/KR0123933Y1/ko
Publication of KR970007684U publication Critical patent/KR970007684U/ko
Application granted granted Critical
Publication of KR0123933Y1 publication Critical patent/KR0123933Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
KR2019950019068U 1995-07-28 1995-07-28 피시비 지지구조 KR0123933Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950019068U KR0123933Y1 (ko) 1995-07-28 1995-07-28 피시비 지지구조

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950019068U KR0123933Y1 (ko) 1995-07-28 1995-07-28 피시비 지지구조

Publications (2)

Publication Number Publication Date
KR970007684U true KR970007684U (ko) 1997-02-21
KR0123933Y1 KR0123933Y1 (ko) 1998-12-15

Family

ID=19419458

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950019068U KR0123933Y1 (ko) 1995-07-28 1995-07-28 피시비 지지구조

Country Status (1)

Country Link
KR (1) KR0123933Y1 (ko)

Also Published As

Publication number Publication date
KR0123933Y1 (ko) 1998-12-15

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
LAPS Lapse due to unpaid annual fee