KR970002358A - Sockets for QFP Package Inspection - Google Patents

Sockets for QFP Package Inspection Download PDF

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Publication number
KR970002358A
KR970002358A KR1019950017068A KR19950017068A KR970002358A KR 970002358 A KR970002358 A KR 970002358A KR 1019950017068 A KR1019950017068 A KR 1019950017068A KR 19950017068 A KR19950017068 A KR 19950017068A KR 970002358 A KR970002358 A KR 970002358A
Authority
KR
South Korea
Prior art keywords
contact
pin
socket
contact pin
package inspection
Prior art date
Application number
KR1019950017068A
Other languages
Korean (ko)
Other versions
KR0179829B1 (en
Inventor
이정식
Original Assignee
문정환
Lg 반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, Lg 반도체 주식회사 filed Critical 문정환
Priority to KR1019950017068A priority Critical patent/KR0179829B1/en
Publication of KR970002358A publication Critical patent/KR970002358A/en
Application granted granted Critical
Publication of KR0179829B1 publication Critical patent/KR0179829B1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

본 발명은 큐에프피(QFP) 패키지 검사용 소켓에 관한 것으로, 종래의 큐에프티 패키지 검사용 소캣은 컨택트 핀을 검사용 로드 보드의 핀 홀더에 삽입시 오삽입으로 핀이 이탈하여 컨택트 핀과 패키지 리드가 접촉이 불량하여 그로 인한 검사불량이 발생하는 문제점이 있었던 바, 본 발명은 소켓의 몸체를 이루는 베이스 하우징(10)과 상부 하우징(11)의 사면 모서리에 스프링(12)이 개재되어 있고, 상기 베이스 하우징(10)과 상부 하우징(11)사이의 장공에 컨택트 핀(15)이 각각 다수개 압입되어 있으며, 상기 베이스 하우징(10)의 하부로 컨택트 핀(15)이 돌출되어 있는 큐에프피 패키지 검사용 소켓에 있어서, 상기 컨택트 핀(15)과 대응되는 상부 하우징(11)에 누름판(11a)을 설치하고, 컨택트 핀(15)을 로드 본드(16)의 핀 홀더(16a)에 삽입시 컨택트 핀(15)의 상부를 누르도록 하여 컨택트 핀(15)이 오삽입시 이탈을 방지함으로써 패키지의 리드와 컨택트 핀의 접촉 불량에 의한 검사불량을 방지하는 효과가 있는 것이다.The present invention relates to a socket for QFP package inspection, and the conventional CAT package inspection socket has a contact pin and a package because the pin is separated by incorrect insertion when the contact pin is inserted into the pin holder of the inspection load board. The lead has a problem that the poor contact caused by the poor contact, the present invention has a spring 12 is interposed in the corners of the base housing 10 and the upper housing 11 forming the body of the socket, A plurality of contact pins 15 are press-fitted into the holes between the base housing 10 and the upper housing 11, and the contact pins 15 protrude downward from the base housing 10. In the socket for package inspection, the pressing plate 11a is installed in the upper housing 11 corresponding to the contact pin 15, and the contact pin 15 is inserted into the pin holder 16a of the rod bond 16. Press the upper part of the contact pin 15 By so to prevent separation when inserting the contact pins 15 will be erroneous that is effective to prevent the test failure due to contact failure of leads and the contact pins of the package.

Description

큐에프피(QFP) 패키지 검사용 소켓Sockets for QFP Package Inspection

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 일반적인 큐에프피(QFP) 패키지 검사용 소켓의 구조를 보인 사시도, 제2도는 일반적인 큐에프피(QFP) 패키지 검사용 소켓을 이용하여 패키지를 검사하는 상태를 보인 종단면도, 제3도는 본 발명에 의한 큐에프피(QFP) 패키지 검사용 소켓의 구조 및 검사용 로드 보드에 장착하는 상태를 보인 종단면도.1 is a perspective view showing the structure of a typical QFP package inspection socket, FIG. 2 is a longitudinal sectional view showing a state of inspecting a package using a general QFP package inspection socket, and FIG. Longitudinal sectional drawing which showed the structure of the QFP package inspection socket by this invention, and the state mounted to the inspection load board.

Claims (1)

소켓의 몸체를 이루는 베이스 하우징과 상부 하우징의 사면 모서리에 스프링이 개재되어 있고, 상기 베이스 하우징과 상부 하우징 사이의 장공에 컨택트 핀이 각각 다수개 압입되어 있으며, 상기 베이스 하우징의 하부로 컨택트 핀이 돌출되어 있는 큐에피프 패키지 검사용 소켓에 있어서, 상기 컨택트 핀과 대응되는 상부 하우징에 누름판을 설치하여 컨택트 핀이 로드 보드의 핀 홀더에 오삽입시 컨택트 핀의 이탈을 방지하도록 한 것을 특징으로 하는 큐에프피 패키지 검사용 소켓.A spring is interposed in the corners of the base housing and the upper housing forming the body of the socket, and a plurality of contact pins are press-fitted into the holes between the base housing and the upper housing, respectively, and the contact pin protrudes below the base housing. A cue pipe package inspection socket, wherein a pressing plate is installed in an upper housing corresponding to the contact pin so that the contact pin prevents detachment of the contact pin when the contact pin is incorrectly inserted into the pin holder of the load board. Socket for FT package inspection. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950017068A 1995-06-23 1995-06-23 Socket for qfp package test KR0179829B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950017068A KR0179829B1 (en) 1995-06-23 1995-06-23 Socket for qfp package test

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950017068A KR0179829B1 (en) 1995-06-23 1995-06-23 Socket for qfp package test

Publications (2)

Publication Number Publication Date
KR970002358A true KR970002358A (en) 1997-01-24
KR0179829B1 KR0179829B1 (en) 1999-04-01

Family

ID=19417995

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950017068A KR0179829B1 (en) 1995-06-23 1995-06-23 Socket for qfp package test

Country Status (1)

Country Link
KR (1) KR0179829B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6858919B2 (en) 2000-03-25 2005-02-22 Amkor Technology, Inc. Semiconductor package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6858919B2 (en) 2000-03-25 2005-02-22 Amkor Technology, Inc. Semiconductor package

Also Published As

Publication number Publication date
KR0179829B1 (en) 1999-04-01

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