KR960702785A - 다수의 패키지상에 리드를 자동으로 설치하기 위한 방법 및 장치(method and apparatus for automatically placing lids on component packages) - Google Patents

다수의 패키지상에 리드를 자동으로 설치하기 위한 방법 및 장치(method and apparatus for automatically placing lids on component packages)

Info

Publication number
KR960702785A
KR960702785A KR1019950705124A KR19950705124A KR960702785A KR 960702785 A KR960702785 A KR 960702785A KR 1019950705124 A KR1019950705124 A KR 1019950705124A KR 19950705124 A KR19950705124 A KR 19950705124A KR 960702785 A KR960702785 A KR 960702785A
Authority
KR
South Korea
Prior art keywords
automatically placing
component packages
placing lids
lids
packages
Prior art date
Application number
KR1019950705124A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR960702785A publication Critical patent/KR960702785A/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P11/00—Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • B23P19/04—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for assembling or disassembling parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B7/00—Closing containers or receptacles after filling
    • B65B7/16—Closing semi-rigid or rigid containers or receptacles not deformed by, or not taking-up shape of, contents, e.g. boxes or cartons
    • B65B7/28—Closing semi-rigid or rigid containers or receptacles not deformed by, or not taking-up shape of, contents, e.g. boxes or cartons by applying separate preformed closures, e.g. lids, covers
    • B65B7/2842—Securing closures on containers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49769—Using optical instrument [excludes mere human eyeballing]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
    • Y10T29/49829—Advancing work to successive stations [i.e., assembly line]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53365—Multiple station assembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/5337—Means to interrelatedly feed plural work parts from plural sources without manual intervention including assembly pallet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53383—Means to interrelatedly feed plural work parts from plural sources without manual intervention and means to fasten work parts together
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53478—Means to assemble or disassemble with magazine supply
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53539—Means to assemble or disassemble including work conveyor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Specific Conveyance Elements (AREA)
KR1019950705124A 1993-05-13 1995-11-13 다수의 패키지상에 리드를 자동으로 설치하기 위한 방법 및 장치(method and apparatus for automatically placing lids on component packages) KR960702785A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/065,294 US5507085A (en) 1993-05-13 1993-05-13 Method and apparatus for automatically placing lids on component packages
PCT/US1994/005391 WO1994026461A1 (en) 1993-05-13 1994-05-13 Method and apparatus for automatically placing lids on component packages

Publications (1)

Publication Number Publication Date
KR960702785A true KR960702785A (ko) 1996-05-23

Family

ID=22061701

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950705124A KR960702785A (ko) 1993-05-13 1995-11-13 다수의 패키지상에 리드를 자동으로 설치하기 위한 방법 및 장치(method and apparatus for automatically placing lids on component packages)

Country Status (4)

Country Link
US (1) US5507085A (ko)
JP (1) JPH09503164A (ko)
KR (1) KR960702785A (ko)
WO (1) WO1994026461A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100312635B1 (ko) * 1999-09-28 2001-11-03 곽영진 입체 가공장치

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3103482B2 (ja) * 1994-09-12 2000-10-30 株式会社日立製作所 自動組立システム
US6048123A (en) * 1996-09-23 2000-04-11 The Procter & Gamble Company Cleaning implement having high absorbent capacity
US6171780B1 (en) 1997-06-02 2001-01-09 Aurora Biosciences Corporation Low fluorescence assay platforms and related methods for drug discovery
US6517781B1 (en) * 1997-06-02 2003-02-11 Aurora Biosciences Corporation Low fluorescence assay platforms and related methods for drug discovery
US6825042B1 (en) * 1998-02-24 2004-11-30 Vertex Pharmaceuticals (San Diego) Llc Microplate lid
US6912775B1 (en) * 1998-02-25 2005-07-05 Seagate Technology Llc Assembly device for assembling components
US5953804A (en) * 1998-07-10 1999-09-21 Systems Engineering Company Automated workpiece insertion method and apparatus
DE19836077C2 (de) * 1998-07-30 2000-05-31 Brose Fahrzeugteile Vorrichtung zum Verbinden einer Fensterscheibe mit einem Fensterheber
CN100446650C (zh) * 2001-12-18 2008-12-24 爱立信股份有限公司 装配电子电路的设备和方法
WO2007129391A1 (ja) * 2006-05-01 2007-11-15 Ibiden Co., Ltd. 焼成用治具組立装置、焼成用治具分解装置、循環装置、セラミック成形体の焼成方法、及び、ハニカム構造体の製造方法
CN102528449B (zh) 2012-01-17 2014-07-16 广州洁特生物过滤制品有限公司 一次性细胞培养瓶透气盖装配机
US20210371148A1 (en) * 2012-05-03 2021-12-02 Vanrx Pharmasystems Inc. Cover removal system for use in controlled environment enclosures
US12065347B2 (en) * 2012-05-03 2024-08-20 Vanrx Pharmasystems Inc. Cover removal system for use in controlled environment enclosures
US9444004B1 (en) * 2014-05-02 2016-09-13 Deployable Space Systems, Inc. System and method for producing modular photovoltaic panel assemblies for space solar arrays
DE102015009004A1 (de) 2015-06-05 2016-12-08 Solaero Technologies Corp. Automatisierte Anordnung und Befestigung von Solarzellen auf Paneelen für Weltraumanwendungen
US10276742B2 (en) 2015-07-09 2019-04-30 Solaero Technologies Corp. Assembly and mounting of solar cells on space vehicles or satellites
US10665489B2 (en) * 2016-06-24 2020-05-26 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated chip die carrier exchanger
CN109650031B (zh) * 2017-10-10 2021-06-25 泰科电子(上海)有限公司 组装设备和组装方法
CN107803647B (zh) * 2017-11-23 2024-03-15 东莞市铁生辉制罐有限公司 一种盖子自动组装机
CN109434451B (zh) * 2018-12-24 2024-08-09 惠州市德赛自动化技术有限公司 雷达导航组装设备
GB2582184B (en) * 2019-03-15 2022-03-02 Proseal Uk Ltd A packaging machine and method
US11981473B2 (en) * 2020-09-27 2024-05-14 V Anrx Pharmasystems Inc. Cover removal system for use in controlled environment enclosures
CN114012390B (zh) * 2021-12-01 2023-10-27 江苏朗迅工业智能装备有限公司 cover组装设备
CN114434120B (zh) * 2021-12-24 2024-07-12 浙江柯建科技有限公司 一种气雾剂罐压盖一体自动化安装装置及其使用方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH047863Y2 (ko) * 1986-07-18 1992-02-28
US4896418A (en) * 1987-08-07 1990-01-30 Texas Instrument Incorporated Direct mounting method for semiconductors
JPH01188240A (ja) * 1988-01-25 1989-07-27 Uematsu Shokai:Kk ユニット式部品組付け装置
JPH0615137B2 (ja) * 1988-05-20 1994-03-02 株式会社三協精機製作所 トランスファー装置
JPH02256430A (ja) * 1989-03-29 1990-10-17 Mitsubishi Electric Corp 自動組立装置および方法
AT398923B (de) * 1989-04-04 1995-02-27 Sticht Walter Fertigungsanlage mit parallel- und nebenförderwegen
JPH02292138A (ja) * 1989-04-28 1990-12-03 Canon Inc 自動組立装置
JPH03112200A (ja) * 1989-09-27 1991-05-13 Hitachi Ltd 電子部品塔載装置
JP3042190B2 (ja) * 1992-07-22 2000-05-15 松下電器産業株式会社 電子部品吸着ノズルの位置ずれ検出装置及び検出方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100312635B1 (ko) * 1999-09-28 2001-11-03 곽영진 입체 가공장치

Also Published As

Publication number Publication date
JPH09503164A (ja) 1997-03-31
WO1994026461A1 (en) 1994-11-24
US5507085A (en) 1996-04-16

Similar Documents

Publication Publication Date Title
KR960702785A (ko) 다수의 패키지상에 리드를 자동으로 설치하기 위한 방법 및 장치(method and apparatus for automatically placing lids on component packages)
DE69425346D1 (de) Verfahren und Vorrichtung zum Umsetzen von Videoformaten
AU5953994A (en) Method and apparatus for arbitrating on an acyclic directed graph
IL111377A0 (en) Method and apparatus for multi-phase component downconversion
IL109030A0 (en) Apparatus and method for thick wafer measurement
GB2278331B (en) Transfer apparatus and method for testing facility
AU2293095A (en) Method and apparatus for automatically positioning electronic die within component packages
EP0435271A3 (en) An apparatus and a method for checking a semiconductor
EP0649031A3 (en) Device and method for testing semiconductor components.
GB9305554D0 (en) Method and apparatus for processing decuments
FI101954B1 (fi) Menetelmä ja laitteisto litteiden esineiden pakkaamiseksi
AU1298695A (en) Apparatus and method for testing integrated circuits
GB2250154B (en) Apparatus and method for locating an object
EP0426931A3 (en) Film bonding method and apparatus for performing same
DE59401548D1 (de) Verfahren und einrichtung zum umsetzen von containern
NO982073L (no) FremgangsmÕte og anordning for hÕndtering av beholdere
FI102595B1 (fi) Laite ja menetelmä palautuspakkausten käsittelyssä
EP0667528A4 (en) METHOD AND DEVICE FOR OPTICAL IMMUNOASSAYS.
DE59404481D1 (de) Verfahren und vorrichtung zum kontaktieren von wickelgütern an anschlusselementen
DK71492A (da) Fremgangsmaade og apparat til fremstilling af skinpakning samt en saadan skinpakning
EP0441319A3 (en) Method and apparatus for verifying microcircuit fabrication procedure
GB2273089B (en) An apparatus and method for handling bottles
AU5388894A (en) Apparatus and method for detecting perforations
ZA9610236B (en) Method for placing lids onto containers and apparatus therefore.
HK37497A (en) Method and apparatus for retaping electronic parts

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid