KR960042212A - Sensitive radiation-sensitive resin composition - Google Patents

Sensitive radiation-sensitive resin composition Download PDF

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Publication number
KR960042212A
KR960042212A KR1019960014975A KR19960014975A KR960042212A KR 960042212 A KR960042212 A KR 960042212A KR 1019960014975 A KR1019960014975 A KR 1019960014975A KR 19960014975 A KR19960014975 A KR 19960014975A KR 960042212 A KR960042212 A KR 960042212A
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KR
South Korea
Prior art keywords
weight
radiation
resin composition
sensitive resin
component
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KR1019960014975A
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Korean (ko)
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KR100497445B1 (en
Inventor
끼미야스 사노
히데끼 찌바
가쯔도시 이가라시
도시유끼 오오다
요시유끼 미찌노
호즈미 사또
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마쯔모또 에이찌
니혼 고오세이 고무 가부시끼가이샤
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Publication of KR960042212A publication Critical patent/KR960042212A/en
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Publication of KR100497445B1 publication Critical patent/KR100497445B1/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Safety Devices In Control Systems (AREA)
  • Control By Computers (AREA)

Abstract

(A) (a) 카르복실기를 갖는 라디칼 중합성 화합물로 이루어진 구성 성분 10 내지 50 중량%, (b) 환상 알킬기를 갖고 카르복실기를 갖지 않은 라디칼 중합성 화합물로 이루어진 구성 성분 20 내지 60 중량%, 및 (c) 다른 라디칼 중합성 화합물로 이루어진 구성 성분 5 내지 40 중량%로 이루어진 알칼리 가용성 공중합체, (B) 적어도 1개의 에틸렌성 불포화 2중 결합을 갖는 화합물, 및 (C) 방사선 라디칼 중합 개시제를 함유하는 것을 특징으로 하는 감방사선성 수지 조성물.(A) 10 to 50% by weight of a component (a) composed of a radically polymerizable compound having a carboxyl group, (b) 20 to 60% by weight of a component comprising a radically polymerizable compound having a cyclic alkyl group and no carboxyl group, c) an alkali-soluble copolymer consisting of 5 to 40% by weight of constituents consisting of other radical polymerizable compounds, (B) a compound having at least one ethylenically unsaturated double bond, and (C) a radiation- By weight of the radiation-sensitive resin composition.

본 발명의 감방사선성 수지 조성물은 알칼리 현상액에 대한 현상성이 20㎛ 이상의 막 두께로서 충분한 해상도를 갖고, 더욱이 내도금성이 우수하고, 또한 현상시의 기판과의 밀착성과 도금에 대한 양호한 젖음성을 나타내며, 도금에 의해 양호한 뱀프를 형성할 수가 있고, 동시에 기판으로부터의 경화제의 박리성이 우수하다.The radiation-sensitive resin composition of the present invention has a sufficient resolution with a film thickness of 20 占 퐉 or more for an alkaline developer and exhibits excellent resistance to electrolytic plating and exhibits good adhesion to a substrate during development and good wettability to plating , A good bump can be formed by plating, and at the same time, the releasability of the curing agent from the substrate is excellent.

Description

감방사선성 수지 조성물Sensitive radiation-sensitive resin composition

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

Claims (4)

(A) (a) 카르복실기를 갖는 라디칼 중합성 화합물로 이루어진 구성 성분 10 내지 50중량%, (b) 환상알킬기를 갖고 카르복실기를 갖지 않는 라디칼 중합성 화합물로 이루어진 구성 성분 20 내지 60중량%, 및 (c) 다른 라디칼 중합성 화합물로 이루어진 구성 성분 5내지 40중량%로 이루어진 알칼리 가용성 공중합체, (B) 적어도 1개의 에틸렌성 불포화 2중 결합을 갖는 화합물, 및 (C) 방사선 라디칼 중합 개시제를 함유하는 것을 특징으로 하는 감방사선성 수지 조성물.(A) 10 to 50% by weight of a component (a) comprising a radically polymerizable compound having a carboxyl group, (b) 20 to 60% by weight of a component comprising a radically polymerizable compound having a cyclic alkyl group and no carboxyl group, c) an alkali-soluble copolymer consisting of 5 to 40% by weight of constituents consisting of other radical polymerizable compounds, (B) a compound having at least one ethylenically unsaturated double bond, and (C) a radiation- By weight of the radiation-sensitive resin composition. 제1항에 있어서, (A) 알칼리 가용성 공중합체를 구성하는 성분 (c) 이외의 라디칼 중합성 화합물이 하기식(가)로 표시되는 화합물을 함유하는 것을 특징으로 하는 감방사선성 수지 조성물.The radiation sensitive resin composition according to claim 1, wherein the radically polymerizable compound other than the component (c) constituting the alkali-soluble copolymer (A) contains a compound represented by the following formula (A). 상기식에서, R1은 수소 또는 메틸기이고, R2는 수소 또는 C1-C4알킬기이며, n은 2≤n≤25를 만족시키는 수이다.Wherein R 1 is hydrogen or a methyl group, R 2 is hydrogen or a C 1 -C 4 alkyl group, and n is a number satisfying 2? N? 25. 제1항에 있어서, 알칼리 수용성 공중합체를 구성하는 성분 (c) 이외의 라디칼 중합성 화합물이 하기 식 (나)로 표시되는 화합물을 함유하는 것을 특징으로 하는 감방사선성 수지 조성물.The radiation sensitive resin composition according to claim 1, wherein the radically polymerizable compound other than the component (c) constituting the alkali water-soluble copolymer contains a compound represented by the following formula (b). 상기식에서, R1은 수소 또는 메틸기이고, R2는 수소 또는 C1-C4알킬기이며, n은 2≤n≤25를 만족시키는 수이다.Wherein R 1 is hydrogen or a methyl group, R 2 is hydrogen or a C 1 -C 4 alkyl group, and n is a number satisfying 2? N? 25. 제1항에 기재된 감방사선성 수지 조성물로 이루어진 뱀프(vamp) 형성용 재료.A material for forming a vamp comprising the radiation sensitive resin composition according to claim 1. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960014975A 1995-05-10 1996-05-08 Radiation-sensitive resin composition KR100497445B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP95-136064 1995-05-10
JP7136064A JPH08306433A (en) 1995-05-10 1995-05-10 Connector device
JP95-136034 1995-05-10

Publications (2)

Publication Number Publication Date
KR960042212A true KR960042212A (en) 1996-12-21
KR100497445B1 KR100497445B1 (en) 2005-10-12

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KR1019960014975A KR100497445B1 (en) 1995-05-10 1996-05-08 Radiation-sensitive resin composition

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JP (1) JPH08306433A (en)
KR (1) KR100497445B1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7002315B2 (en) 2002-05-28 2006-02-21 Toshiba Kikai Kabushiki Kaisha Servo control device
JP5544919B2 (en) * 2010-02-18 2014-07-09 株式会社デンソーウェーブ robot
JP5561532B2 (en) * 2010-04-14 2014-07-30 横河電機株式会社 Redundant unit
CN104186029B (en) * 2012-03-27 2016-10-12 日本电气株式会社 Floor board and the method being used for floor board is connected up

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JPH08306433A (en) 1996-11-22
KR100497445B1 (en) 2005-10-12

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