KR960041114A - Non-slip and waterproof resin packaging material and packaging method - Google Patents

Non-slip and waterproof resin packaging material and packaging method Download PDF

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Publication number
KR960041114A
KR960041114A KR1019950013587A KR19950013587A KR960041114A KR 960041114 A KR960041114 A KR 960041114A KR 1019950013587 A KR1019950013587 A KR 1019950013587A KR 19950013587 A KR19950013587 A KR 19950013587A KR 960041114 A KR960041114 A KR 960041114A
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South Korea
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resin
aggregate
resin binder
elongation
packaging material
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KR1019950013587A
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Korean (ko)
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KR0136641B1 (en
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김현돈
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황선두
삼성종합화학 주식회사
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
    • C04B26/02—Macromolecular compounds
    • C04B26/10—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C04B26/18—Polyesters; Polycarbonates
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
    • E04F15/102—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials of fibrous or chipped materials, e.g. bonded with synthetic resins
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/20—Resistance against chemical, physical or biological attack
    • C04B2111/27—Water resistance, i.e. waterproof or water-repellent materials

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Architecture (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Civil Engineering (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Road Paving Structures (AREA)

Abstract

본 발명의 논슬립 및 방수성을 갖는 수지 포장재는 콘크리트, 아스팔트 등의 바닥면 위에 시공하는 포장재로서, 이들의 바닥면 바로 위에 0.3㎏/㎡의 양으로 도포되는 프라이마(primer)수지, 상기 프라이마 수지 위에 2∼3㎏/㎡의 양의 수지 바인더와 6∼8㎏/㎡의 양의 골재와의 혼합층으로 이루어진다. 본 발명에서 사용되는 수지 바인더로는 에폭시 수지, 불포화폴리에스테르 수지 또는 우레탄 수지가 있으며, 골재로는 그 크기가 1.5∼5㎜ 정도인 입상골재와 0.074∼1.5㎜정도인 분말골재가 있다.Non-slip and waterproof resin packaging material of the present invention is a packaging material to be installed on the floor surface of concrete, asphalt, etc., the primer resin (primer resin), which is applied in an amount of 0.3 kg / ㎡ directly on the bottom surface, the prima resin It consists of the mixed layer of the resin binder of the quantity of 2-3 kg / m <2> and the aggregate of 6-8 kg / m <2> above. The resin binder used in the present invention may be an epoxy resin, an unsaturated polyester resin or a urethane resin, and aggregates include granular aggregates having a size of about 1.5 to 5 mm and powder aggregates having a size of about 0.074 to 1.5 mm.

수지 바인더는 신율이 5%이하인 일반적인 열경화성 합성수지 바인더(이하 '저신율 수지 바인더'라 함)와 신율이 50∼200%의 범위인 열경화성 합성수지 바인더(이하 '고신율 수지 바인더'라 함)로 구분된다. 본 발명에서는 골재와 혼합되는 수지 바인더가 저신율 수지 바인더 또는 고신율 수지 바인더만으로 이루어지는 경우가 있으며, 혼합층의 하부층에는 고신율 수지 바인더와 골재로 이루어지고 혼합층의 상부층에는 저신율 수지 바인더와 골재로 이루어지는 2중 구조 형태를 갖는 경우가 있다. 어느 경우든지 사용되는 수지 바인더의 양 및 골재의 양은 동일하다. 다시 말해서 저신율 또는 고신율 수지 바인더에 상관없이, 1㎡당 약2∼3㎏의 수지 바인더가 사용되어야 하며, 1㎡당 약 6∼8㎏의 골재가 사용되어야 한다.The resin binder is divided into a general thermosetting resin binder (hereinafter referred to as 'low elongation resin binder') with elongation of 5% or less and a thermosetting synthetic resin binder (hereinafter referred to as 'high elongation resin binder') with elongation in the range of 50 to 200%. . In the present invention, the resin binder mixed with the aggregate may be composed of only a low elongation resin binder or a high elongation resin binder, and the lower layer of the mixed layer consists of a high elongation resin binder and an aggregate, and the upper layer of the mixed layer consists of a low elongation resin binder and an aggregate. It may have a double structure form. In either case, the amount of resin binder and the amount of aggregate used are the same. In other words, regardless of the low or high elongation resin binder, about 2 to 3 kg of resin binder per m 2 should be used and about 6 to 8 kg of aggregate per 1 m 2 should be used.

Description

논슬립(non-slip) 및 방수성을 갖는 수지포장재 및 그 포장시공방법Non-slip and waterproof resin packaging material and packaging method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (14)

바닥면 1㎡당 약 0.3∼0.5㎏의 프라이마 수지가 도포된 프라이마 수지층과 상기 프라이마 수지층 위에 25℃에서의 점도가 2∼10CP인 수지 바인더 2∼3㎏/㎡과 골재 6∼8㎏/㎡이 혼합된 골재층으로 구성되는 것을 특징으로 하는 논슬립 및 방수성을 갖는 수지 포장재.2 to 3 kg / m 2 of resin binder having a viscosity of 2 to 10 CP at 25 ° C. on the prima resin layer coated with about 0.3 to 0.5 kg of prima resin per 1 m 2 of the bottom surface and the aggregate 6 to A resin packaging material having non-slip and water resistance, characterized by comprising an aggregate layer mixed with 8 kg / m 2. 제1항에 있어서, 상기 수지 바인더가 신율이 5%이하인 저신율 수지 바인더인 것을 특징으로 하는 논슬립 및 방수성을 갖는 수지 포장재.The resin packaging material having non-slip and water resistance according to claim 1, wherein the resin binder is a low elongation resin binder having an elongation of 5% or less. 제1항에 있어서, 상기 수지 바인더가 신율이 50∼200%인 고신율 수지 바인더인 것을 특징으로 하는 논슬립 및 방수성을 갖는 수지 포장재.The resin packaging material having non-slip and water resistance according to claim 1, wherein the resin binder is a high elongation resin binder having an elongation of 50 to 200%. 제2항 또는 제3항 있어서, 상기 수지 바인더가 에폭시 수지, 불포화폴리에스테르 수지, 및 우레탄 수지로 이루어진 군으로부터 선택되는 것을 특징으로 하는 논슬립 및 방수성을 갖는 수지 포장재.The resin packaging material having non-slip and water resistance according to claim 2 or 3, wherein the resin binder is selected from the group consisting of an epoxy resin, an unsaturated polyester resin, and a urethane resin. 제1항에 있어서, 상기 골재가 1.5∼5㎜의 입도를 갖는 입상골재인 것을 특징으로 하는 논슬립 및 방수성을 갖는 수지 포장재.The resin packaging material according to claim 1, wherein the aggregate is a granular aggregate having a particle size of 1.5 to 5 mm. 제1항에 있어서, 상기 골재가 0.074∼1.5㎜의 입도를 갖는 분말골재인 것을 특징으로 하는 논슬립 및 방수성을 갖는 수지 포장재.The resin packaging material according to claim 1, wherein the aggregate is a powder aggregate having a particle size of 0.074 to 1.5 mm. 제1항에 있어서, 상기 수지 바인더가 도포되기 전에, 상기 골재가 0.24∼0.48㎏/㎡의 수지 바인더와 포함되는 것을 특징으로 하는 논슬립 및 방수성을 갖는 수지 포장재.The resin packaging material having non-slip and water resistance according to claim 1, wherein the aggregate is contained with a resin binder of 0.24 to 0.48 kg / m 2 before the resin binder is applied. 제1항에 있어서, 상기 프라이마 수지와 수지 바인더는 수지 100중량부당 1중량부에 해당하는 경화제를 더 포함하는 것을 특징으로 하는 논슬립 및 방수성을 갖는 수지 포장재.The resin packaging material of claim 1, wherein the prima resin and the resin binder further include a curing agent corresponding to 1 part by weight per 100 parts by weight of the resin. 바닥면 1㎡당 약 0.3∼0.5㎏의 프라이마 수지가 도포된 프라이마 수지층; 상기 프라이마 수지층위에 25℃에서의 점도가 2∼10CP이고 신율이 50∼100%인 고신율 수지 바인더 1∼1.5㎏/㎡과 골재 3∼4㎏/㎡이 혼합하여 형성된 골재 하부층; 및 상기 골재 하부층 위에 250℃에서의 점도가 2∼10CP이고 신율이 5%이하인 저신율 수지 바인더 1∼1.5㎏/㎡과 골재 3∼4㎏/㎡이 혼합하여 형성된 골재 상부층으로 구성되는 것을 특징으로 하는 논슬립 및 방수성을 갖는 수지 포장재.A prima resin layer coated with about 0.3 to 0.5 kg of prima resin per 1 m 2 of bottom surface; An aggregate lower layer formed by mixing 1 to 1.5 kg / m 2 of a high elongation resin binder having an elongation of 50 to 100% and an aggregate of 3 to 4 kg / m 2 at 25 ° C. on the prima resin layer; And an aggregate upper layer formed by mixing 1 to 1.5 kg / m 2 of low elongation resin binder having an elongation of 5% or less and aggregate 3 to 4 kg / m 2 at 250 ° C. on the lower layer of aggregate. Resin packaging material having non-slip and waterproof. 제9항에 있어서, 상기 골재가 0.074∼1.5㎜의 입도를 갖는 분말골재인 것을 특징으로 하는 논슬립 및 방수성을 갖는 수지 포장재.10. The resin packaging material according to claim 9, wherein the aggregate is a powder aggregate having a particle size of 0.074 to 1.5 mm. 바닥면 1㎡당 약 0.3∼0.5㎏의 프라이마 수지를 도포하여 경화하는 단계; 바닥면 1㎡당 약 0.24∼0.48㎏의 수지 바인더와 입도가 1.5∼5㎜인 6∼8㎏의 골재가 혼합된 골재혼합물을 약 5㎜의 두께로 상기 프라이마 수지면에 포설하여 경화하는 단계; 및 상기 골재가 포설된 골재면 1㎡당 점도가 2∼10CP이고 신율이 5% 이하인 2∼3㎏의 수지 바인더로 도포하여 경화하는 단계로 구성되는 것을 특징으로 하는 수지 포장재의 시공방법.Applying and curing about 0.3 to 0.5 kg of a prima resin per square meter of the bottom surface; Laying and curing an aggregate mixture of about 0.24 to 0.48 kg of resin binder per square meter of floor surface and 6 to 8 kg of aggregate having a particle size of 1.5 to 5 mm on the surface of the prima resin to a thickness of about 5 mm; And a step of applying and curing with a resin binder having a viscosity of 2 to 10 CP and an elongation of 5% or less per 2 m 2 of the aggregated surface on which the aggregate is placed, and curing the resin packaging material. 제11항에 있어서, 상기 수지 바인더가 신율이 50∼200%인 고신율 수지 바인더인 것을 특징으로 하는 수지 포장재의 시공방법.The method for constructing a resin packaging material according to claim 11, wherein the resin binder is a high elongation resin binder having an elongation of 50 to 200%. 바닥면 1㎡당 약 0.3㎏의 프라이마 수지를 도포하여 경화하는 단계; 바닥면 1㎡당 약 0.12∼0.24㎏의 고신율 수지 바인더와 3∼4㎏의 골재가 혼합된 골재혼합물을 약5㎜의 두께로 상기 프라이마 수지면에 포설하여 골재층을 형성하는 단계; 상기 골재층 1㎡당 점도가 2∼10CP이고 신율이 50∼200%인 1∼1.5㎏의 고신율 수지 바인더로 도포하며 경화하는 단계; 상기 골재층 1㎡당 점도가 2∼10CP이고 신율이 5%이하인 1∼1.5㎏의 저신율 수지 바인더로 도포하며 경화하는 단계로 구성되는 것을 특징으로 하는 수지 포장재의 시공방법.Applying and curing about 0.3 kg of prima resin per square meter of bottom surface; Placing an aggregate mixture of about 0.12 to 0.24 kg of high elongation resin binder and 3 to 4 kg of aggregate per 1 m 2 of the bottom surface on the surface of the prima resin to form an aggregate layer; Applying and curing with a 1 to 1.5 kg high elongation resin binder having a viscosity of 2 to 10 CP and an elongation of 50 to 200% per m 2 of the aggregate layer; A method of constructing a resin packaging material, comprising the step of applying and curing with a low elongation resin binder having a viscosity of 2 to 10CP and an elongation of 5% or less per 1 m 2 of the aggregate layer. 제13항에 있어서, 상기 골재가 0.074∼1.5㎜의 입도를 갖는 분말골재인 것을 특징으로 하는 수지 포장재의 시공방법.The method for constructing a resin packaging material according to claim 13, wherein the aggregate is a powder aggregate having a particle size of 0.074 to 1.5 mm. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950013587A 1995-05-29 1995-05-29 Packing material and its method having non-slip and waterproof properties KR0136641B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020083534A (en) * 2001-04-24 2002-11-04 연창익 Nomslip tile

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100398275B1 (en) * 1996-03-20 2003-12-24 삼성종합화학주식회사 Resin mortar composition
WO2017039718A1 (en) 2015-09-03 2017-03-09 3M Innovative Properties Company Magnifying device
KR101979609B1 (en) * 2019-01-10 2019-05-17 로고스(주) Urethane synthetic resin and waterproof method for bride using the same
KR102230331B1 (en) * 2019-04-03 2021-03-23 주식회사 태건특장 Folding-type truck ramp with anti-slip surface treatment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020083534A (en) * 2001-04-24 2002-11-04 연창익 Nomslip tile

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